Patents by Inventor Sung-Hsueh Tsai

Sung-Hsueh Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Docking stations
    Patent number: 11320862
    Abstract: A docking station may include a first communication port to couple the docking station to a target computing device, a rotatable plate, and a fixed plate. The docking station may be rotatably coupled to the target computing device about the first communication port via the rotatable plate and the fixed plate.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: May 3, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wen-Yen Tang, Chang-Han Tsai, Sung-Hsueh Tsai
  • INSULATIVE LAYERS
    Publication number: 20210199150
    Abstract: A thermally resistant coupling device coupled to an electronic device may include a screw to threadingly engage with a boss hole formed in the electronic device and an elastic insulative layer encapsulating a portion of the screw. An electronic device may include a screw hole, an elastic insulative layer placed within the screw hole, and a screw to threadingly engage with the screw hole and elastic insulative layer.
    Type: Application
    Filed: August 10, 2018
    Publication date: July 1, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chien Tu Cheng, Al-Tsung LI, Sung Hsueh Tsai, Jamil Abdul Wakil
  • DOCKING STATIONS
    Publication number: 20210173441
    Abstract: A docking station may include a first communication port to couple the docking station to a target computing device, a rota table plate, and a fixed plate. The docking station may be rotatably coupled to the target computing device about the first communication port via the rota table plate and the fixed plate.
    Type: Application
    Filed: August 28, 2018
    Publication date: June 10, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Wen-Yen Tang, Chang-Han Tsai, Sung-Hsueh Tsai