Patents by Inventor Sung-Il Oh

Sung-Il Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128603
    Abstract: The present invention relates to an electrode tab welding apparatus for welding electrode tabs of a pouch-shaped battery to each other in a state of gathering the electrode tabs using tab guides in a preliminary welding step of welding the electrode tabs to each other before welding the electrode tabs and an electrode lead of the pouch-shaped battery to each other and an electrode tab welding method using the same.
    Type: Application
    Filed: October 25, 2021
    Publication date: April 18, 2024
    Applicant: LG Energy Solution, Ltd.
    Inventors: Sang Hun Kim, Sung Hun Oh, Jeong Jin Ban, Tae Jong Kim, Sun Il Lee
  • Publication number: 20240112002
    Abstract: Disclosed is an interface system including a first neuron cluster that outputs a first neuron signal including a first neuron request and first neuron data by performing a first arithmetic operation, and a first interface circuit that stores the first neuron data and outputs a first response, in response to the first neuron request. The first neuron cluster outputs a second neuron signal including a second neuron request and second neuron data by performing a second arithmetic operation, in response to the first response. Before the first data is transmitted to a second neuron cluster different from the first neuron cluster, the first interface circuit outputs the first response in response to a fact that the first neuron data is stored.
    Type: Application
    Filed: June 29, 2023
    Publication date: April 4, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Sung Eun KIM, Tae Wook KANG, Hyuk KIM, Young Hwan BAE, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE, In San JEON
  • Publication number: 20240104962
    Abstract: Disclosed are a fingerprint forgery detection device and a method of operating the same. The fingerprint forgery detection device includes a memory that stores a first feature signal including biological channel feature information of a user, a transmitter including at least one transmission electrode for transmitting a pulse signal to the user, a receiver including at least one reception electrode for receiving a biological channel response signal in response to the transmitted pulse signal, and a signal processor for processing the biological channel response signal to detect whether a fingerprint is forged, and at least one processor that controls the memory, the transmitter, and the receiver.
    Type: Application
    Filed: June 23, 2023
    Publication date: March 28, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Tae Wook KANG, Sung Eun KIM, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE
  • Publication number: 20240097799
    Abstract: Disclosed is an amplification circuit, which includes a first amplifier that receives an external signal and performs first band pass filtering on the external signal to output a first filter signal, and a second amplifier that receives the first filter signal and performs second band pass filtering on the first filter signal to output a second filter signal, and a frequency pass bandwidth of the second band pass filtering is narrower than a frequency pass bandwidth of the first band pass filtering.
    Type: Application
    Filed: June 26, 2023
    Publication date: March 21, 2024
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Sung Eun KIM, Tae Wook KANG, Hyuk KIM, Kyung Hwan PARK, Mi Jeong PARK, Hyung-IL PARK, Kyung Jin BYUN, Kwang IL OH, Jae-Jin LEE, In Gi LIM
  • Patent number: 11923882
    Abstract: A hybrid communication device, an operation method thereof, and a communication system including the same are provided. The hybrid communication device includes a contact unit that includes an antenna for receiving a first communication signal and an electrode for receiving a second signal, a switch controller that includes a first switch and a second switch and controls the first switch and the second switch based on a change in capacitance of the electrode, and a signal processing unit that receives at least one of the first communication signal and the second communication signal from the contact unit via the first switch and processes the received signal. The first switch is connected to the contact unit, and the signal processing unit is connected to the first switch.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: March 5, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Tae Wook Kang, Sung Eun Kim, Hyung-Il Park, Jae-Jin Lee, Hyuk Kim, Kyung Hwan Park, Mi Jeong Park, Kyung Jin Byun, Kwang Il Oh, In Gi Lim
  • Publication number: 20160141116
    Abstract: There is provided an electronic component including: a ceramic body; internal electrodes formed within the ceramic body; and external electrodes electrically connected to the internal electrodes, formed on external surfaces of the ceramic body, and including a metal powder having nano protrusions formed of an organic metal on a surface of a metal particle.
    Type: Application
    Filed: November 4, 2015
    Publication date: May 19, 2016
    Inventors: Kwi Jong LEE, Sung Il OH
  • Publication number: 20140049874
    Abstract: There is provided an electronic component including: a ceramic body; internal electrodes formed within the ceramic body; and external electrodes electrically connected to the internal electrodes, formed on external surfaces of the ceramic body, and including a metal powder having nano protrusions formed of an organic metal on a surface of a metal particle.
    Type: Application
    Filed: December 17, 2012
    Publication date: February 20, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwi Jong LEE, Sung Il OH
  • Publication number: 20140023779
    Abstract: There are provided a conductive copper paste composition and a method of forming a metal thin film using the same, wherein the conductive copper paste composition includes a back bone chain particle formed of copper (Cu) or a copper alloy containing copper (Cu); and an organic copper compound, have excellent electrical characteristics even at the time of low-temperature heat treatment process and suppress an increase in a viscosity depending on the time.
    Type: Application
    Filed: March 15, 2013
    Publication date: January 23, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Il OH, Kwi Jong LEE, Dong Hoon KIM
  • Publication number: 20120220072
    Abstract: Provided is a copper nano paste that can be calcined at a relatively low temperature. The copper nano paste includes: a binder added in an amount of 0.1 to 30 parts by weight; an additive added in an amount of not more than 10 parts by weight; and copper particles added in an amount of 1 to 95 parts by weight, wherein the copper particles have a particle size of 150 nm or less, and the surfaces of the copper particles are coated with a capping material.
    Type: Application
    Filed: December 5, 2011
    Publication date: August 30, 2012
    Inventors: Dong Hoon KIM, Sung Il Oh, Sung Koo Kang, Byung Ho Jun, Young Ah Song, Seong Jin Kim, Byoung Jin Chun
  • Patent number: 8216635
    Abstract: Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.
    Type: Grant
    Filed: July 15, 2009
    Date of Patent: July 10, 2012
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Ah Song, Young Chang Joo, Ji Hoon Lee, Seol Min Yi, Jae Woo Joung, Sung Il Oh, Tae Hoon Kim, In Young Kim
  • Publication number: 20120168201
    Abstract: There are provided a method of fabricating a thin metal film electrode and a thin metal film electrode fabricated by the same. The method of fabricating a thin metal film electrode according to an embodiment of the present invention includes applying a metal paste including a metal powder and a dispersant to a substrate to form a thin metal film; and subjecting the thin metal film to reduction firing in an atmosphere containing an organic acid and an aqueous solution in a ratio ranging from 10:90 to 90:10.
    Type: Application
    Filed: August 31, 2011
    Publication date: July 5, 2012
    Inventors: Young Ah SONG, Byoung Jin Chun, Dong Hoon Kim, Sung Il Oh
  • Publication number: 20120111401
    Abstract: There are provided a solar cell and a method of manufacturing the same. The solar cell includes: a solar cell unit absorbing sunlight to generate electricity; a surface treatment layer formed on at least one of upper and lower surfaces of the solar cell unit by a condensation reaction of a compound having a functional group —Y having a lone pair and an alkoxy group —OR; and a metal electrode layer bonded to the functional group —Y having the lone pair of the surface treatment layer. The solar cell has excellent energy conversion efficiency.
    Type: Application
    Filed: July 26, 2011
    Publication date: May 10, 2012
    Inventors: Sung Koo KANG, Young Ah Song, Sung Il Oh, Byoung Jin Chun, Dong Hoon Kim
  • Publication number: 20110308844
    Abstract: Disclosed herein is a conductive electrode pattern used as an electrode of a solar cell. The conductive electrode pattern includes a lower metal layer and an upper metal layer vertically disposed on a substrate, wherein any one of the lower metal layer and the upper metal layer includes silver (Ag) and the other one of the lower metal layer and the upper metal layer includes a metal of transition metals, different from that of the lower metal layer.
    Type: Application
    Filed: November 10, 2010
    Publication date: December 22, 2011
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyoung-Jin Jeong, Sung Il Oh, Jae Woo Joung, Da Mi Shim
  • Publication number: 20110312123
    Abstract: Disclosed herein is a conductive electrode pattern used as an electrode of a solar cell. The conductive electrode pattern includes a lower metal layer and an upper metal layer vertically disposed on a substrate, wherein any one of the lower metal layer and the upper metal layer includes silver (Ag) and the other one of the lower metal layer and the upper metal layer includes a metal of transition metals, different from that of the lower metal layer.
    Type: Application
    Filed: November 10, 2010
    Publication date: December 22, 2011
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kyoung-Jin Jeong, Seong Jin Kim, Sung Il Oh, Jae Woo Joung
  • Publication number: 20110134181
    Abstract: An inkjet printer includes: a cartridge body provided with an ink chamber; a head unit coupled to a bottom surface of the cartridge body and provided with nozzles for jetting ink; and an energy irradiation unit coupled to the cartridge body so as to irradiate energy onto the ink jetted from the nozzles of the head unit.
    Type: Application
    Filed: July 16, 2010
    Publication date: June 9, 2011
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Il Oh, Dong Hoon Kim, Byoung Jin Chun, Su Hwan Cho
  • Patent number: 7916450
    Abstract: A ceramic slurry composition includes 20˜50 wt. % of a ceramic powder, 2˜10 wt. % of a polymer having average molecular weight of 400,000 or more, 0.1˜2 wt. % of a polymer having hydrogen bond-forming functional groups, and 40˜75 wt. % of a solvent. If necessary, the ceramic slurry composition further includes 1˜5 wt. % of a polymer having weight average molecular weight of 400,000 or less.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: March 29, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Sung Il Oh
  • Patent number: 7910010
    Abstract: An inkjet head having an electrostatic actuator and a manufacturing method of the same are disclosed. The inkjet head having an electrostatic actuator, comprising a stator, on which is formed a plurality of comb pattern shaped first protrusion parts and second protrusion parts in both directions, and a rotor consisting of a first component and a second component, the ends of which join with the diaphragm, wherein a third protrusion part is formed on the first component, facing the first protrusion parts and meshing with the first protrusion parts without contact; and a fourth protrusion part is formed on the second component, facing the second protrusion parts and meshing with the second protrusion parts without contact, may decrease the size of the head composition and may increase the electrostatic force so that a large displacement may be obtained with little voltage to increase the ink discharge pressure.
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: March 22, 2011
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young-Jae Kim, Jae-Seong Lim, Sung-Il Oh
  • Patent number: 7878470
    Abstract: A motorized mount attaches a monitor to a wall and is able is able to reposition the angle of a monitor through motorized action. The motorized mount can extend the and then swivel and/or tilt the monitor.
    Type: Grant
    Filed: November 21, 2006
    Date of Patent: February 1, 2011
    Inventors: Sung Il Oh, Byung Ju Yi, Gyu Chang Kim
  • Publication number: 20100209619
    Abstract: A method for manufacturing a printed wiring board having one or more layers of a conductive pattern and an insulating pattern, including forming an insulating pattern on an insulating substrate; semi-hardening at least one of the insulating substrate and the insulating pattern; forming a conductive pattern on the insulating substrate and/or the insulating pattern, thereby providing a stack structure; performing a thermal treatment on the stack structure to fully harden the semi-hardened insulating substrate and/or insulating pattern; and firing the conductive pattern. In the method, the conductive pattern and the insulating pattern are simultaneously formed on the same layer using an inkjet process.
    Type: Application
    Filed: March 30, 2010
    Publication date: August 19, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hye Jin Cho, Jae Woo Joung, Sung Il Oh
  • Publication number: 20100196681
    Abstract: Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.
    Type: Application
    Filed: July 15, 2009
    Publication date: August 5, 2010
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ah SONG, Young Chang Joo, Ji Hoon Lee, Seol Min Yi, Jae Woo Joung, Sung Il Oh, Tae Hoon Kim, In Young Kim