Patents by Inventor SungJae Lim

SungJae Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961493
    Abstract: A display device including: a display panel including first through N-th pixel rows; and a panel driver configured to sequentially receive first through N-th line data for the first through the N-th pixel rows in each frame period, and to drive the display panel based on the first through the N-th line data, the panel driver including: a current control circuit configured to determine a current control value for a (K+1)-th pixel row based on the first through K-th line data for the first through K-th pixel rows received in a current frame period and (K+1)-th through the N-th line data for the (K+1)-th through the N-th pixel rows received in a previous frame period; and a data correction circuit configured to correct the (K+1)-th line data for the (K+1)-th pixel row based on the current control value in the current frame period.
    Type: Grant
    Filed: September 13, 2022
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jinho Lee, Seunghwan Park, Youngwoon Choi, Sungjae Park, Seungho Park, Kitae Yoon, Namjae Lim
  • Patent number: 11948492
    Abstract: A display device includes a display panel and a display panel driver. The display panel includes pixels. The display panel driver determines an average image load of input image data, determines an operation mode based on a grayscale value of the input image data and the average image load as a first operation mode or a second operation mode, applies a first scale factor to the input image data in the first operation mode, applies a second scale factor different from the first scale factor to the input image data in the second operation mode, and drives the display panel.
    Type: Grant
    Filed: August 2, 2022
    Date of Patent: April 2, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jinho Lee, Sungjae Park, Seunghwan Park, Namjae Lim, Youngwoon Choi, Jong Wook Kim
  • Publication number: 20240107195
    Abstract: An image sensor comprising a pixel array in which a plurality of pixels are arranged and a row driver . Each of the pixel includes a photodiode, a transfer transistor for transferring photocharges of the photodiode to a floating diffusion node (FD), a conversion gain control transistor, a first source follower for amplifying and outputting the voltage of the FD to a first node, a precharge selection transistor connected between the first node and a second node, a first capacitor, a first sampling transistor connected between the second node and the first capacitor, a second capacitor, a second sampling transistor connected between the second node and the second capacitor, a second source follower for amplifying a voltage of the second node, a first selection transistor connected between the second source follower and a column line, and a second selection transistor connected between the first node and the column line.
    Type: Application
    Filed: August 31, 2023
    Publication date: March 28, 2024
    Inventors: Heesung Shim, Seungsik Kim, Jaekyu Lee, Seunghyun Lim, Sungjae Jun
  • Patent number: 11601791
    Abstract: Various embodiments of the present invention pertain to a method for pairing devices using near field communication and an electronic apparatus using the same.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: March 7, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sungjae Lim, Woowon Park, Jaehong Park
  • Publication number: 20210409924
    Abstract: Various embodiments of the present invention pertain to a method for pairing devices using near field communication and an electronic apparatus using the same.
    Type: Application
    Filed: March 13, 2019
    Publication date: December 30, 2021
    Inventors: Sungjae LIM, Woowon PARK, Jaehong PARK
  • Patent number: 7863761
    Abstract: An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circuit die, and the connector and minimizing ambient gas deformation of the substrate to keep the connector from touching another connector.
    Type: Grant
    Filed: August 3, 2007
    Date of Patent: January 4, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Dal Jae Lee, Nam Ju Cho, Soo-San Park, Jaepil Kim, Sungpil Hur, Hyeong Kug Jin, JongMin Han, SungJae Lim, HyoungChul Kwon
  • Publication number: 20080029873
    Abstract: An integrated circuit package system comprising: providing a substrate; attaching an integrated circuit die over the substrate; attaching a connector to the integrated circuit die and the substrate; and forming an encapsulant over the substrate, the integrated circuit die, and the connector and minimizing ambient gas deformation of the substrate to keep the connector from touching another connector.
    Type: Application
    Filed: August 3, 2007
    Publication date: February 7, 2008
    Inventors: Dal Jae Lee, Nam Ju Cho, Soo-San Park, Jaepil Kim, Sungpil Hur, Hyeong Kug Jin, JongMin Han, SungJae Lim, HyoungChul Kwon