Patents by Inventor Sung-Jen Wu

Sung-Jen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250050386
    Abstract: The present invention relates to a method of cleaning relays. The method includes: a loading step by placing a relay on a feeding platform of a machine and directing a laser processing head of the machine to allow emission of laser light towards the relay; and a surface treatment step by activating the laser processing head to perform laser surface treatment on a portion of the relay to be treated. The present invention provides operators with a fast, time-saving, and efficient method for processing a large number of relays requiring surface treatment. It aims to improve upon the conventional electrolytic surface treatment techniques that are labor-intensive, time-consuming, and may have certain impacts on human health and the environment.
    Type: Application
    Filed: August 8, 2023
    Publication date: February 13, 2025
    Inventor: Sung-Jen Wu
  • Publication number: 20250053039
    Abstract: An E-paper display panel including an E-paper display layer, a first substrate, a pixel array layer, a common electrode layer, and a driving circuit is provided. The first substrate is disposed at a first side of the E-paper display layer. The pixel array substrate is disposed between the first substrate and the E-paper display layer and includes touch electrodes and driving pixels arranged in an array. Each driving pixel includes a first pixel electrode and a second pixel electrode. The touch electrodes, the first pixel electrode, and the second pixel electrode are overlapped with each other. The common electrode layer is disposed at a second side of the E-paper display layer. The first side is opposite to the second side. The driving circuit is in signal communication with the common electrode layer and the pixel array layer. The touch electrodes are individually in signal communication with the driving circuit.
    Type: Application
    Filed: July 11, 2024
    Publication date: February 13, 2025
    Applicant: E Ink Holdings Inc.
    Inventors: Chia-Ming Hsieh, Chi-Mao Hung, Sung-Hui Huang, Chuen-Jen Liu, Liang-Yu Yan, Pei Ju Wu, Po-Chun Chuang, Che-Sheng Chang, Wen-Chung Yang
  • Patent number: 12204163
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: February 5, 2024
    Date of Patent: January 21, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11688574
    Abstract: An electromagnetic relay includes a base, at least one fixed conductive sheet assembly, at least one movable conductive sheet assembly, at least one arc blow component, an electromagnet and an outer cap. The fixed conductive sheet assembly includes a fixed connecting plate and a fixed contact, and the movable conductive sheet assembly includes a movable connecting plate and a movable contact. The base is made of a thermal conductive polymer, and the fixed connecting plate has a first heat conduction part installed in the base and a second heat conduction part connected to the first heat conduction part and extended to an outer side of the base. The electromagnetic relay further includes at least two thermal conduction components installed in the base and symmetrically configured on both opposite sides of the fixed and movable contacts respectively for dissipating the heat generated by the electromagnetic relay.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: June 27, 2023
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Publication number: 20230085584
    Abstract: An electromagnetic relay includes a base, at least one fixed conductive sheet assembly, at least one movable conductive sheet assembly, at least one arc blow component, an electromagnet and an outer cap. The fixed conductive sheet assembly includes a fixed connecting plate and a fixed contact, and the movable conductive sheet assembly includes a movable connecting plate and a movable contact. The base is made of a thermal conductive polymer, and the fixed connecting plate has a first heat conduction part installed in the base and a second heat conduction part connected to the first heat conduction part and extended to an outer side of the base. The electromagnetic relay further includes at least two thermal conduction components installed in the base and symmetrically configured on both opposite sides of the fixed and movable contacts respectively for dissipating the heat generated by the electromagnetic relay.
    Type: Application
    Filed: September 13, 2021
    Publication date: March 16, 2023
    Inventor: SUNG-JEN WU
  • Publication number: 20220148834
    Abstract: A relay structure includes a case; a magnetoelectric assembly; a first leg and a second leg assembled with two ends of the magnetoelectric assembly, respectively, a magnetic conduction assembly having an end electrically connected to the magnetoelectric assembly in a normal condition, and when the magnetoelectric assembly produces electromagnetism, the magnetic conduction assembly is magnetically attracted to and abutted with other end of the magnetoelectric assembly; a driving plate assembled with the top surface of the magnetic conduction assembly; an armature assembly including conductive plates stacked with each other, and having an end bonded with a third leg, and other end extended toward the driving plate and formed with a conductively connecting member, a top end of the driving plate is inserted through the armature assembly; a fourth leg having an end disposed inside the case and formed with a contact member above the conductively connecting member.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 12, 2022
    Inventor: SUNG-JEN WU
  • Patent number: 11328886
    Abstract: A relay structure includes a case; a magnetoelectric assembly; a first leg and a second leg assembled with two ends of the magnetoelectric assembly, respectively; a magnetic conduction assembly having an end electrically connected to the magnetoelectric assembly in a normal condition, and when the magnetoelectric assembly produces electromagnetism, the magnetic conduction assembly is magnetically attracted to and abutted with other end of the magnetoelectric assembly; a driving plate assembled with the top surface of the magnetic conduction assembly; an armature assembly including conductive plates stacked with each other, and having an end bonded with a third leg, and other end extended toward the driving plate and formed with a conductively connecting member, a top end of the driving plate is inserted through the armature assembly; a fourth leg having an end disposed inside the case and formed with a contact member above the conductively connecting member.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: May 10, 2022
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: 11322326
    Abstract: An elastic contact plate structure of an electromagnetic relay includes at least one elastic plate assembly and at least one contact structure. The elastic plate assembly includes first, second, third and fourth plates sequentially stacked on one another, and first plate has a first convex arc bent portion with first mounting hole formed at an end; second plate has second convex arc bent portion with second mounting hole formed at an end. Third plate has third mounting hole formed at an end; fourth plate has fixed section, which has fourth mounting hole, and elastic section. Contact structure is passed and fixed into first, second, third, and fourth mounting hole. Therefore, the force receiving strength of elastic contact plate structure shows a positive linear change with the deformation, and the stability of connecting or disconnecting elastic contact plate structure is improved significantly, so as to achieve a better electrical performance.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: May 3, 2022
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D922964
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: June 22, 2021
    Assignee: Song Chuan Precision Co., Ltd.
    Inventor: Sung-Jen Wu
  • Patent number: D948458
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: April 12, 2022
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D951209
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: May 10, 2022
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D951210
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: May 10, 2022
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D984392
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: April 25, 2023
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D994618
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: August 8, 2023
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1020657
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: April 2, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1021814
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: April 9, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1021815
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: April 9, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1026832
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: May 14, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1026833
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: May 14, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1031671
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: June 18, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu