Abstract: Provided are: an optical laminate comprising a second adhesive layer, a second adhesive layer laminated on the second adhesive layer, and a light shield part laminated between the first adhesive layer and the second adhesive layer; an optical member comprising same; and an optical display device including same.

Abstract: A semiconductor design optimization system that includes: a data base configured to store design data, a training data preprocessing unit configured to preprocess the design data and generate training data, a data learning unit configured to generate a physical property prediction model by training using the training data, a physical property prediction unit configured to generate predicted physical property data including information associated with predicted physical property values for each region of a semiconductor device to be fabricated, wherein the physical property prediction unit is configured to input, into the physical property prediction model, input data including information associated with design drawings of the semiconductor device to be fabricated, and a layout generator configured generate a design layout optimized to distribute the predicted physical property values for each region of the semiconductor device to be fabricated by modifying the design drawings based on the predicted physical

Abstract: A positive electrode material for a lithium secondary battery has improved electron conductivity and surface stability because oxidation-treated carbon nanotubes are stably attached to the surface of an active material. According to one embodiment the positive electrode material includes a positive electrode active material core made of a Li—Ni—Co—Mn-M-O-based material (M=transition metal) and an oxidized carbon nanotube coating layer formed on the surface of the positive electrode active material core and including 1% to 3% by weight of oxidation-treated carbon nanotubes (OCNT) relative to 100% by weight of the positive electrode active material core.

Abstract: A positive electrode material for a lithium secondary battery and a manufacturing method therefor are provided. The positive electrode material may have carbon nanotubes stably attached to a surface of an active material and may exhibit increased electron conductivity and improved surface stability. The positive electrode material for a lithium secondary battery may comprises: a positive electrode active material core comprising a Li—Ni—Co—Mn-M-O-based material, where M is a transition metal; and a carbon nanotube coating layer on a surface of the positive electrode active material core. Carbon nanotubes (CNT) may be in an amount of 1-5 wt %, based on 100 wt % of the positive electrode active material core.

Abstract: A semiconductor package may include a lower structure, a first semiconductor chip on the lower structure, the first semiconductor chip including a hot spot, a second semiconductor chip horizontally spaced apart from the first semiconductor chip on the lower structure, and a connection chip in the lower structure and connecting the first and second semiconductor chips to each other. The hot spot may vertically overlap the connection chip.

Abstract: A semiconductor package with improved thermal properties is provided. The semiconductor package includes a first package including a first die, an interposer on the first package and including a first area and a second area. A second package is on a top face of the interposer in the second area, and a thermal diffusion structure is on a top face of the interposer in the first area. The thermal diffusion structure is configured so that heat generated in the first die is discharged through the thermal diffusion structure.

Abstract: Provided is an airbag control unit with inertial measurement unit (IMU) integration, which includes an airbag collision sensor configured to detect airbag collision information; a digital sensor configured to detect a yaw rate and an acceleration, and to convert a detected data to a digital signal; and a micom configured to identify whether an output from the digital sensor and an output from the airbag collision sensor are within a measurement range of a corresponding sensor.

Abstract: A wiring substrate for a semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface. The substrate has at least one slot from the first surface to the second surface that exposes chip pads of a semiconductor chip mounted to the first surface. The substrate has first and second regions divided by the slot. A plurality of bonding pads is arranged along both side portions of the slot and the bonding pads are connected to bonding wires that are drawn from the chip pads through the slot. First and second conductive patterns are respectively formed in the first and second regions and respectively connected to the at least one bonding pad. A merging pattern extends from the first region to the second region to electrically connect the first conductive pattern and the second conductive pattern. A merging wire electrically connects the merging pattern and the at least one chip pad.

Abstract: A semiconductor package apparatus comprises: at least one semiconductor chip; and a circuit board on which the semiconductor chip is installed, wherein at least one conductive plane for improving power and/or ground characteristics is positioned on a side of the semiconductor chip. In this manner, fabrication cost for the semiconductor package apparatus can be mitigated, and power and/or ground characteristics can be improved so as to readily control impedance of signal lines. As a result, reliability of the operation of the semiconductor package apparatus can be improved, and noise and malfunction can be prevented.

Abstract: Disclosed herein is a collision detection system for a vehicle. The collision detection system for a vehicle according to the present invention includes a sensor unit and a control unit. The sensor unit measures impacts A and B along two axes that intersect each other in diagonal directions. The control unit calculates a longitudinal impact X and a transverse impact Y using the measured impacts A and B, and determines the direction of collision and whether to operate at least one device for protection against collision-related injury using the impacts.

Abstract: A semiconductor package apparatus comprises: at least one semiconductor chip; and a circuit board on which the semiconductor chip is installed, wherein at least one conductive plane for improving power and/or ground characteristics is positioned on a side of the semiconductor chip. In this manner, fabrication cost for the semiconductor package apparatus can be mitigated, and power and/or ground characteristics can be improved so as to readily control impedance of signal lines. As a result, reliability of the operation of the semiconductor package apparatus can be improved, and noise and malfunction can be prevented.

Abstract: A first exemplary embodiment of the present invention includes detecting pressures applied to a left front wheel, a left back wheel, a right front wheel, and a right back wheel; and judging that the possibility of roll over exists if any of the pressures applied to the left wheels, the right wheels, or the front wheels is greater than a reference pressure. A second exemplary embodiment of the present invention includes detecting pressures applied to the wheels; and judging that the possibility of roll over exists if a difference in the pressures of the left wheels and the right wheels, or the pressures of the front wheels and the back wheels, is greater than a reference difference. The method may further include controlling the wheels if the possibility of roll over is judged to exist.