Patents by Inventor Sung Hyup Kim

Sung Hyup Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210120603
    Abstract: A method of controlling, by using a mobile terminal, at least one Bluetooth Low Energy (BLE) device is provided. The method includes searching for at least one BLE device, displaying a BLE device list, including the at least one searched for BLE device, on a display unit of the mobile terminal, receiving an input of selection of a BLE device from the BLE device list, receiving an input of user added information from a user regarding the selected BLE device, and mapping and storing property information and the user added information regarding the selected BLE device.
    Type: Application
    Filed: December 28, 2020
    Publication date: April 22, 2021
    Inventors: Ju-youn LEE, Sang-hyup LEE, Min-jeong KO, Kwang-choon KIM, Jung-won SUH, Seung-hyuck SHIN, Sung-jin YOON
  • Patent number: 10971379
    Abstract: A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: April 6, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-hyung Kim, Sung-hyup Kim, Tae-yeong Kim
  • Patent number: 10937670
    Abstract: A megasonic cleaner includes a water tank that includes a pair of opposite inner walls and a bottom wall connected thereto, and that accommodates a fluid therein; a plurality of supporting units arranged in the water tank at predetermined positions that support a wafer; and at least one transducer arranged on the bottom wall that transmits energy in the form of waves into the fluid, where each of the opposite inner walls has a first protrusion that protrudes into an internal space of the water tank, the first protrusion being spaced above the bottom wall and positioned at an height that is greater than or equal to a height of the centers of the plurality of supporting units.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: March 2, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung-Yong Park, Sung-Hyup Kim, Sung-Gwang Lee, Kwang-Sung Lee
  • Patent number: 10811381
    Abstract: A wafer to wafer bonding method includes performing a plasma process on a bonding surface of a first wafer, pressurizing the first wafer after performing the plasma process on the bonding surface of the first wafer, and bonding the first wafer to a second wafer. The plasma process has different plasma densities along a circumferential direction about a center of the first wafer. A middle portion of the first wafer protrudes after pressurizing the first wafer. The first wafer is bonded to the second wafer by gradually joining the first wafer to the second wafer from the middle portion of the first wafer to a peripheral region of the first wafer.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: October 20, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joon-Ho Lee, Sung-Hyup Kim, Ki-Ju Sohn
  • Patent number: 10811287
    Abstract: A spin coater includes a rotatable chuck structure configured to hold a substrate, a bowl enclosing the substrate and guiding a flow of a fluid around the substrate to a bottom of the bowl, and a flow controller detachably coupled to the bowl such that the flow controller is arranged between the bowl and an edge of the substrate and separates the flow into a linear flow and a non-linear flow.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: October 20, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun-Joo Jeon, Sung-Hyup Kim
  • Patent number: 10763243
    Abstract: A substrate bonding apparatus and a method of bonding substrates, the apparatus including an upper chuck securing a first substrate onto a lower surface thereof such that the first substrate is downwardly deformed into a concave surface profile; a lower chuck arranged under the upper chuck and securing a second substrate onto an upper surface thereof such that the second substrate is upwardly deformed into a convex surface profile; and a chuck controller controlling the upper chuck and the lower chuck to secure the first substrate and the second substrate, respectively, and generating a shape parameter for changing a shape of the second substrate to the convex surface profile from a flat surface profile.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: September 1, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jun-Hyung Kim, Sung-Hyup Kim, Kyeong-Bin Lim, Seok-Ho Kim, Tae-Yeong Kim
  • Publication number: 20200070223
    Abstract: A jig configured to clean a bowl of a spin coater includes a base disposed on a spin chuck of the spin coater, the base being configured to rotate by the spin chuck. The jig further includes a guide member extending in a first direction from an edge portion of the base toward an inner cover of the bowl and configured to guide a lower cleaning agent injected to a lower surface of the base to the inner cover of the bowl. The inner cover of the bowl is configured to receive photoresist from under the spin chuck.
    Type: Application
    Filed: April 4, 2019
    Publication date: March 5, 2020
    Applicant: SEMES CO., LTD.
    Inventors: Hyun-Joo JEON, Dae-Sung KIM, Seung-Han LEE, Sung-Hyup KIM
  • Publication number: 20200075360
    Abstract: A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substrate susceptor and the substrate holder.
    Type: Application
    Filed: July 10, 2019
    Publication date: March 5, 2020
    Inventors: Jun-hyung KIM, Sung-hyup KIM, Tae-yeong KIM
  • Publication number: 20200070300
    Abstract: A chemical mechanical polishing apparatus includes a polishing head, including a polishing head body, a membrane attached to a lower portion of the polishing head body, and a reflector disposed between the polishing head body and the membrane, a platen including an opening, an emitter disposed below the opening of the platen, the emitter configured to emit terahertz waves, a detector disposed below the opening of the platen, the detector configured to receive the terahertz waves emitted by the emitter and reflected by the reflector, and an analyzer configured to analyze an electrical signal generated by converting the terahertz waves received by the detector, the analyzer configured to determine a polishing end point.
    Type: Application
    Filed: February 6, 2019
    Publication date: March 5, 2020
    Inventors: Eun Kyung HONG, Nam Il KOO, Ji Min LEE, Sung Hyup KIM, Sang Yeon OH, Ik Seon JEON, Ji Min CHOI
  • Publication number: 20200043884
    Abstract: A wafer to wafer bonding method includes performing a plasma process on a bonding surface of a first wafer, pressurizing the first wafer after performing the plasma process on the bonding surface of the first wafer, and bonding the first wafer to a second wafer. The plasma process has different plasma densities along a circumferential direction about a center of the first wafer. A middle portion of the first wafer protrudes after pressurizing the first wafer. The first wafer is bonded to the second wafer by gradually joining the first wafer to the second wafer from the middle portion of the first wafer to a peripheral region of the first wafer.
    Type: Application
    Filed: February 6, 2019
    Publication date: February 6, 2020
    Inventors: JOON-HO LEE, Sung-Hyup Kim, Ki-Ju Sohn
  • Publication number: 20200020610
    Abstract: A semiconductor device including: a substrate; a via which penetrates the substrate; a via insulating film formed along an inner wall of the via; and a core plug which fills the via, wherein a residual stress of the via insulating film is 60 MPa to ?100 MPa.
    Type: Application
    Filed: February 1, 2019
    Publication date: January 16, 2020
    Inventors: KYEONG BIN LIM, Sung Hyup KIM, Hyo Ju KIM, Ho Chang LEE, Jeong Min NA
  • Publication number: 20200020562
    Abstract: A vacuum chuck for bonding substrates includes a chucking plate including vacuum holes to hold the substrate, partitions arranged in the chucking plate, the partitions dividing the chucking plate into regions, and a temperature control member in each one of the regions, the temperature control member to independently control temperature in each of the regions to selectively expand or contract portions of the substrate in contact with each of the regions.
    Type: Application
    Filed: January 11, 2019
    Publication date: January 16, 2020
    Inventors: Ki-Ju SOHN, Sung-Hyup KIM
  • Publication number: 20200013643
    Abstract: A wafer bonding apparatus includes a first bonding chuck to fix a first wafer on a first surface thereof, a second bonding chuck to fix a second wafer on a second surface thereof facing the first surface, a bonding initiation member at a center of the first bonding chuck to push the first wafer towards the second surface, and a membrane member including a protrusion protruding from a center portion of the second surface towards the first surface, and a planar portion defining the protrusion on an outer region surrounding the center portion.
    Type: Application
    Filed: February 15, 2019
    Publication date: January 9, 2020
    Inventors: Jun-hyung KIM, Sung-hyup KIM, Tae-yeong KIM
  • Publication number: 20190189593
    Abstract: A substrate bonding apparatus and a method of bonding substrates, the apparatus including an upper chuck securing a first substrate onto a lower surface thereof such that the first substrate is downwardly deformed into a concave surface profile; a lower chuck arranged under the upper chuck and securing a second substrate onto an upper surface thereof such that the second substrate is upwardly deformed into a convex surface profile; and a chuck controller controlling the upper chuck and the lower chuck to secure the first substrate and the second substrate, respectively, and generating a shape parameter for changing a shape of the second substrate to the convex surface profile from a flat surface profile.
    Type: Application
    Filed: September 19, 2018
    Publication date: June 20, 2019
    Inventors: Jun-Hyung KIM, Sung-Hyup KIM, Kyeong-Bin LIM, Seok-Ho KIM, Tae-Yeong KIM
  • Publication number: 20190157116
    Abstract: A spin coater includes a rotatable chuck structure configured to hold a substrate, a bowl enclosing the substrate and guiding a flow of a fluid around the substrate to a bottom of the bowl, and a flow controller detachably coupled to the bowl such that the flow controller is arranged between the bowl and an edge of the substrate and separates the flow into a linear flow and a non-linear flow.
    Type: Application
    Filed: September 12, 2018
    Publication date: May 23, 2019
    Inventors: HYUN-JOO JEON, SUNG-HYUP KIM
  • Patent number: 10295564
    Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: May 21, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Yong Park, Sang-Boo Kang, Jae-Geun Kim, Sung-Hyup Kim, Jeong-Min Na, Jae-Hyoung Park, Sang-Kyu Yoo, Jae-Hoon Joo
  • Publication number: 20190013218
    Abstract: A megasonic cleaner includes a water tank that includes a pair of opposite inner walls and a bottom wall connected thereto, and that accommodates a fluid therein; a plurality of supporting units arranged in the water tank at predetermined positions that support a wafer; and at least one transducer arranged on the bottom wall that transmits energy in the form of waves into the fluid, where each of the opposite inner walls has a first protrusion that protrudes into an internal space of the water tank, the first protrusion being spaced above the bottom wall and positioned at an height that is greater than or equal to a height of the centers of the plurality of supporting units.
    Type: Application
    Filed: January 12, 2018
    Publication date: January 10, 2019
    Inventors: Sung-Yong Park, Sung-Hyup Kim, Sung-Gwang Lee, Kwang-Sung Lee
  • Publication number: 20180017595
    Abstract: An apparatus for clamping a probe card may include a body portion, an inner clamping portion and a plurality of outer clamping portions. The body portion may be arranged between a printed circuit board (PCB) of the probe card and a test head. The inner clamping portion may be integrally formed with an upper surface of the body portion. The inner clamping portion may be configured to affix a central portion of the PCB to the test head. The outer clamping portions may be integrally formed with side surfaces of the body portion. The outer clamping portions may be configured to affix a portion surrounding the central portion of the PCB to the test head. Thus, a contact area between the clamping apparatus and the PCB may be increased.
    Type: Application
    Filed: January 17, 2017
    Publication date: January 18, 2018
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung-Yong PARK, Sang-Boo KANG, Jae-Geun KIM, Sung-Hyup KIM, Jeong-Min NA, Jae-Hyoung PARK, Sang-Kyu YOO, Jae-Hoon JOO
  • Patent number: 9791855
    Abstract: A semiconductor process management system is provided. The semiconductor process management system includes a communicator that receives a process recipe from one or more process apparatuses and receives a measured value for each sampling point from one or more measuring apparatus, and a first determination unit that establishes a mutual influence model between the process recipe and the measured value for each sampling point based on the process recipe and the measured value for each sampling point.
    Type: Grant
    Filed: May 21, 2015
    Date of Patent: October 17, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong-hoon Han, Jai-hyung Won, Do-hyung Kim, Sung-hyup Kim, Ho-jun Kim
  • Publication number: 20150346709
    Abstract: A semiconductor process management system is provided. The semiconductor process management system includes a communicator that receives a process recipe from one or more process apparatuses and receives a measured value for each sampling point from one or more measuring apparatus, and a first determination unit that establishes a mutual influence model between the process recipe and the measured value for each sampling point based on the process recipe and the measured value for each sampling point.
    Type: Application
    Filed: May 21, 2015
    Publication date: December 3, 2015
    Inventors: Dong-hoon Han, Jai-hyung Won, Do-hyung Kim, Sung-hyup Kim, Ho-jun Kim