Patents by Inventor Sung II Kang

Sung II Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same
    Patent number: 10811302
    Abstract: A method of manufacturing a semiconductor package substrate includes forming a trench and a post by etching an upper surface of a base substrate including a conductive material, filling the trench with a resin, removing the resin exposed to outside of the trench such that an upper surface of the post and an upper surface of the resin are at same level, forming a conductive layer on an entire area of the upper surface of the post and the upper surface of the resin, and forming a circuit wiring including an upper circuit wiring and a lower circuit wiring by simultaneously patterning the conductive layer and a lower surface of the base substrate.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: October 20, 2020
    Assignee: HAESUNG DS CO., LTD.
    Inventors: Sung II Kang, In Seob Bae, Jea Won Kim