Abstract: A semiconductor device includes a substrate, a first active pattern disposed on the substrate, a second active pattern stacked on the first active pattern, a first gate structure extending to intersect the first active pattern and the second active pattern, a second gate structure spaced apart from the first gate structure and extending to intersect the first active pattern and the second active pattern, a first epitaxial pattern interposed between the first gate structure and the second gate structure, and connected to the first active pattern, a second epitaxial pattern interposed between the first gate structure and the second gate structure, and connected to the second active pattern, an insulating pattern interposed between the first epitaxial pattern and the second epitaxial pattern, and a semiconductor film interposed between the insulating pattern and the second epitaxial pattern, the semiconductor film extending along a top surface of the insulating pattern.

Abstract: Provided is a method of manufacturing a transparent circuit substrate for a touch screen. The method may involve forming an electrode layer on a transparent substrate, stacking a light shielding layer on the transparent substrate such that the light shielding layer is located on an outside of the electrode layer, stacking a mask on the light shielding layer and the electrode layer, forming a conductive layer on the mask, forming connecting lines for connecting the electrode layer and connecting terminals by removing the mask and a portion of the conductive layer, and forming the connecting terminals on the light shielding layer such that the connecting terminals contact the connecting lines.

Abstract: Provided herein is a capacitive-type touch panel. The capacitive-type touch panel may include a first transparent substrate, a first conductive layer positioned on the first transparent substrate, a sensor layer having a second conductive layer spaced from the first conductive layer by a spacer, and a second transparent substrate positioned on the sensor layer. The first conductive layer and the second conductive layer may be transparent.

Abstract: A polymer electrolyte including a polymer fiber having a nanoscale diameter, wherein the polymer fiber is fabricated by an electrospinning method and a solar cell device exhibiting high energy conversion efficiency using the same. The solid-state electrolyte comprising such nanosized polymer fiber does not need a sealing agent and further simplifies the entire process compared to a conventional dye-sensitized solar cell using liquid electrolytes. Specifically, the energy conversion efficiency of the present dye-sensitized solar cell is significantly superior to that of a dye-sensitized solar cell using a polymer film electrolyte fabricated by a spin coating method. Further, the present dye-sensitized solar cell device can be obtained by using a scattering layer and compensating the surface effect.

Abstract: Provided is a method of manufacturing a transparent circuit substrate for a touch screen. The method may involve forming an electrode layer on a transparent substrate, stacking a light shielding layer on the transparent substrate such that the light shielding layer is located on an outside of the electrode layer, stacking a mask on the light shielding layer and the electrode layer, forming a conductive layer on the mask, forming connecting lines for connecting the electrode layer and connecting terminals by removing the mask and a portion of the conductive layer, and forming the connecting terminals on the light shielding layer such that the connecting terminals contact the connecting lines.

Abstract: Provided is a method of manufacturing a transparent circuit substrate for a touch screen. The method may involve forming an electrode layer on a transparent substrate, stacking a light shielding layer on the transparent substrate such that the light shielding layer is located on an outside of the electrode layer, stacking a mask on the light shielding layer and the electrode layer, forming a conductive layer on the mask, forming connecting lines for connecting the electrode layer and connecting terminals by removing the mask and a portion of the conductive layer, and forming the connecting terminals on the light shielding layer such that the connecting terminals contact the connecting lines.

Abstract: Provided is a method of manufacturing a transparent circuit substrate for a touch screen. The method may involve forming an electrode layer on a transparent substrate, stacking a light shielding layer on the transparent substrate such that the light shielding layer is located on an outside of the electrode layer, stacking a mask on the light shielding layer and the electrode layer, forming a conductive layer on the mask, forming connecting lines for connecting the electrode layer and connecting terminals by removing the mask and a portion of the conductive layer, and forming the connecting terminals on the light shielding layer such that the connecting terminals contact the connecting lines.

Abstract: Provided is a touch screen that includes a first sensor layer and a second sensor layer. The first sensor layer and the second sensor layer form a sensor for recognizing a touch position on the touch screen.

Abstract: A polymer electrolyte including a polymer fiber having a nanoscale diameter, wherein the polymer fiber is fabricated by an electrospinning method and a solar cell device exhibiting high energy conversion efficiency using the same. The solid-state electrolyte comprising such nanosized polymer fiber does not need a sealing agent and further simplifies the entire process compared to a conventional dye-sensitized solar cell using liquid electrolytes. Specifically, the energy conversion efficiency of the present dye-sensitized solar cell is significantly superior to that of a dye-sensitized solar cell using a polymer film electrolyte fabricated by a spin coating method. Further, the present dye-sensitized solar cell device can be obtained by using a scattering layer and compensating the surface effect.

Abstract: Provided an error compensating method for an instrument transformer, in which an error of an instrument transformer is compensated by reflecting hysteresis characteristics of iron core. When such error compensation is performed, a hysteresis loop indicating the relationship between magnetic flux and excitation current is not used as it is, but core-loss resistances and magnetic flux-excitation current curves are used, thereby achieving more precise compensation. According to the present invention, an error of an instrument transformer can be significantly reduced. Therefore, it is possible to manufacture an instrument transformer with high accuracy and to significantly reduce the size of the instrument transformer. Further, a material with high permeability does not need to be used in order to increase the accuracy.

Abstract: An apparatus for and a method of heat-treating a wafer for use in producing a semiconductor device ensures a desired distribution of surface temperatures across the wafer. Spacers are used to space the wafer above a heat transfer plate. The spacers can be used to adjust the spacing and inclination of the wafer relative to the heat transfer plate by predetermined amounts determined in advance to produce the desired distribution of surface temperatures across the wafer during heat-treatment. With the present invention, wafers can be heat-treated during production using a plurality of bake units disposed in parallel because each of the bake units can be precisely adjusted using the spacers to produce surface temperature distributions similar to a standard surface temperature distribution. Accordingly, the productivity of the semiconductor manufacturing process can be markedly enhanced.

Abstract: An apparatus for and a method of heat-treating a wafer for use in producing a semiconductor device ensures a desired distribution of surface temperatures across the wafer. Spacers are used to space the wafer above a heat transfer plate. The spacers can be used to adjust the spacing and inclination of the wafer relative to the heat transfer plate by predetermined amounts determined in advance to produce the desired distribution of surface temperatures across the wafer during heat-treatment. With the present invention, wafers can be heat-treated during production using a plurality of bake units disposed in parallel because each of the bake units can be precisely adjusted using the spacers to produce surface temperature distributions similar to a standard surface temperature distribution. Accordingly, the productivity of the semiconductor manufacturing process can be markedly enhanced.