Abstract: Provided are a back sheet for a solar cell module and a solar cell module including the same, the solar cell module comprises a polyester film layer and a fluorine coating layer which coats at least one surface of the polyester film layer. The back sheet is formed on an upper surface of the polyester film layer, and include s a polyethylene film layer attached to an ethylene vinyl acetate (EVA) sheet of the solar cell module. The back sheet for the solar cell module can be distributed at a low cost, and has excellent adhesive property, moisture barrier property (water vapor -permeability preventing property) and the like.

Abstract: A semiconductor package including a circuit board including a plurality of pads; a support structure disposed on the circuit board; and a plurality of semiconductor chips stacked on the circuit board and the support structure, each semiconductor chip including at least one pad. For each semiconductor chip, the at least one pad is aligned with a corresponding pad of the circuit board; and an electrical connection is formed between the at least one pad and the corresponding pad of the circuit board through the support structure.

Abstract: A display apparatus includes a display panel including lower and upper substrates confronting each other, and a film member combined with the upper substrate; and a panel support member to support the display panel to expose the front and lateral sides of the display panel to the outside.

Abstract: A method and a system for cutting the knee joint using a robot. A cantilevered cutter is introduced into the knee joint from inside and outside of upper and lower bones of the knee joint to realize a tunnel cutting technique in which cutting is conducted such that tunnels are defined in bone and remnant bone is cleared. The cutter includes a shaft in which a substantial axial portion is fitted into a sleeve and a remaining axial portion serves as a cantilever extending out of the sleeve, and a head which is formed at a distal end of the shaft. A length of the cantilever and a diameter of the head are determined to have minimum sizes as long as the head can be introduced into bone in such a way as to define a tunnel and can be moved in the bone while cutting the bone.

Abstract: Disclosed is an LCD device including: a liquid crystal panel including an upper substrate and a lower substrate; a backlight unit supplying light to the liquid crystal panel; a guide frame guiding a location of the liquid crystal panel and a location of the backlight unit; and a rear set cover and front set cover accommodating the liquid crystal panel, the backlight unit, and the guide frame, and serving as a cover of a product, wherein the front set cover comprises an bezel part facing a side of the upper substrate, and being not formed on a top of the upper substrate.

Abstract: A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring.

Abstract: A method for forming metal-polymer hybrid tooling includes patterning a surface of a member such as a silicon wafer, stainless steel, nickel or nickel alloy, engaging a polymer layer with the patterned features of the surface of the silicon wafer to form the polymer layer having a reverse of the patterned surface the silicon wafer, removing the patterned polymer layer to expose a patterned polymer layer surface, depositing a metallic layer on the patterned polymer layer surface, and wherein the deposited metallic layer on the patterned polymer layer is operable to form parts with features having a width dimension between about 0.01 microns and about 100 microns and a height dimension of between about 0.01 micron and about 800 microns (e.g., up to aspect ratio of 8).

Abstract: Disclosed is a composition for biodegradable starch bowl consisting of unmodified starch of 20-60 wt. %, pulp fiber powder of 5-30 wt. %, solvent of 30-60 wt. %, photo catalyst of 0.1-2.0 wt. %, preservative of 0.01-1 wt. % and releasing agent of 0.5-5 wt. %. In the present invention, further disclosed is a biodegradable starch bowl being prepared by heating and pressurizing said composition for biodegradable starch bowl so as to have a desired shape. The composition for a biodegradable starch bowl and the biodegradable starch bowl using the same according to the present invention have improved sterilizing, deodorizing, preservative and releasing properties.

Abstract: Disclosed is a user interface providing method for controlling a game play in a portable device. A user interface providing technology determines whether a received first touch input is a touch input for setting a GUI, determines a GUI setting mode, and activating at least one GUI element for controlling the game play in response to the GUI setting mode.

Abstract: Provided are a stack package and a stack packaging method. The stack package includes: a first package; and a second package stacked on the first package, wherein external leads of the first package and the second package are directly connected to one another and inner leads thereof are arranged in different shapes so that the Chip Select signal of the second package are input through a No Select pin of the first package.

Abstract: Embodiments of the inventive concept provide a semiconductor chip stack-type package. The package comprises a lead frame including a die paddle part and a lead part, a first semiconductor chip group and a second semiconductor chip group stacked sequentially and mounted on one surface of the die paddle part, a first wiring board between the first semiconductor chip group and the second semiconductor chip group, and second semiconductor chip group bonding wires for electrically connecting the second semiconductor chip group to the first wiring board. End portions of the first wiring board are electrically connected to inner leads of the lead part, which is adjacent to the die paddle part.

Abstract: An apparatus for transferring a plurality of substrates in manufacturing a liquid crystal display, includes a storage unit to store the plurality of substrates, an unloading member disposed in the storage unit to unload the substrates from the storage unit, a cassette disposed in the storage unit to lift and lower the plurality of substrates between respective storage substrate positions and the unloading member, a processing equipment to receive the substrates unloaded from the cassette, and a substrate feeder to receive the substrates from the storage unit unloaded by the unloading member and to load the substrates into the processing equipment.

Abstract: A semiconductor package includes: a semiconductor chip having a first surface, and a second surface that is opposite to the first surface and allows a semiconductor device to be formed thereon; bonding pads disposed on the second surface of the semiconductor chip; and a metal ion barrier layer disposed on the first surface of the semiconductor chip, and preventing metal ions from penetrating into the semiconductor chip through the first surface of the semiconductor chip. Accordingly, the semiconductor package can obtain a superior semiconductor device by minimizing moisture absorption and effectively blocking the penetration of metal ions.

Abstract: A method and a system for cutting the knee joint using a robot. A cantilevered cutter is introduced into the knee joint from inside and outside of upper and lower bones of the knee joint to realize a tunnel cutting technique in which cutting is conducted such that tunnels are defined in bone and remnant bone is cleared. The cutter includes a shaft in which a substantial axial portion is fitted into a sleeve and a remaining axial portion serves as a cantilever extending out of the sleeve, and a head which is formed at a distal end of the shaft. A length of the cantilever and a diameter of the head are determined to have minimum sizes as long as the head can be introduced into bone in such a way as to define a tunnel and can be moved in the bone while cutting the bone.

Abstract: Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that exposes bonding pads within an aperture formed in a center portion of the lead frame and a peripheral terminal pad portion for establishing external contacts. A plurality of bonding wires are used to establish electrical connection between a lower surface of the paddle part and corresponding bonding pads with intermediate leads providing connection to the terminal pad portions. The semiconductor chip, lead frame and bonding wires may then be encapsulated to form a thin semiconductor package having a thickness substantially equal to that of the terminal pad portions. The thin semiconductor packages may, in turn, be used to form multi-chip stack packages using known good semiconductor chips to form a high-density compound semiconductor packages.

Abstract: A semiconductor chip package includes a lead frame, an insulation member, a chip, bonding wires and a sealing member. The lead frame includes a plurality of first leads and a plurality of second leads. The second leads have a chip adhesion region. The insulation member fills a space between the second leads in the chip adhesion region. The chip is provided on at least one surface of the insulation member. The chip has single-side bonding pads. The bonding wires electrically connect the leads and the bonding pads. The sealing member covers the lead frame, the insulation member, the chip and the bonding wires. Since the space between the second leads is filled with the insulation member, voids may be prevented from occurring.

Abstract: Embodiments of the inventive concept provide a semiconductor chip stack-type package. The package comprises a lead frame including a die paddle part and a lead part, a first semiconductor chip group and a second semiconductor chip group stacked sequentially and mounted on one surface of the die paddle part, a first wiring board between the first semiconductor chip group and the second semiconductor chip group, and second semiconductor chip group bonding wires for electrically connecting the second semiconductor chip group to the first wiring board. End portions of the first wiring board are electrically connected to inner leads of the lead part, which is adjacent to the die paddle part.

Abstract: A cassette stacking apparatus is provided. The cassette stacking apparatus includes a first loading unit that loads or unloads a cassette. The cassette stacking apparatus also has a stacking unit disposed at a side of the loading unit, wherein an upper portion of the stacking unit forms a shelf which receives the cassette.

Abstract: The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the semiconductor device. An adhesive material is applied in the opening in the lead frame. This adhesive material contacts both the lead frame and the semiconductor device. The lead frame is therefore securely held to the semiconductor device. Wires can then be bonded to contact pads on the semiconductor device and to the lead frame.

Abstract: Provided is a thin semiconductor package comprising a semiconductor chip and a lead frame, the lead frame including a paddle portion configured for mounting the semiconductor chip in a manner that exposes bonding pads within an aperture formed in a center portion of the lead frame and a peripheral terminal pad portion for establishing external contacts. A plurality of bonding wires are used to establish electrical connection between a lower surface of the paddle part and corresponding bonding pads with intermediate leads providing connection to the terminal pad portions. The semiconductor chip, lead frame and bonding wires may then be encapsulated to form a thin semiconductor package having a thickness substantially equal to that of the terminal pad portions. The thin semiconductor packages may, in turn, be used to form multi-chip stack packages using known good semiconductor chips to form a high-density compound semiconductor packages.