Patents by Inventor Sung Hur
Sung Hur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11942632Abstract: A positive electrode active material particle includes a core that contains lithium cobalt oxide represented by the following Chemical Formula LiaCo(1-x)MxO2-yAy and a shell that is coated on the surface of the core and contains composite metal oxide of a metal with an oxidation number of +2 and a metal with an oxidation number of +3. In particular, M is at least one selected from the group consisting of Ti, Mg, Zn, Si, Al, Zr, V, Mn, Nb and Ni. A is oxygen-substitutional halogen and 1.00?a?1.05, 0?x?0.05, and 0?y?0.001.Type: GrantFiled: October 4, 2017Date of Patent: March 26, 2024Assignee: LG Energy Solution, Ltd.Inventors: Hyuck Hur, Chi Ho Jo, Bo Ram Lee, Sung bin Park, Young uk Park, Wang Mo Jung
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Patent number: 11257857Abstract: An image sensor may include a substrate including first and second surfaces opposite each other, a plurality of photoelectric conversion devices isolated from direct contact with each other within the substrate, a first trench configured to extend into an interior of the substrate from the first surface of the substrate and between adjacent photoelectric conversion devices of the plurality of photoelectric conversion devices, a first supporter within the first trench, and a first isolation layer at least partially covering both sidewalls of the first supporter within the first trench, wherein a lower surface of the first supporter is coplanar with the first surface of the substrate.Type: GrantFiled: October 17, 2019Date of Patent: February 22, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Jae Sung Hur, Jin Gyun Kim, Kook Tae Kim, Young Bin Lee, Ha Jin Lim, Taek Soo Jeon, Soo Jin Hong
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Patent number: 11205683Abstract: An image sensor includes a substrate having a photoelectric conversion element therein, a first insulating layer on the substrate, a contact penetrating through the first insulating layer, a color filter on at least one side of the contact, and a moisture absorption prevention layer in contact with a sidewall of the contact and extending on an upper surface of the color filter.Type: GrantFiled: February 11, 2020Date of Patent: December 21, 2021Inventors: Kwan Sik Kim, Jin Hyung Kim, Chang Hwa Kim, Hong Ki Kim, Sang-Su Park, Beom Suk Lee, Jae Sung Hur
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Patent number: 11152415Abstract: An image sensor includes a photoelectric converter in a pixel area of a substrate to generate photoelectrons in response to an incident light that is incident onto the pixel area, a signal generator on a first surface of the substrate in the pixel area to generate electric signals corresponding to image information of an object in accordance with the photoelectrons, and a pixel separation pattern penetrating through the substrate from the first surface of the substrate to a second surface of the substrate opposite to the first surface of the substrate, the pixel separation pattern including an insulation pattern having a refractive index smaller than that of the substrate and a metallic conductive pattern enclosed by the insulation pattern, and the pixel area being enclosed by the pixel separation pattern and isolated from a neighboring pixel area.Type: GrantFiled: July 9, 2019Date of Patent: October 19, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ha-Jin Lim, Kook-Tae Kim, Jong-Min Jeon, Jae-Sung Hur, Hye-Ri Hong
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Publication number: 20200395414Abstract: An image sensor includes a substrate having a photoelectric conversion element therein, a first insulating layer on the substrate, a contact penetrating through the first insulating layer, a color filter on at least one side of the contact, and a moisture absorption prevention layer in contact with a sidewall of the contact and extending on an upper surface of the color filter.Type: ApplicationFiled: February 11, 2020Publication date: December 17, 2020Inventors: Kwan Sik KIM, Jin Hyung KIM, Chang Hwa KIM, Hong Ki KIM, Sang-Su PARK, Beom Suk LEE, Jae Sung HUR
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Publication number: 20200219911Abstract: An image sensor may include a substrate including first and second surfaces opposite each other, a plurality of photoelectric conversion devices isolated from direct contact with each other within the substrate, a first trench configured to extend into an interior of the substrate from the first surface of the substrate and between adjacent photoelectric conversion devices of the plurality of photoelectric conversion devices, a first supporter within the first trench, and a first isolation layer at least partially covering both sidewalls of the first supporter within the first trench, wherein a lower surface of the first supporter is coplanar with the first surface of the substrate.Type: ApplicationFiled: October 17, 2019Publication date: July 9, 2020Applicant: Samsung Electronics Co., Ltd.Inventors: Jae Sung HUR, Jin Gyun KIM, Kook Tae KIM, Young Bin LEE, Ha Jin LIM, Taek Soo JEON, Soo Jin HONG
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Patent number: 10644058Abstract: An image sensor includes a plurality of photo diodes disposed at a semiconductor substrate, and a splitter disposed on the photo diodes. The splitter splits an incident light depending on a wavelength so that split light of different colors enters different photo diodes, respectively. The splitter includes a first pattern structure having a cross-sectional structure in which a plurality of refractive layer patterns are deposited in a lateral direction.Type: GrantFiled: October 26, 2018Date of Patent: May 5, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jung-Hun Kim, Sang-Su Park, Chang-Hwa Kim, Hyung-Yong Kim, Beom-Suk Lee, Man-Geun Cho, Jae-Sung Hur
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Publication number: 20200127025Abstract: An image sensor includes a photoelectric converter in a pixel area of a substrate to generate photoelectrons in response to an incident light that is incident onto the pixel area, a signal generator on a first surface of the substrate in the pixel area to generate electric signals corresponding to image information of an object in accordance with the photoelectrons, and a pixel separation pattern penetrating through the substrate from the first surface of the substrate to a second surface of the substrate opposite to the first surface of the substrate, the pixel separation pattern including an insulation pattern having a refractive index smaller than that of the substrate and a metallic conductive pattern enclosed by the insulation pattern, and the pixel area being enclosed by the pixel separation pattern and isolated from a neighboring pixel area.Type: ApplicationFiled: July 9, 2019Publication date: April 23, 2020Inventors: Ha-Jin LIM, Kook-Tae KIM, Jong-Min JEON, Jae-Sung HUR, Hye-Ri HONG
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Patent number: 10313979Abstract: An apparatus for controlling an Uplink (UL) power in a wireless communication system including a transmitter/receiver and a controller may be provided. The transmitter/receiver may receive/decode Downlink (DL) data, transmit a feedback signal with respect to the DL data, and receive Transmit power Control (TPC) commands from active set cells including a serving cell. The controller may decode the TPC commands to generate a combined TPC command, in which decoded TPC commands of the active set cells are combined, and calculate a transmission error rate of an UL feedback transmission signal and a requested rate of transmit power increase of the serving cell, determine a transmit power gain offset and the requested rate of transmit power increase, determine an UL power for transmitting a feedback signal with respect to the received DL data based on the transmit power gain offset, and transmit the feedback signal based on the UL power.Type: GrantFiled: November 29, 2016Date of Patent: June 4, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Ki-Ho Kil, Min-Ho Shin, Min-Sung Hur
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Publication number: 20190157336Abstract: An image sensor includes a plurality of photo diodes disposed at a semiconductor substrate, and a splitter disposed on the photo diodes. The splitter splits an incident light depending on a wavelength so that split light of different colors enters different photo diodes, respectively. The splitter includes a first pattern structure having a cross-sectional structure in which a plurality of refractive layer patterns are deposited in a lateral direction.Type: ApplicationFiled: October 26, 2018Publication date: May 23, 2019Inventors: Jung-Hun KIM, Sang-Su PARK, Chang-Hwa KIM, Hyung-Yong KIM, Beom-Suk LEE, Man-Geun CHO, Jae-Sung HUR
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Patent number: 10109664Abstract: An image sensor configured to provide improved reliability may include a charge passivation layer that includes a multiple different elements, each element of the different elements being a metal element or a metalloid element. The different elements may include a first element of a first group of periodic table elements and a second element of a second, different group of periodic table elements. The charge passivation layer may include an amorphous crystal structure.Type: GrantFiled: May 30, 2017Date of Patent: October 23, 2018Assignee: Samsung Electronics Co., Ltd.Inventors: In Gyu Baek, Sang Hoon Uhm, Tae Yon Lee, Jae Sung Hur
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Publication number: 20180053796Abstract: An image sensor configured to provide improved reliability may include a charge passivation layer that includes a multiple different elements, each element of the different elements being a metal element or a metalloid element. The different elements may include a first element of a first group of periodic table elements and a second element of a second, different group of periodic table elements. The charge passivation layer may include an amorphous crystal structure.Type: ApplicationFiled: May 30, 2017Publication date: February 22, 2018Applicant: Samsung Electronics Co., Ltd.Inventors: In Gyu BAEK, Sang Hoon Uhm, Tae Yon Lee, Jae Sung Hur
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Patent number: 9883000Abstract: The disclosure is related identifying a push content frame at a transport layer and dynamically and selectively controlling a transmission path of a server push service by a server in a heterogeneous multipath transmission environment. The method may include determining whether frames are associated with the server push service when the frames are provided from an application layer to be transmitted to a user equipment, selecting at least one transmission path based on predetermined selection conditions from multiple transmission paths between the server and the user equipment, and transmitting, through the selected at least one transmission path, packetized frames associated with the server push service to the user equipment.Type: GrantFiled: October 7, 2015Date of Patent: January 30, 2018Assignee: KT CORPORATIONInventors: Dong-Hoon Yi, Tae-Sung Hur
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Publication number: 20170367052Abstract: An apparatus for controlling an Uplink (UL) power in a wireless communication system including a transmitter/receiver and a controller may be provided. The transmitter/receiver may receive/decode Downlink (DL) data, transmit a feedback signal with respect to the DL data, and receive Transmit power Control (TPC) commands from active set cells including a serving cell. The controller may decode the TPC commands to generate a combined TPC command, in which decoded TPC commands of the active set cells are combined, and calculate a transmission error rate of an UL feedback transmission signal and a requested rate of transmit power increase of the serving cell, determine a transmit power gain offset and the requested rate of transmit power increase, determine an UL power for transmitting a feedback signal with respect to the received DL data based on the transmit power gain offset, and transmit the feedback signal based on the UL power.Type: ApplicationFiled: November 29, 2016Publication date: December 21, 2017Applicant: Samsung Electronics Co., Ltd.Inventors: Ki-Ho KIL, Min-Ho SHIN, Min-Sung HUR
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Publication number: 20170191979Abstract: A plastic microchip is disclosed. The plastic microchip according to examples of the present invention enables a bonding material to be quickly and uniformly diffused along a bonding surface so as to accurately and easily bond an upper substrate and a lower substrate, maintain a shape of a bonding part when separating an injection-molded article from a mold so as to minimize a design error of a channel height, and prevent the bonding material from leaking inside a space of a bonding jig or a sample charging part, thereby improving product productivity and reliability.Type: ApplicationFiled: May 14, 2015Publication date: July 6, 2017Applicant: NANOENTEK, INC.Inventors: Yu-Rae KIM, Jae-Jeong KIM, Dae-Sung HUR
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Patent number: 9599542Abstract: The present invention relates to a sample analyzing chip. The chip can prevent upper and lower substrates of a channel from being attached to each other due to deflection on a micro channel and can solve the problem of the sample drying up within a measuring time of a target. Also, the chip can prevent bubbles from being generated in a central portion of the micro channel.Type: GrantFiled: May 14, 2013Date of Patent: March 21, 2017Assignee: NANOENTEK, INC.Inventors: Dae Sung Hur, Jae Jeong Kim, Yu Rae Kim
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Patent number: 9574978Abstract: Disclosed therein is a sampler. The sampler includes: a chamber accommodating a fluid or solid reagent therein and being sealed at both ends with penetrable films; a tube joined with the chamber at one side, the tube having a hollow portion therein; and a movable bar having a tip which is formed at one end and has a specimen extracting portion, the tip being guided and moved through a hollow portion, the tip being adapted for mixing the specimen extracted by the specimen extracting portion with the reagent so as to form a diluted solution while penetrating through one end of the chamber and adapted for quantitatively discharging out the diluted solution while penetrating through the other end of the chamber.Type: GrantFiled: December 1, 2011Date of Patent: February 21, 2017Assignee: NANOENTEK, INC.Inventors: Dae-Sung Hur, Ji-Young Park
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Publication number: 20160100332Abstract: The disclosure is related identifying a push content frame at a transport layer and dynamically and selectively controlling a transmission path of a server push service by a server in a heterogeneous multipath transmission environment. The method may include determining whether frames are associated with the server push service when the frames are provided from an application layer to be transmitted to a user equipment, selecting at least one transmission path based on predetermined selection conditions from multiple transmission paths between the server and the user equipment, and transmitting, through the selected at least one transmission path, packetized frames associated with the server push service to the user equipment.Type: ApplicationFiled: October 7, 2015Publication date: April 7, 2016Applicant: KT CORPORATIONInventors: Dong-Hoon YI, Tae-Sung HUR
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Patent number: 9176035Abstract: The present invention relates to a sampler which is capable of rapidly and easily separating blood corpuscles from blood, being operated conveniently, and directly using extracted plasma. According to one embodiment of the present invention, a sampler includes a chamber and a membrane guide. Here, the chamber includes an insertion unit having an insertion hole on one side, wherein the other side is opened, and an inner side includes a receiving space for receiving a sample. Additionally, one side of the membrane guide is combined to the membrane, and the membrane guide includes a channel wherein filtered materials, which are filtered through the membrane among the samples received in the receiving space, are moved in a gravitational direction.Type: GrantFiled: May 15, 2012Date of Patent: November 3, 2015Assignee: NANOENTEK, INC.Inventor: Dae Sung Hur
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Publication number: 20150114556Abstract: Disclosed is a method of bonding upper and lower substrates for manufacturing a plastic micro chip comprising the upper substrate, the lower substrate and a sample filling space having a predetermined height for filling a sample between the upper and lower substrates. According to the method, the upper and lower substrates are bonded by introducing an organic solvent between the upper and lower substrates. In addition, the invention provides a method of manufacturing a micro chip using the method and a micro chip manufactured according to the method. According to the invention, it is possible to easily and precisely bond the upper and lower substrates of the plastic micro chip.Type: ApplicationFiled: November 26, 2014Publication date: April 30, 2015Inventors: Jun Keun CHANG, Dae Sung HUR, Chanil CHUNG, Jun Ha PARK, Han Sang JO