Patents by Inventor Sung Hun Yu

Sung Hun Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10825009
    Abstract: An electronic device includes: a memory configured to store at least one instruction; and a processor connected to the memory. The at least one instruction executed by the processor is set to receive an application identifier for payment transaction from a reader device and generate payment related information including payment identification information for the payment transaction and additional service information relating to the payment transaction by a payment application corresponding to the application identifier.
    Type: Grant
    Filed: March 15, 2016
    Date of Patent: November 3, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: In Ho Kim, Ji Su Oh, Seung Won Oh, Sung Hun Yu, Byoung Kab Choi, Ki Bong Kim, Seong Min Je
  • Publication number: 20160275474
    Abstract: An electronic device includes: a memory configured to store at least one instruction; and a processor connected to the memory. The at least one instruction executed by the processor is set to receive an application identifier for payment transaction from a reader device and generate payment related information including payment identification information for the payment transaction and additional service information relating to the payment transaction by a payment application corresponding to the application identifier.
    Type: Application
    Filed: March 15, 2016
    Publication date: September 22, 2016
    Inventors: In Ho KIM, Ji Su OH, Seung Won OH, Sung Hun YU, Byoung Kab CHOI, Ki Bong KIM, Seong Min JE
  • Publication number: 20140353820
    Abstract: Semiconductor device and method for fabricating the same are provided. The semiconductor device comprises a first metal wiring line, a chip pad which is electrically connected with the first metal wiring line and has a first width, a passivation layer which encloses the chip pad and includes a contact hole, a first barrier pattern formed on a side wall of the contact hole and a top surface of the passivation layer, a contact filling the contact hole on the first barrier pattern, and a bump, which is formed of the same material as the contact, has a second width which is smaller than the first width, and is overlaid with the first metal wiring line and the chip pad, the bump being entirely overlapped with the chip pad.
    Type: Application
    Filed: March 6, 2014
    Publication date: December 4, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-Hun Yu, Sang-Hoon Park, Jun-Gu Kang, Oh-Kyum Kwon, Sun-Hyun Kim
  • Publication number: 20070189728
    Abstract: Disclosed herein is a method of recording and reproducing surveillance images in a Digital Video Recorder (DVR). In one embodiment of the present invention, a recording speed such as a frame rate for surveillance images are controlled according to extent of motion of subjects in the surveillance detected through prediction between neighboring frames, and information about the controlled frame rates and information about time at which the frame rate is used may be managed and recorded in an associated manner. In another embodiment of the present invention, based on information about frame rates managed in associated with information about time at which the frame rate is used, specific frames from surveillance images on a recording medium are selectively reproduced, and a period in which frames are recorded at a frame rate higher than a specific rate may be selected and reproduced.
    Type: Application
    Filed: December 22, 2006
    Publication date: August 16, 2007
    Applicant: LG Electronics Inc.
    Inventor: Sung Hun Yu