Abstract: A light emitting diode apparatus is provided. The light emitting diode apparatus includes a wavelength conversion layer, a light emitting diode layer, a light transmission layer, and a sheath layer. The wavelength conversion layer has a first refractive index. The light emitting diode layer includes a base layer arranged on the wavelength conversion layer, and a light emitting structure layer arranged on the base layer. The light transmission layer is arranged on the wavelength conversion layer, surrounds a sidewall of the light emitting diode layer and contacts the sidewall of the light emitting diode layer, and has a second refractive index. The sheath layer is arranged to cover the light emitting diode layer and the light transmission layer, and has a third refractive index less than the second refractive index.

Abstract: A light-emitting diode (LED) package includes: an LED having a polygonal shape in a plan view; a light-transmissive layer directing light from the LED in an upward direction; a wavelength conversion layer changing a wavelength of the light emitted through the light-transmissive layer; and a coating layer covering the light-transmissive layer and reflecting the light emitted through the light-transmissive layer in the upward direction. In a plan view of the light-transmissive layer, a length from a first point corresponding to a vertex of the LED to a second point corresponding to an end of an extension of a diagonal of the LED is greater than or equal to a length from the first point to a third point corresponding to an end of an extension of a side of the LED.

Abstract: A light emitting diode apparatus is provided. The light emitting diode apparatus includes a wavelength conversion layer, a light emitting diode layer, a light transmission layer, and a sheath layer. The wavelength conversion layer has a first refractive index. The light emitting diode layer includes a base layer arranged on the wavelength conversion layer, and a light emitting structure layer arranged on the base layer. The light transmission layer is arranged on the wavelength conversion layer, surrounds a sidewall of the light emitting diode layer and contacts the sidewall of the light emitting diode layer, and has a second refractive index. The sheath layer is arranged to cover the light emitting diode layer and the light transmission layer, and has a third refractive index less than the second refractive index.

Abstract: A light-emitting diode (LED) package includes: an LED having a polygonal shape in a plan view; a light-transmissive layer directing light from the LED in an upward direction; a wavelength conversion layer changing a wavelength of the light emitted through the light-transmissive layer; and a coating layer covering the light-transmissive layer and reflecting the light emitted through the light-transmissive layer in the upward direction. In a plan view of the light-transmissive layer, a length from a first point corresponding to a vertex of the LED to a second point corresponding to an end of an extension of a diagonal of the LED is greater than or equal to a length from the first point to a third point corresponding to an end of an extension of a side of the LED.

Abstract: A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.

Abstract: A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.

Abstract: Provided is an eco-friendly filament using a biomass manufactured by extruding a bioplastic pellet which is formed from a bioplastic pellet composition including mixed particles including a coffee byproduct with a fatty acid content of 0.01 to 2.5 wt % or less and inorganic particles and having a size of 50 ?m or less; an additive; and a plastic raw material. The inorganic particles are one or more selected from the group consisting of calcium carbonate, silica, starch, alumina, titanium dioxide, talc, kaolin, mica, sericite, zinc oxide, barium carbonate, barium sulfate, diatomaceous earth, magnesium carbonate, magnesium silicate, boron nitride, alumina, zirconium oxide, iron oxide and mica titanium. The additive is one or more selected from the group consisting of an amide-based active compound, copolyamide, ethyl methane sulfonate (EMS), ethylene bis stearamide (EBS), and D-sorbitol.

Abstract: A composite cathode active material including a lithium metal oxide including an oxide Formula 1 and sulfur, xLi2MnO3.(1?x?y)LiMO2.yLiMn2O4??(1) wherein 0<x<0.6, 0<y<0.1, and M is at least one selected from a metal and a metalloid.

Abstract: A composite metal oxide represented by the formula Ma1?xMbxMcO4+x/2, wherein Ma is at least one element selected from alkaline earth metals, Mb is at least one element selected from lanthanoids, Mc is at least one element selected from Mo and W, and x is from about 0.1 to about 0.5.

Abstract: A composite cathode active material including a lithium metal oxide including an oxide Formula 1 and sulfur, xLi2MnO3.(1?x?y)LiMO2.yLiMn2O4??(1) wherein 0<x<0.6, 0<y<0.1, and M is at least one selected from a metal and a metalloid.

Abstract: A composite metal oxide represented by the formula Ma1?xMbxMcO4+x/2, wherein Ma is at least one element selected from alkaline earth metals, Mb is at least one element selected from lanthanoids, Mc is at least one element selected from Mo and W, and x is from about 0.1 to about 0.5.

Abstract: A composite including: a nickel compound represented by Formula 1: Ni1-xM1xOy??Formula 1 wherein M1 is silicon (Si), germanium (Ge), molybdenum (Mo), or a combination thereof, and 0?x?0.3 and 0?y?3; and a yttria-stabilized zirconia including cerium (Ce), titanium (Ti), or a combination thereof.

Abstract: A cathode for a solid oxide fuel cell, the cathode including: a mixed ionic-electronic conductor having a structure in a form of a pattern.