Abstract: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.

Abstract: An X-ray imaging apparatus includes an imaging device configured to capture a camera image of a target; a controller configured to stitch a plurality of X-ray images of respective divided regions of the target to generate one X-ray image of the target; and a display configured to display a settings window that provides a GUI for receiving a setting of an X-ray irradiation condition for the respective divided regions, and display the camera image in which positions of the respective divided regions are displayed.

Abstract: A package includes a package component, a device die over and bonded to the package component, a metal cap having a top portion over the device die, and a thermal interface material between and contacting the device die and the metal cap. The thermal interface material includes a first portion directly over an inner portion of the device die, and a second portion extending directly over a corner region of the device die. The first portion has a first thickness. The second portion has a second thickness greater than the first thickness.

Abstract: An electro-optic device and a method for manufacturing the same. The method includes forming a bottom electrode on a substrate, forming a first insulation film crossing over the bottom electrode, forming an organic film on the substrate, forming a top electrode film on the organic film, and forming a top electrode that crosses the bottom electrode by laser-scribing the top electrode film. Herein, forming the top electrode by laser-scribing may position a bottom edge of the top electrode along an upper side of the first insulation film. Therefore, processing required for separately forming the top electrodes may be reduced, thereby simplifying manufacturing processes and saving manufacturing cost. Furthermore, since the insulation film is formed under the top electrode edge, leakage current and device malfunction caused by deformation of the top electrode can be prevented, even though the top electrode edge is damaged during laser-scribing. Thus, electro-optic device reliability can be improved.

Abstract: An electro-optic device and a method for manufacturing the same. The method includes forming a bottom electrode on a substrate, forming a first insulation film crossing over the bottom electrode, forming an organic film on the substrate, forming a top electrode film on the organic film, and forming a top electrode that crosses the bottom electrode by laser-scribing the top electrode film. Herein, forming the top electrode by laser-scribing may position a bottom edge of the top electrode along an upper side of the first insulation film. Therefore, processing required for separately forming the top electrodes may be reduced, thereby simplifying manufacturing processes and saving manufacturing cost. Furthermore, since the insulation film is formed under the top electrode edge, leakage current and device malfunction caused by deformation of the top electrode can be prevented, even though the top electrode edge is damaged during laser-scribing. Thus, electro-optic device reliability can be improved.

Abstract: Provided are an electro-optic device and a method for manufacturing the same. The method includes forming a bottom electrode on a substrate, forming a first insulation film to cross over the bottom electrode forming an organic film on the substrate where the bottom electrode and the first insulation film are formed, forming a top electrode film on the organic film, and forming a top electrode to cross the bottom electrode by removing a portion of the top electrode film through a laser-scribing process. Herein, in the forming of the top electrode through the laser-scribing process, an edge region of a bottom surface of the top electrode may be positioned corresponding to an upper side of the first insulation film. Therefore, it is possible to reduce the number of processing apparatuses and steps required for separately forming the plurality of top electrodes, thereby simplifying manufacturing processes and saving manufacturing cost.