Abstract: An LED lighting device is provided, which does not create dazzling effects, has no difference in brightness in accordance with viewing angles, and has superior interior effects. The LED lighting device includes an LED irradiating light onto an outside, a first lens having a lower part in which the LED is provided and having a convex form to diffuse the light incident from the LED through the lower part thereof to the outside, and a second lens provided on the outside of the first lens and having a rough surface formed on its inner surface to diffusedly reflect the light diffused through the first lens.

Abstract: The present invention relates to a method of controlling a mobile communication terminal and mobile communication system therefor. In the mobile communication terminal control method, a synchronous base station of a synchronous area placed at the boundary region of an asynchronous area transmits a dummy pilot signal at the same frequency as that of a signal used in the asynchronous mobile communication system and drives a synchronous modem unit of the mobile communication terminal moving from the asynchronous area to the synchronous area. A handover cell is constructed at the boundary between synchronous and asynchronous areas, and a handover base station in the handover cell transmits a signal including system information at the same frequency as that of a signal used in the asynchronous mobile communication system, thus driving the synchronous modem unit of the mobile communication terminal entering the handover cell.

Abstract: In the handover method, a radio network controller periodically measures the wireless environment of a mobile communication terminal, determines whether handover is required, and informs the asynchronous mobile switching center of the asynchronous communication system that the handover is required. The asynchronous mobile switching center requests the handover and a synchronous mobile switching center assigns a forward channel to the mobile communication terminal. The mobile communication terminal prepares for communication with a synchronous mobile communication system according to the direction of the asynchronous mobile switching center, and causes a backward channel with respect to the synchronous communication system to be assigned to the mobile communication terminal.

Abstract: Methods of fabricating a semiconductor device is provided. The methods include forming an interlayer insulating layer on a semiconductor substrate having a first region and a second region. First contact plugs may be formed on a portion of the second region to fill a plurality of first contact holes. A plurality of first contact mask layers and a plurality of first dummy mask layers may be formed on the interlayer insulating layer. The first contact mask layers may be formed in the first region. The first dummy mask layers may be formed in the second region. A plurality of second contact mask layers may be formed between two adjacent first contact mask layers. A plurality of second dummy mask layers may be formed between two adjacent first dummy mask layers. The interlayer insulating layer may be etched using the first contact mask layers and the second contact mask layers as etch stop layers to form a plurality of second contact holes through the interlayer insulating layer formed in the first region.

Abstract: Disclosed is a cell culture tube, having in opposite end walls two respective eccentric openings which communicate with each other through an inner straight passage formed in the cell culture tube, in which the inner straight passage is tilted at an angle relative to a longitudinal axis of the cell culture tube to allow a culture medium to smoothly flow into and out of the inner passage through the openings. Also, provided is a multiple cell culture system using a plurality of the culture tubes.

Abstract: An LED lighting device is provided, which does not create dazzling effects, has no difference in brightness in accordance with viewing angles, and has superior interior effects. The LED lighting device includes an LED irradiating light onto an outside, a first lens having a lower part in which the LED is provided and having a convex form to diffuse the light incident from the LED through the lower part thereof to the outside, and a second lens provided on the outside of the first lens and having a rough surface formed on its inner surface to diffusedly reflect the light diffused through the first lens.

Abstract: A circle type LED lighting flood lamp using a nano spreader is provided, which can provide a double heat dissipation structure formed by mounting an extended nano spreader having high heat diffusion on the inside of a circular type upper cover and making the extension parts of the nano spreader in contact with a heat dissipation portion in both directions, and prevent a heat dissipation plate from exposing to an outside by fixedly putting the upper cover on the outside of a heat dissipation member to improve the heat dissipation efficiency and the life span of the lamp.

Abstract: An LED lighting flood lamp having a double heat dissipation plate structure using nano spreaders are provided, in which the double heat dissipation plate structure is formed by installing the nano spreaders having high heat diffusion inside the lamp and forming heat dissipation plates on upper and lower parts of the nano spreaders, and heat dissipation pins are arranged in zigzag on the upper part of the upper heat dissipation plate, so that the heat dissipation efficiency is maximized, and the lamp has a slim external appearance without being limited in installation space.

Abstract: A heat dissipation member having variable heat dissipation paths and an LED lighting flood lamp using the same are provided, which can maximize heat dissipation effect by widening an air contact area and making air flow rapidly, seek a waterproof effect and prevention of a scald due to contact with a high-temperature heat dissipation plate, and prevent the reduction of heat dissipation efficiency caused by foreign substances by keeping wings of the heat dissipation plate not exposed to an outside.

Abstract: A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head including a pusher pad, the pusher pad adapted to push the polishing tape against the surface of the wafer to be polished, a color image sensor adjacent to the polishing tape, the color image sensor being adapted to detect a color image of the polishing tape and to output a signal corresponding to the detected color image, and a controller connected to the color image sensor, the controller being adapted to receive the signal output from the color image sensor and to determine when a color of the color image detected by the color image sensor changes, a change in the color image indicating a polishing end point.

Abstract: Methods of fabricating a semiconductor device is provided. The methods include forming an interlayer insulating layer on a semiconductor substrate having a first region and a second region. First contact plugs may be formed on a portion of the second region to fill a plurality of first contact holes. A plurality of first contact mask layers and a plurality of first dummy mask layers may be formed on the interlayer insulating layer. The first contact mask layers may be formed in the first region. The first dummy mask layers may be formed in the second region. A plurality of second contact mask layers may be formed between two adjacent first contact mask layers. A plurality of second dummy mask layers may be formed between two adjacent first dummy mask layers. The interlayer insulating layer may be etched using the first contact mask layers and the second contact mask layers as etch stop layers to form a plurality of second contact holes through the interlayer insulating layer formed in the first region.

Abstract: The present invention relates to a cool air supply structure of a storage receptacle for a refrigerator. The present invention comprises one or more box casings detachably installed in a refrigerating chamber, each box casing having a mounting space and a channel through which cool air flows, the cool air being supplied from a cool air supply source through a cool air supply port formed in a side surface of the refrigerating chamber; and one or more storage receptacles, each storage receptacle being withdrawably installed in the mounting space, wherein food accommodated in an accommodation space provided in the storage receptacle is indirectly cooled by the cool air that flows through the channel. According to the present invention, there is an advantageous effect in that the food accommodated in a plurality of storage receptacles can be stored to be fresher by indirectly cooling the food and simultaneously the supply of cool air can be controlled depending on the use or not of the storage receptacles.

Abstract: Disclosed is a mobile communication system and method for packet hand-over between asynchronous communication network and synchronous communication network, and mobile communication terminal therefor for enabling a mobile phone to be connected with a synchronous network using a call re-sending message transmitted in an asynchronous network. The mobile communication system and method saves the time that a mobile phone, which performs a packet hand-over from an asynchronous network to a synchronous network, re-connects the synchronous network with a packet call, because the call re-sending message transmitted in an asynchronous network is provided to a multi mode multi band mobile phone in case that a hand-over is requested.

Abstract: Disclosed are a method for hand-over between an asynchronous communication network and a synchronous communication network of multi mode multi band mobile communication terminal and mobile communication terminal therefor to improve the hand-over connecting rate between an asynchronous communication network and a synchronous communication network in a mixed mobile communication system of an asynchronous network and a synchronous network.

Abstract: The handover method includes the steps of the base stations of the synchronous mobile communication network transmitting dummy pilot signals for the asynchronous mobile communication network, the mobile communication terminal, for which call connection with the asynchronous mobile communication network is performed through the asynchronous wireless device, determining whether the dummy pilot signals for the asynchronous mobile communication network have been received through the asynchronous wireless device; the mobile communication terminal requesting handover from the asynchronous mobile communication network if it is determined that the dummy pilot signals for the asynchronous mobile communication network have been received; and the asynchronous mobile communication network determining that handover is possible, notifying the mobile communication terminal of the determination that handover is possible, and the asynchronous mobile communication network requesting handover to the synchronous mobile communica

Abstract: A handover method for a mobile communication terminal is disclosed. In the handover method, a radio network controller periodically measures the wireless environment of a mobile communication terminal, determines whether handover is required, and informs the asynchronous mobile switching center of the asynchronous communication system that the handover is required. The asynchronous mobile switching center requests the handover and a synchronous mobile switching center assigns a forward channel to the mobile communication terminal. The mobile communication terminal prepares for communication with a synchronous mobile communication system according to the direction of the asynchronous mobile switching center, and causes a backward channel with respect to the synchronous communication system to be assigned to the mobile communication terminal.

Abstract: A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided. In a preferred method, for example, a first displacement of a semiconductor wafer with respect to a polishing pad is measured during an initial stage and a first reference range of the thickness change of the slurry film is preferably set to determine a replacement time corresponding to the abrasion amount of the polishing pad. A conditioning condition of the polishing pad conditioning can also be set, and a second displacement of the semiconductor wafer with respect to the polishing pad can be measured when the surface of the semiconductor wafer is polished by the polishing pad. The first displacement is then preferably compared with the second displacement to calculate the thickness change of the slurry film formed between the polishing pad and the semiconductor wafer.

Abstract: A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided. In a preferred method, for example, a first displacement of a semiconductor wafer with respect to a polishing pad is measured during an initial stage and a first reference range of the thickness change of the slurry film is preferably set to determine a replacement time corresponding to the abrasion amount of the polishing pad. A conditioning condition of the polishing pad conditioning can also be set, and a second displacement of the semiconductor wafer with respect to the polishing pad can be measured when the surface of the semiconductor wafer is polished by the polishing pad. The first displacement is then preferably compared with the second displacement to calculate the thickness change of the slurry film formed between the polishing pad and the semiconductor wafer.

Abstract: Example embodiments are directed to a method of planarizing a semiconductor device. A first CMP process may be performed on an insulating layer to remove a stepped structure of the insulating layer. A second CMP process may be performed to planarize the insulating layer with the stepped structure removed until a given pattern is exposed. A process temperature of the first CMP process may be higher than that of the second CMP process. Accordingly, an initial stepped structure may be more readily removed in a planarization process of a surface of the semiconductor device, which may reduce the CMP process time and may increase the degree of planarization.

Abstract: A robotic system providing precision interfaces between a rotary actuator and a robotic structure. The robotic structure responsive to control by a rotary actuator via a connection means whereby interface design parameters are relayed to the rotary actuator. The rotary actuator for controlling the robotic structure includes an actuator shell, an eccentric cage and a primer mover portion, rigidly attached to the eccentric cage and capable of exerting a torque on a first prime mover. A cross-roller is also included having a first bearing portion rigidly fixed to the actuator shell and a second bearing portion, an output attachment plate attached to a second bearing portion, a shell gear rigidly attached to the actuator shell, an output gear attached to the output attachment plate and an eccentric gear attached to the eccentric cage.