Abstract: Biochemical carriers are provided. Each of the biochemical carriers includes: biochemical molecules having a sequence into which digital data information is encoded; a carrier particle composed of a polymer matrix and in which the biochemical molecules are connected to the surface or inside of the polymer matrix; and an index code introduced into the carrier particle. Also provided is a method for fabricating biochemical carriers. The fabrication method includes: encoding digital data into a sequence of biochemical molecules; synthesizing the biochemical molecules based on the encoded sequence; mixing the biochemical molecules with a photocurable material; curing the mixture to obtain carrier particles including a polymer matrix; and introducing an index code into the carrier particles simultaneously with or separately from the curing. Also provided is a method for restoring digital data from the biochemical carrier.

Abstract: Provided is a photomask cleaning apparatus. The apparatus may include a photomask chuck, a cleaning arm and a nozzle set. The nozzle set may be installed in an end portion of the cleaning arm. The nozzle set may include a first nozzle and a second nozzle. The first nozzle and the second nozzle may be a bar-type shape and parallel to each other.

Abstract: A system for photolithography may include an exposure chamber providing a first isolated environment, an exposure stage in the exposure chamber, a radiation source, an interface chamber providing a second isolated environment, a port, a post exposure bake heater in the interface chamber, and a wafer handler. The exposure stage may be configured to receive a wafer having photoresist thereon to be exposed, and the radiation source may be configured to provide exposing radiation to the wafer being exposed. The port may be configured to allow wafer transport between the first and second isolated environments of the exposure and interface chambers, and the post exposure bake heater may be configured to bake the wafer after exposure.

Abstract: A system for photolithography may include an exposure chamber providing a first isolated environment, an exposure stage in the exposure chamber, a radiation source, an interface chamber providing a second isolated environment, a port, a post exposure bake heater in the interface chamber, and a wafer handler. The exposure stage may be configured to receive a wafer having photoresist thereon to be exposed, and the radiation source may be configured to provide exposing radiation to the wafer being exposed. The port may be configured to allow wafer transport between the first and second isolated environments of the exposure and interface chambers, and the post exposure bake heater may be configured to bake the wafer after exposure.