Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

Abstract: A method of preparing a structure, more particularly, a method of preparing a structure capable of ensuring a space for carrying an electrode active material by a simple method which includes an electrospinning process using a double nozzle electrospinning device and a heat treatment process.

Abstract: A die ejector includes a supporter configured to support a film on which a die is attached in a vertical direction, an elevation device in a hole of the supporter and configured to move the film with the die attached thereon in the vertical direction and in relation to the supporter, a driver configured to move the elevation device in the vertical direction, an air conduit guide in an enclosure region at least partially defined by an inner surface of the elevation device and having an inner surface defining an air flow conduit, a pressure adjuster device configured to induce air flow through the air flow conduit based on inducing a pressure gradient between the air flow conduit and the pressure adjuster device, and a flow guide in the air flow conduit and configured to control a flow of air through at least a portion of the air flow conduit.

Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

Abstract: According to the present invention, oxidized and reduced regions of graphene can be accurately detected in a short time using a terahertz wave so as to measure the conductivity of graphene, and thus the time required to test the conductivity of graphene can be reduced. In addition, when an oxidized region exists in graphene, the oxidized region can be immediately reduced by irradiating an electromagnetic wave thereto so as to increase the conductivity of graphene and thus minimize the time required to restore graphene.

Abstract: A method of and apparatus for cleaning a semiconductor chip, the method including applying a first polar composition to a protection layer on a surface of at least one semiconductor chip to remove a particle from the surface of the at least one semiconductor chip and suspend the particle in the first polar composition; and applying a second polar composition, having a surface tension that is lower than that of the first polar composition, to a central portion of the applied first polar composition to push the first polar composition and the particle toward an outskirt of the at least one semiconductor chip.

Abstract: A die ejector includes a supporter configured to support a film on which a die is attached in a vertical direction, an elevation device in a hole of the supporter and configured to move the film with the die attached thereon in the vertical direction and in relation to the supporter, a driver configured to move the elevation device in the vertical direction, an air conduit guide in an enclosure region at least partially defined by an inner surface of the elevation device and having an inner surface defining an air flow conduit, a pressure adjuster device configured to induce air flow through the air flow conduit based on inducing a pressure gradient between the air flow conduit and the pressure adjuster device, and a flow guide in the air flow conduit and configured to control a flow of air through at least a portion of the air flow conduit.

Abstract: A method of preparing a structure, more particularly, a method of preparing a structure capable of ensuring a space for carrying an electrode active material by a simple method which includes an electrospinning process using a double nozzle electrospinning device and a heat treatment process.

Abstract: According to the present invention, oxidized and reduced regions of graphene can be accurately detected in a short time using a terahertz wave so as to measure the conductivity of graphene, and thus the time required to test the conductivity of graphene can be reduced. In addition, when an oxidized region exists in graphene, the oxidized region can be immediately reduced by irradiating an electromagnetic wave thereto so as to increase the conductivity of graphene and thus minimize the time required to restore graphene.

Abstract: Disclosed are an apparatus and a method for non-contact sample analysis using terahertz waves. The apparatus includes an emission unit radiating terahertz waves onto a sample provided with a conductive material layer, and a receiving unit receiving terahertz waves reflected from the sample or terahertz waves passing through the sample.

Abstract: According to the present invention, oxidized and reduced regions of graphene can be accurately detected in a short time using a terahertz wave so as to measure the conductivity of graphene, and thus the time required to test the conductivity of graphene can be reduced. In addition, when an oxidized region exists in graphene, the oxidized region can be immediately reduced by irradiating an electromagnetic wave thereto so as to increase the conductivity of graphene and thus minimize the time required to restore graphene.

Abstract: Disclosed are an apparatus and a method for non-contact sample analysis using terahertz waves. The apparatus includes an emission unit radiating terahertz waves onto a sample provided with a conductive material layer, and a receiving unit receiving terahertz waves reflected from the sample or terahertz waves passing through the sample.

Abstract: An electrode catalyst for a fuel cell, the electrode catalyst including a catalyst particle including palladium, gallium, and cerium.

Abstract: An electrode catalyst for a fuel cell, the electrode catalyst including a catalyst particle including palladium, gallium, and cerium.

Abstract: An apparatus coats a semiconductor wafer with photoresist that is to be etched in the manufacture of the semiconductor. The apparatus includes a body having an open top, a spin chuck for revolving a wafer fixed thereon at a uniform rate, a bowl for preventing photoresist from spattering on the body and which is installed inside the body, a photoresist dispensing nozzle for spraying photoresist on the wafer, a side rinse nozzle for removing photoresist adhered to the peripheral edge of the wafer, a cover for opening/closing the top of the body, and a cleaning device associated with the cover for cleaning the bowl. The apparatus allows the bowl to be cleaned while the cover is closed and the bowl is still disposed inside the body. The cleaning device includes a sprinkler and a pump.

Abstract: A developing solution feed system for a semiconductor photolithography process feeds the developing solution while removing any gas contained in the solution at a high solution feed pressure. The developing solution feed system has a plurality of feed tanks and a developing solution feed line having a plurality of first connecting pipes, each connected to the feed tanks, a second connecting pipe connected to the first connecting pipe to be converged into one passage, and a plurality of third connecting pipes branching out from the second connecting pipe.