Patents by Inventor Sung-Jen Wu

Sung-Jen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240390899
    Abstract: A biochip includes a chip unit and an elastic pad. The chip unit comprises a plurality of liquid inlets arranged at intervals, and a plurality of micro flow channels respectively communicating with the liquid inlets. The elastic pad has an upper surface and a lower surface, and the lower surface is pasted on the chip unit. The elastic pad includes a plurality of guide channels arranged at intervals and penetrating the upper surface and the lower surface of the elastic pad. The guide channels respectively correspond to the liquid inlets of the chip unit. Each guide channel has an upper guiding section, and the diameter of the upper guiding section is gradually reduced from top to bottom. The detection liquid can enter the chip unit more quickly through the guide channel and improving the detection efficiency and accuracy. The invention also provides a connector module used in conjunction with the biochip.
    Type: Application
    Filed: April 15, 2024
    Publication date: November 28, 2024
    Applicant: Radiant Opto-Electronics Corporation
    Inventors: Yi-Jen CHIU, Sung-Fu WU, Hui-Hua HUNG
  • Patent number: 11688574
    Abstract: An electromagnetic relay includes a base, at least one fixed conductive sheet assembly, at least one movable conductive sheet assembly, at least one arc blow component, an electromagnet and an outer cap. The fixed conductive sheet assembly includes a fixed connecting plate and a fixed contact, and the movable conductive sheet assembly includes a movable connecting plate and a movable contact. The base is made of a thermal conductive polymer, and the fixed connecting plate has a first heat conduction part installed in the base and a second heat conduction part connected to the first heat conduction part and extended to an outer side of the base. The electromagnetic relay further includes at least two thermal conduction components installed in the base and symmetrically configured on both opposite sides of the fixed and movable contacts respectively for dissipating the heat generated by the electromagnetic relay.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: June 27, 2023
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Publication number: 20230085584
    Abstract: An electromagnetic relay includes a base, at least one fixed conductive sheet assembly, at least one movable conductive sheet assembly, at least one arc blow component, an electromagnet and an outer cap. The fixed conductive sheet assembly includes a fixed connecting plate and a fixed contact, and the movable conductive sheet assembly includes a movable connecting plate and a movable contact. The base is made of a thermal conductive polymer, and the fixed connecting plate has a first heat conduction part installed in the base and a second heat conduction part connected to the first heat conduction part and extended to an outer side of the base. The electromagnetic relay further includes at least two thermal conduction components installed in the base and symmetrically configured on both opposite sides of the fixed and movable contacts respectively for dissipating the heat generated by the electromagnetic relay.
    Type: Application
    Filed: September 13, 2021
    Publication date: March 16, 2023
    Inventor: SUNG-JEN WU
  • Publication number: 20220148834
    Abstract: A relay structure includes a case; a magnetoelectric assembly; a first leg and a second leg assembled with two ends of the magnetoelectric assembly, respectively, a magnetic conduction assembly having an end electrically connected to the magnetoelectric assembly in a normal condition, and when the magnetoelectric assembly produces electromagnetism, the magnetic conduction assembly is magnetically attracted to and abutted with other end of the magnetoelectric assembly; a driving plate assembled with the top surface of the magnetic conduction assembly; an armature assembly including conductive plates stacked with each other, and having an end bonded with a third leg, and other end extended toward the driving plate and formed with a conductively connecting member, a top end of the driving plate is inserted through the armature assembly; a fourth leg having an end disposed inside the case and formed with a contact member above the conductively connecting member.
    Type: Application
    Filed: November 6, 2020
    Publication date: May 12, 2022
    Inventor: SUNG-JEN WU
  • Patent number: 11328886
    Abstract: A relay structure includes a case; a magnetoelectric assembly; a first leg and a second leg assembled with two ends of the magnetoelectric assembly, respectively; a magnetic conduction assembly having an end electrically connected to the magnetoelectric assembly in a normal condition, and when the magnetoelectric assembly produces electromagnetism, the magnetic conduction assembly is magnetically attracted to and abutted with other end of the magnetoelectric assembly; a driving plate assembled with the top surface of the magnetic conduction assembly; an armature assembly including conductive plates stacked with each other, and having an end bonded with a third leg, and other end extended toward the driving plate and formed with a conductively connecting member, a top end of the driving plate is inserted through the armature assembly; a fourth leg having an end disposed inside the case and formed with a contact member above the conductively connecting member.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: May 10, 2022
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: 11322326
    Abstract: An elastic contact plate structure of an electromagnetic relay includes at least one elastic plate assembly and at least one contact structure. The elastic plate assembly includes first, second, third and fourth plates sequentially stacked on one another, and first plate has a first convex arc bent portion with first mounting hole formed at an end; second plate has second convex arc bent portion with second mounting hole formed at an end. Third plate has third mounting hole formed at an end; fourth plate has fixed section, which has fourth mounting hole, and elastic section. Contact structure is passed and fixed into first, second, third, and fourth mounting hole. Therefore, the force receiving strength of elastic contact plate structure shows a positive linear change with the deformation, and the stability of connecting or disconnecting elastic contact plate structure is improved significantly, so as to achieve a better electrical performance.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: May 3, 2022
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: 11004639
    Abstract: A relay includes a case and a coil unit is located in the case. Multiple first legs each have the first end thereof connected to the coil unit, and the second end thereof extending beyond the case. A second leg has the first end thereof located in the case and forms a contact, and the second end of the second leg extends beyond the case. A third leg includes an upright section and a transverse section which extends from the upright section and located in the case. The upright section has one end thereof extending beyond the case. An armature has a connection section connected to the transverse section, and a main section located beneath the contact. The connection section increases conductive area and flexibility of the armature in the case.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: May 11, 2021
    Assignee: SONG CHU AN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D922963
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: June 22, 2021
    Assignee: Song Chuan Precision Co., Ltd.
    Inventor: Sung-Jen Wu
  • Patent number: D922964
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: June 22, 2021
    Assignee: Song Chuan Precision Co., Ltd.
    Inventor: Sung-Jen Wu
  • Patent number: D948458
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: April 12, 2022
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D951209
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: May 10, 2022
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D951210
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: May 10, 2022
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D984392
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: April 25, 2023
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D994618
    Type: Grant
    Filed: May 13, 2021
    Date of Patent: August 8, 2023
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1020657
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: April 2, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1021814
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: April 9, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1021815
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: April 9, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1026832
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: May 14, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1026833
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: May 14, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu
  • Patent number: D1031671
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: June 18, 2024
    Assignee: SONG CHUAN PRECISION CO., LTD.
    Inventor: Sung-Jen Wu