Patents by Inventor Sung Je PARK

Sung Je PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961742
    Abstract: A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: April 16, 2024
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Jong Sik Paek, Doo Hyun Park, Seong Min Seo, Sung Geun Kang, Yong Song, Wang Gu Lee, Eun Young Lee, Seo Yeon Ahn, Pil Je Sung
  • Publication number: 20240096888
    Abstract: A super-steep switching device and an inverter device using the same are disclosed. The super-steep switching device includes a semiconductor channel disposed on a substrate and made of a semiconductor material having impact ionization characteristic; a source electrode and a drain electrode in contact with the semiconductor channel, wherein the source electrode and the drain electrode are disposed on the substrate and are spaced apart from each other; and a gate electrode disposed on the semiconductor channel so as to overlap only a portion of the semiconductor channel, wherein a top surface of the semiconductor channel includes a first area overlapping the gate electrode, and a second area non-overlapping the gate electrode, wherein a ratio of a length of the first area and a length of the second area is in a range of 1:0.1 to 0.4.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 21, 2024
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Hae Ju CHOI, Tae Ho KANG, Chan Woo KANG, Hyeon Je SON, Jin Hong PARK, Sung Joo LEE, Sung Pyo BAEK
  • Patent number: 11932618
    Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: March 19, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Hong Chul Yoon, Kyung Mi An, Myong Jae Lee, Jin Hee Lee, Jeong-geun Kim, A-rang Im, Woo Jin Jeon, Jin Ah Jeong, Jaeho Heo, Changhee Hong, Kyeojin Kim, Jung-Eun Park, Te-ik Sohn, Changmok Oh, Da Hae Hong, Sung Wook Kwon, Jung Ho Kim, Jae Eui Shin, Yeongran Yoo, Min Whan Chang, Eun Hye Jang, In-gyu Je, Ji Hye Choi, Gunhee Kim, Yearin Jun
  • Patent number: 11732770
    Abstract: A mass damper for a refrigerant pipe is configured to insulate vibration and noise of the refrigerant pipe for the flow of a refrigerant circulating in a vehicle air conditioner system and a mass damper for a vehicle air conditioner system is configured to prevent an external circumferential surface of a casing from cracking due to thermal deformation.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: August 22, 2023
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Yong Han Lee, Yong Woong Cha, Sung Je Park
  • Publication number: 20220412423
    Abstract: A mass damper for a refrigerant pipe is configured to insulate vibration and noise of the refrigerant pipe for the flow of a refrigerant circulating in a vehicle air conditioner system and a mass damper for a vehicle air conditioner system is configured to prevent an external circumferential surface of a casing from cracking due to thermal deformation.
    Type: Application
    Filed: June 21, 2022
    Publication date: December 29, 2022
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Yong Han LEE, Yong Woong CHA, Sung Je PARK
  • Publication number: 20140081886
    Abstract: Disclosed is a method of providing a sectorial donation service for a small-sum donor, which is performed using a service provision server that provides a donation service to a donor, the method, comprising: opening a virtual donation foundation for which a donation field and a targeted collection amount are fixed; receiving information about a virtual donation foundation and a collection amount selected and inputted from a user terminal and registering the user as a donor when payment for the contribution amount is completed; selecting a winner among donors when the total amount of contributions reaches the targeted collection amount; receiving information about a beneficiary among donation recipients falling in the donation field of the virtual donation foundation selected in the step (2) inputted from a winner terminal of the selected winner; and (5) performing donation of the collection amount in the name of the winner to the inputted beneficiary.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 20, 2014
    Inventors: Sung Je PARK, Soo Kyo PARK