Patents by Inventor Sung Hen Cho
Sung Hen Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9406630Abstract: A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.Type: GrantFiled: December 22, 2014Date of Patent: August 2, 2016Assignee: Samsung Display Co., Ltd.Inventors: Joo-Han Kim, Ki-Yong Song, Dong-Ju Yang, Hee-Joon Kim, Yeo-Geon Yoon, Sung-Hen Cho, Chang-Hoon Kim, Jae-Hong Kim, Yu-Gwang Jeong, Ki-Yeup Lee, Sang-Gab Kim, Yun-Jong Yeo, Shin-Il Choi, Ji-Young Park
-
Patent number: 9136047Abstract: Disclosed herein is a method of forming low-resistance metal pattern, which can be used to obtain a metal pattern having stable and excellent characteristics by performing sensitization treatment using a copper compound before an activation treatment for forming uniform and dense metal cores, a patterned metal structure, and display devices using the same.Type: GrantFiled: July 15, 2013Date of Patent: September 15, 2015Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Ki Yong Song, Sung Hen Cho, Sang Eun Park
-
Publication number: 20150108489Abstract: A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.Type: ApplicationFiled: December 22, 2014Publication date: April 23, 2015Inventors: Joo-Han KIM, Ki-Yong SONG, Dong-Ju YANG, Hee-Joon KIM, Yeo-Geon YOON, Sung-Hen CHO, Chang-Hoon KIM, Jae-Hong KIM, Yu-Gwang JEONG, Ki-Yeup LEE, Sang-Gab KIM, Yun-Jong YEO, Shin-Il CHOI, Ji-Young PARK
-
Patent number: 8946004Abstract: A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.Type: GrantFiled: August 19, 2009Date of Patent: February 3, 2015Assignee: Samsung Display Co., Ltd.Inventors: Joo-Han Kim, Ki-Yong Song, Dong-Ju Yang, Hee-Joon Kim, Yeo-Geon Yoon, Sung-Hen Cho, Chang-Hoon Kim, Jae-Hong Kim, Yu-Gwang Jeong, Ki-Yeup Lee, Sang-Gab Kim, Yun-Jong Yeo, Shin-Il Choi, Ji-Young Park
-
Publication number: 20130299450Abstract: Disclosed herein is a method of forming low-resistance metal pattern, which can be used to obtain a metal pattern having stable and excellent characteristics by performing sensitization treatment using a copper compound before an activation treatment for forming uniform and dense metal cores, a patterned metal structure, and display devices using the same.Type: ApplicationFiled: July 15, 2013Publication date: November 14, 2013Inventors: Ki Yong SONG, Sung Hen CHO, Sang Eun PARK
-
Patent number: 8198191Abstract: Disclosed herein is a method of preparing a low resistance metal line, in which a wet plating technique is used instead of a vacuum film forming process in order to simplify the process and decrease the manufacturing cost. In addition, a self-assembled monolayer is formed that facilitates the increased adsorption density and strength of the metal catalyst resulting in the formation of a high-density metal catalyst layer, thereby obtaining a high-quality metal line. Also disclosed herein, are a patterned metal line structure, and a display device using the same.Type: GrantFiled: July 26, 2010Date of Patent: June 12, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Sung Hen Cho, Ki Yong Song, Sang Eun Park
-
Publication number: 20110168669Abstract: Disclosed herein is a method of preparing a low resistance metal line, in which a wet plating technique is used instead of a vacuum film forming process in order to simplify the process and decrease the manufacturing cost. In addition, a self-assembled monolayer is formed that facilitates the increased adsorption density and strength of the metal catalyst resulting in the formation of a high-density metal catalyst layer, thereby obtaining a high-quality metal line. Also disclosed herein, are a patterned metal line structure, and a display device using the same.Type: ApplicationFiled: July 26, 2010Publication date: July 14, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hen CHO, Ki Yong SONG, Sang Eun PARK
-
Publication number: 20100294369Abstract: A counter electrode for a photovoltaic cell and a photovoltaic cell including the same include a transparent substrate and a catalyst layer formed on the transparent substrate using a supported catalyst The counter electrode of the present invention has an economical preparation cost and process, and also has an enlarged contact area with an electrolyte layer of the cell, leading to improved catalytic activity. Thus, in the case where the counter electrode is applied to the photovoltaic cell, excellent photoconversion efficiency is exhibited. In an exemplary embodiment, the photovoltaic cell is a dye-sensitized photovoltaic cell including such a counter electrode.Type: ApplicationFiled: June 7, 2010Publication date: November 25, 2010Applicant: SAMSUNG ELECTRONICS CO., LTDInventors: Jin Young Kim, Chan Ho Pak, Sang Hoon Joo, Sang Cheol Park, Sung Hen Cho, Ki Young Song, Chang Ho Noh
-
Publication number: 20100270552Abstract: A protrusion of dry-etched pattern of a thin film transistor substrate generated due to a difference between isotropy of wet etching and anisotropy of dry etching is removed by forming a plating part on a surface of the wet etched pattern through an electroless plating method. If the plating part is formed on a data pattern layer of the substrate, the width or the thickness of the data pattern layer may be increased without loss of aperture ratio, the channel length of the semiconductor layer may be reduced under the limit according to the stepper resolution and the protrusion part of the semiconductor layer may be removed. As a result, the aperture ratio may be increased, the resistance may be reduced, and the driving margin may be increased due to rising of the ion current. Furthermore, the so-called water-fall noise phenomenon may be eliminated.Type: ApplicationFiled: September 30, 2009Publication date: October 28, 2010Inventors: Ki-Yong Song, Sung-Haeng Cho, Jae-Hong Kim, Sung-Hen Cho, Yong-Mo Choi, Hyung-Jun Kim, Sung-Ryul Kim, Byeong-Hoon Cho, O-Sung Seo, Seong-Hun Kim
-
Publication number: 20100230679Abstract: A contact portion of wiring and a method of manufacturing the same are disclosed. A contact portion of wiring according to an embodiment includes: a substrate; a conductive layer disposed on the substrate; an interlayer insulating layer disposed on the conductive layer and having a contact hole; a metal layer disposed on the conductive layer and filling the contact hole; and a transparent electrode disposed on the interlayer insulating layer and connected to the metal layer, wherein the interlayer insulating layer includes a lower insulating layer and an upper insulating layer disposed on the lower insulating layer, the lower insulating layer is undercut at the contact hole, and the metal layer fills in the portion where the lower insulating layer is undercut.Type: ApplicationFiled: August 19, 2009Publication date: September 16, 2010Inventors: Joo-Han Kim, Ki-Yong Song, Dong-Ju Yang, Hee-Joon Kim, Yeo-Geon Yoon, Sung-Hen Cho, Chang-Hoon Kim, Jae-Hong Kim, Yu-Gwang Jeong, Ki-Yeup Lee, Snag-Gab Kim, Yun-Jong Yeo, Shin-Il Choi, Ji-Young Park
-
Patent number: 7750555Abstract: Disclosed herein is a transparent electrode featuring the interposition of a nano-metal layer between a grid electrode on a transparent substrate and an electroconductive polymer layer, and a preparation method thereof. The transparent electrode can be produced in a continuous process at high productivity and low cost and can be applied to various display devices.Type: GrantFiled: November 7, 2006Date of Patent: July 6, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Ki Yong Song, Jin Young Kim, Sung Hen Cho, Chang Ho Noh
-
Patent number: 7742216Abstract: Disclosed herein is an electrochromic display device comprising a pair of transparent substrates facing each other, an anode electrode and a cathode electrode respectively formed on the transparent substrates, an electrolytic layer disposed between the anode electrode and the cathode electrode, an electrochromophore layer of a nano structure formed on at least one of the anode electrode and the cathode electrode, and a redox promoter layer coated with a conductive compound, on the other electrode.Type: GrantFiled: September 6, 2007Date of Patent: June 22, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Chang Ho Noh, Sung Hen Cho, Ki Yong Song, Tae Rim Choi, Tamara Byk
-
Publication number: 20090117333Abstract: A method of manufacturing a display device includes: forming an auxiliary layer including at least one of metal and a metal oxide on an insulating substrate; forming a photoresist layer pattern partially exposing the auxiliary layer on the auxiliary layer; forming a trench on the insulating substrate by etching the exposed auxiliary layer and the insulating substrate under the exposed auxiliary layer; forming a seed layer including a first seed layer disposed on the photoresist layer pattern and a second seed layer disposed in the trench; removing the photoresist layer pattern and the first seed layer by lifting off the photoresist layer pattern; removing the auxiliary layer remaining on the insulating substrate after lifting off the photoresist layer pattern; and forming a main wiring layer on the second seed layer by electroless plating.Type: ApplicationFiled: August 26, 2008Publication date: May 7, 2009Inventors: Byeong-Jin Lee, Hong-sick Park, Hong-long Ning, Chang-oh Jeong, Yang-ho Bae, Pil-sang Yun, Sung-hen Cho, Ki-Yong Song, Seung-jae Jung, Byeong-beom Kim
-
Patent number: 7494926Abstract: Disclosed herein is a method for forming a highly conductive metal pattern which comprises forming a metal pattern on a substrate by the use of a photocatalyst and a selective electroless or electroplating process, and transferring the metal pattern to a flexible plastic substrate. According to the method, a highly conductive metal pattern can be effectively formed on a flexible plastic substrate within a short time, compared to conventional formation methods. Further disclosed is an EMI filter comprising a metal pattern formed by the method. The EMI filter not only exhibits high performances, but also is advantageous in terms of low manufacturing costs and simple manufacturing process. Accordingly, the EMI filter can be applied to a variety of flat panel display devices, including PDPs and organic ELs.Type: GrantFiled: December 20, 2004Date of Patent: February 24, 2009Assignee: Samsung Corning Co., Ltd.Inventors: Jin Young Kim, Sung Hen Cho, Ki Yong Song, Chang Ho Noh, Euk Che Hwang
-
Patent number: 7488570Abstract: A method for forming a metal pattern with a low resistivity. The method may include the steps of: (i) coating a photocatalytic compound onto a substrate to form a photocatalytic film layer; (ii) coating a water-soluble polymeric compound onto the photocatalytic film layer to form a water-soluble polymer layer; (iii) selectively exposing the two layers to light to form a latent pattern acting as a nucleus for crystal growth; and (iv) plating the latent pattern with a metal to grow metal crystals thereon. According to the method, a multilayer wiring pattern including a low resistivity metal may be formed in a relatively simple manner at low cost, and the metals constituting the respective layers can be freely selected according to the intended application. The low resistivity metal pattern may be advantageously applied to flat panel display devices, e.g., LCDs, PDPs and ELDs.Type: GrantFiled: November 2, 2005Date of Patent: February 10, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Chang Ho Noh, Ki Yong Song, Jin Young Kim, Sung Hen Cho, Euk Che Hwang, Tamara Byk
-
Patent number: 7473307Abstract: Disclosed herein is an electroless copper plating solution, including a copper salt, a completing agent, a reductant and a pH adjuster, in which the plating solution includes a 2,2-dipyridyl acid solution and the hydrogen ion concentration (pH) thereof is about 11.5 to about 13.0, a method of producing the same, and an electroless copper plating method. According to the plating solution of the present invention, an electroless copper plating film having stable and improved adhesivity and low electrical resistance can be obtained. Further, display devices including a metal pattern formed with the electroless copper plating solution can improve the reliability and price competitiveness of products prepared therefrom.Type: GrantFiled: August 3, 2007Date of Patent: January 6, 2009Assignee: Samsung Electronics Co., Ltd.Inventors: Ki Yong Song, Sung Hen Cho
-
Publication number: 20080314628Abstract: Disclosed is a method of forming a metal pattern, the method comprising depositing a dielectric substrate on a supporting substrate; forming a latent mask pattern of a metal pattern on the dielectric substrate; etching the dielectric substrate exposed by the latent mask pattern; forming a seed layer on the supporting substrate by activating the supporting substrate; removing the latent mask pattern and the portion of the seed layer disposed on the latent mask pattern through a lift-off process; and plating a metal layer on the patterned seed layer.Type: ApplicationFiled: January 29, 2008Publication date: December 25, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ki Yong SONG, Sung-Hen CHO, Jun Hyuk MOON, Chang Oh JEONG, Hong Long NING
-
Publication number: 20080268280Abstract: Disclosed herein is a method of preparing a low resistance metal line, in which a wet plating technique is used instead of a vacuum film forming process in order to simplify the process and decrease the manufacturing cost. In addition, a self-assembled monolayer is formed that facilitates the increased adsorption density and strength of the metal catalyst resulting in the formation of a high-density metal catalyst layer, thereby obtaining a high-quality metal line. Also disclosed herein, are a patterned metal line structure, and a display device using the same.Type: ApplicationFiled: January 23, 2008Publication date: October 30, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Hen CHO, Ki Yong SONG, Sang Eun PARK
-
Publication number: 20080223253Abstract: Disclosed herein is an electroless copper plating solution, including a copper salt, a completing agent, a reductant and a pH adjuster, in which the plating solution includes a 2,2-dipyridyl acid solution and the hydrogen ion concentration (pH) thereof is about 11.5 to about 13.0, a method of producing the same, and an electroless copper plating method. According to the plating solution of the present invention, an electroless copper plating film having stable and improved adhesivity and low electrical resistance can be obtained. Further, display devices including a metal pattern formed with the electroless copper plating solution can improve the reliability and price competitiveness of products prepared therefrom.Type: ApplicationFiled: August 3, 2007Publication date: September 18, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ki Yong SONG, Sung Hen CHO
-
Patent number: 7426071Abstract: Disclosed herein is an electrochromic device having the functionality of a secondary battery. The electrochromic device includes a plurality of secondary battery/display segments in which a double metal oxide layer comprising mesoporous metal oxide particles and macroporous metal oxide particles is disposed on a transparent electrode, and a cathode active material for a lithium secondary battery is disposed on a counter electrode to enable oxidation and reduction of lithium. Methods of manufacturing the electrochromic device are disclosed as well.Type: GrantFiled: August 9, 2006Date of Patent: September 16, 2008Assignee: Samsung Electronics Co., Ltd.Inventors: Ki Yong Song, Sung Hen Cho, Chang Ho Noh, Jin Young Kim, Jong Min Kim