Abstract: Embodiments provide light emitting device package including a package body, a first lead frame and a second lead frame disposed on the package body, and a light emitting device electrically connected to the first lead frame and the second lead frame via respective conductive adhesives. At least one of the conductive adhesives has the smallest width at a central region thereof.

Abstract: Disclosed are a light emitting device. The light emitting device include first and second lead frames, a first body on the first and second lead frames and including an open region, a second body on the first body and including a first opening, a light emitting chip on the opening region, and a transmissive layer on the light emitting chip. The first body and the second body are formed of a resin material. A top surface of the first body is located at a position lower than a position of a top surface of the light emitting chip. The second body includes a bottom surface located at a position lower than the position of the top surface of the light emitting chip. The first body comprises an inclined part around the light emitting chip. The first body includes a reflectance material and the second body includes a transmissive material.

Abstract: A light emitting device include a first lead frame including a first bonding region and a second lead frame including a second bonding region. A gap is provided between the first and second lead frames. A first body is coupled to the first and second lead frames and includes an open region exposing the first and second bonding regions. A second body is coupled onto the first body and includes a first opening on the open region of the first body. A light emitting chip is provided on the second bonding region of the second lead frame, and a transmissive resin layer surrounds the light emitting chip in the open region of the first body and the first opening of the second body.

Abstract: A light emitting device include a first lead frame including a first bonding region and a second lead frame including a second bonding region. A gap is provided between the first and second lead frames. A first body is coupled to the first and second lead frames and includes an open region exposing the first and second bonding regions. A second body is coupled onto the first body and includes a first opening on the open region of the first body. A light emitting chip is provided on the second bonding region of the second lead frame, and a transmissive resin layer surrounds the light emitting chip in the open region of the first body and the first opening of the second body.

Abstract: Disclosed are a light emitting device. The light emitting device includes a body having a cavity; a plurality of lead frames in the cavity; a light emitting chip; a first molding member having a first metal oxide material around the light emitting chip; and a second molding member having a second metal oxide material on the first molding member and the light emitting chip, wherein the light emitting chip includes a reflective electrode layer under a light emitting structure, wherein a top surface of the first molding member extends from a region between a top surface of the light emitting chip and a lateral side of the reflective electrode layer at a predetermined curvature, and wherein a bottom surface of the second molding member includes a curved surface which is convex toward the first molding member.

Abstract: A light emitting device according to the embodiment includes a body; a first lead electrode having a first bonding part and a second bonding part; a second lead electrode having a third bonding part and a fourth bonding part; a gap part between the first and second lead electrodes; a third lead electrode on a bottom surface of the body; a fourth lead electrode on the bottom surface of the body; a first connection electrode; a second connection electrode; a light emitting chip; and a first bonding member, wherein the gap part includes a first gap part disposed between the first and third bonding parts, and the first gap part includes first and second regions spaced apart from each other corresponding to a width of the third bonding part, and a third region connected to the first and second regions and disposed perpendicularly to the first and second regions.