Abstract: Disclosed is a wake-up circuit including a preprocessing unit that generates a first signal by removing noise from an input signal, a comparison unit that generates a second signal based on the first signal and weight data, an output circuit that generates a power signal based on the second signal and an initialization signal, and a micro control unit (MCU) that generates the initialization signal based on a state signal received from the output circuit. The comparison unit includes a spike neuron network structure that generates the second signal by applying the weight data to the first signal. The output circuit supplies power to an external sensor node in response to the power signal.

Abstract: Disclosed is an operating method of a user communication device, which includes receiving a wakeup signal from a stationary communication device over a first human body communication channel, the wakeup signal having a frequency in a low frequency band, switching from a standby mode to a wakeup mode in response to the wakeup signal, and receiving a data signal from the stationary communication device over the first human body communication channel during the wakeup mode, and the first human body communication channel is provided by a body of a user of the user communication device.

Abstract: There is provided an electronic component including: a ceramic body; internal electrodes formed within the ceramic body; and external electrodes electrically connected to the internal electrodes, formed on external surfaces of the ceramic body, and including a metal powder having nano protrusions formed of an organic metal on a surface of a metal particle.

Abstract: There is provided an electronic component including: a ceramic body; internal electrodes formed within the ceramic body; and external electrodes electrically connected to the internal electrodes, formed on external surfaces of the ceramic body, and including a metal powder having nano protrusions formed of an organic metal on a surface of a metal particle.

Abstract: There are provided a conductive copper paste composition and a method of forming a metal thin film using the same, wherein the conductive copper paste composition includes a back bone chain particle formed of copper (Cu) or a copper alloy containing copper (Cu); and an organic copper compound, have excellent electrical characteristics even at the time of low-temperature heat treatment process and suppress an increase in a viscosity depending on the time.

Abstract: Provided is a copper nano paste that can be calcined at a relatively low temperature. The copper nano paste includes: a binder added in an amount of 0.1 to 30 parts by weight; an additive added in an amount of not more than 10 parts by weight; and copper particles added in an amount of 1 to 95 parts by weight, wherein the copper particles have a particle size of 150 nm or less, and the surfaces of the copper particles are coated with a capping material.

Abstract: Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.

Abstract: There are provided a method of fabricating a thin metal film electrode and a thin metal film electrode fabricated by the same. The method of fabricating a thin metal film electrode according to an embodiment of the present invention includes applying a metal paste including a metal powder and a dispersant to a substrate to form a thin metal film; and subjecting the thin metal film to reduction firing in an atmosphere containing an organic acid and an aqueous solution in a ratio ranging from 10:90 to 90:10.

Abstract: There are provided a solar cell and a method of manufacturing the same. The solar cell includes: a solar cell unit absorbing sunlight to generate electricity; a surface treatment layer formed on at least one of upper and lower surfaces of the solar cell unit by a condensation reaction of a compound having a functional group —Y having a lone pair and an alkoxy group —OR; and a metal electrode layer bonded to the functional group —Y having the lone pair of the surface treatment layer. The solar cell has excellent energy conversion efficiency.

Abstract: Disclosed herein is a conductive electrode pattern used as an electrode of a solar cell. The conductive electrode pattern includes a lower metal layer and an upper metal layer vertically disposed on a substrate, wherein any one of the lower metal layer and the upper metal layer includes silver (Ag) and the other one of the lower metal layer and the upper metal layer includes a metal of transition metals, different from that of the lower metal layer.

Abstract: Disclosed herein is a conductive electrode pattern used as an electrode of a solar cell. The conductive electrode pattern includes a lower metal layer and an upper metal layer vertically disposed on a substrate, wherein any one of the lower metal layer and the upper metal layer includes silver (Ag) and the other one of the lower metal layer and the upper metal layer includes a metal of transition metals, different from that of the lower metal layer.

Abstract: An inkjet printer includes: a cartridge body provided with an ink chamber; a head unit coupled to a bottom surface of the cartridge body and provided with nozzles for jetting ink; and an energy irradiation unit coupled to the cartridge body so as to irradiate energy onto the ink jetted from the nozzles of the head unit.

Abstract: A ceramic slurry composition includes 20˜50 wt. % of a ceramic powder, 2˜10 wt. % of a polymer having average molecular weight of 400,000 or more, 0.1˜2 wt. % of a polymer having hydrogen bond-forming functional groups, and 40˜75 wt. % of a solvent. If necessary, the ceramic slurry composition further includes 1˜5 wt. % of a polymer having weight average molecular weight of 400,000 or less.

Abstract: An inkjet head having an electrostatic actuator and a manufacturing method of the same are disclosed. The inkjet head having an electrostatic actuator, comprising a stator, on which is formed a plurality of comb pattern shaped first protrusion parts and second protrusion parts in both directions, and a rotor consisting of a first component and a second component, the ends of which join with the diaphragm, wherein a third protrusion part is formed on the first component, facing the first protrusion parts and meshing with the first protrusion parts without contact; and a fourth protrusion part is formed on the second component, facing the second protrusion parts and meshing with the second protrusion parts without contact, may decrease the size of the head composition and may increase the electrostatic force so that a large displacement may be obtained with little voltage to increase the ink discharge pressure.

Abstract: A motorized mount attaches a monitor to a wall and is able is able to reposition the angle of a monitor through motorized action. The motorized mount can extend the and then swivel and/or tilt the monitor.

Abstract: A method for manufacturing a printed wiring board having one or more layers of a conductive pattern and an insulating pattern, including forming an insulating pattern on an insulating substrate; semi-hardening at least one of the insulating substrate and the insulating pattern; forming a conductive pattern on the insulating substrate and/or the insulating pattern, thereby providing a stack structure; performing a thermal treatment on the stack structure to fully harden the semi-hardened insulating substrate and/or insulating pattern; and firing the conductive pattern. In the method, the conductive pattern and the insulating pattern are simultaneously formed on the same layer using an inkjet process.

Abstract: Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.

Abstract: An ink suction apparatus is disclosed. In accordance with an embodiment of the present invention, the ink suction apparatus, which sucks in residual ink of an inkjet head, includes: a suction nozzle, which sucks in the residual ink; a heater, which is adjacent to the suction nozzle and heats the suction nozzle to prevent the suction nozzle from being blocked by the residual ink; a nozzle cover, which is installed on the suction nozzle and opens and closes the suction nozzle to control sucking power of the suction nozzle; a collection chamber, which collects the residual ink having been sucked into the suction nozzle; and a suction pump, which generates sucking power and provides the sucking power to the suction nozzle. The ink suction apparatus can prevent a suction nozzle from being blocked when sucking in hyper-viscous residual ink and control the sucking power of the suction nozzle by controlling the suction nozzle's opening and closing.

Abstract: A conductive ink composition for inkjet printing, more particularly to a conductive ink composition for inkjet printing, which includes 30 to 85 parts by weight of metal nanoparticles, 10 to 60 parts by weight of an organic solvent, 10 to 30 parts by weight of a humectant, the humectant made of a diol or glycol base compound, and 0.1 to 10 parts by weight of an ethylene glycol-based ether compound additive for adjusting viscosity. The ink composition may be optimized, such that the viscosity of the ink may be adjusted while maintaining a high concentration of metal, when forming wiring using an inkjet device, for improved flow and ejection properties of the ink.

Abstract: Disclosed are methods of forming a printed circuit pattern and forming a guide, and a guide-forming ink. The method of forming a printed circuit pattern in accordance with the present invention includes forming a guide by using guide-forming ink having a slip property, curing the formed guide by in-situ UV, and forming a printed circuit pattern on the inside of the cured guide by using metal ink.