Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: Provided is a beauty tool for nail and skin exfoliation, and specifically, a beauty tool for nail and skin exfoliation including a body, a plate which is coupled to the body and is made of a glass material, a plurality of metal protrusions which are disposed on an upper surface of the plate with a predetermined pattern, and a plurality of concave grooves which are defined with a predetermined depth on the upper surface of the plate and are not covered by the plurality of metal protrusions.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: The present invention relates to a snow removing apparatus for a vehicle, comprising a frame installed on a vehicle; a first spraying portion installed on the frame for spraying a snow remover in a downward direction; a second spraying portion installed on at least one side surface from among both side surfaces of the frame, for spraying a snow remover in a lateral direction to the frame; a snow remover supplying portion for supplying the snow remover to the first and second spraying portions; and a control unit for controlling the sprayed state of the snow remover from the first and second spraying portions. The snow removing apparatus for a vehicle according to the present invention has a lateral spraying nozzle capable of spraying a snow remover in a lateral direction to a snow removing vehicle, and has the advantage of being able to expand the spraying range of the snow remover.

Abstract: The present invention relates to a motor. A motor including a stator and a rotor that is rotatably provided at an outer side in a radial direction of the stator, the rotor comprising: a base part; a side wall part that is integrally formed with the base part and vertically extended with respect to the base part; and a permanent magnet that is provided at an inner side of the side wall part, wherein a spacing distance from an inner side surface of the base part to a lower end of the permanent magnet is formed to be larger than a radial thickness of the permanent magnet.

Abstract: The motor including a stator having a stator core, and an insulator provided to the stator core for winding a coil thereon, a rotor rotatably provided with respect to the stator, and a tap terminal provided to the insulator for positioning an end of the coil, wherein the coil includes a core wire of aluminum.

Abstract: A method of fabricating a floating trap type nonvolatile memory device includes forming a cell gate insulating layer on a semiconductor substrate, the cell gate insulating layer being comprised of a lower insulating layer, a charge storage layer and an upper insulating layer sequentially stacked; thermally annealing the cell gate insulating Layer at a temperature of approximately 810° C. to approximately 1370° C.; and forming a gate electrode on the thermally annealed cell gate insulating layer.

Abstract: The motor including a stator having a stator core, and an insulator provided to the stator core for winding a coil thereon, a rotor rotatably provided with respect to the stator, and a tap terminal provided to the insulator for positioning an end of the coil, wherein the coil includes a core wire of aluminum.

Abstract: The motor including a stator having a stator core, and an insulator provided to the stator core for winding a coil thereon, a rotor rotatably provided with respect to the stator, and a tap terminal provided to the insulator for positioning an end of the coil, wherein the coil includes a core wire of aluminum.

Abstract: A cassette assembly and a method of manufacturing fluorescent lamps using the cassette assembly are provided. The cassette assembly includes a housing defining a process chamber and having a plurality of holes in which glass tubes for the fluorescent lamps are inserted to communicate with the chamber, a carrying unit including two or more porous plates through which the glass tubes are fitted, a plurality of ring members disposed on the porous plates to preliminarily fix the glass tubes to the carrying unit by allowing the outer circumferences of the glass tubes to contact, and a locking unit for changing the glass tubes from the preliminary fixing status to a lockup status by varying contact pressure applied between the ring members and the glass tubes.

Abstract: The present invention relates to a motor. A motor including a stator and a rotor that is rotatably provided at an outer side in a radial direction of the stator, the rotor comprising: a base part; a side wall part that is integrally formed with the base part and vertically extended with respect to the base part; and a permanent magnet that is provided at an inner side of the side wall part, wherein a spacing distance from an inner side surface of the base part to a lower end of the permanent magnet is formed to be larger than a radial thickness of the permanent magnet.

Abstract: A method of fabricating an electrode of an external electrode fluorescent lamp (EEFL) includes plating nickel on both ends of a glass tube through an electroless nickel plating process and forming electrodes by dipping the glass tube into an electrode material including zinc, and tin or lead.

Abstract: There is provided a fluorescent material coating apparatus for a fluorescent lamp. The fluorescent material coating apparatus includes a cassette on which a plurality of glass tubes are detachably mounted, a delivery member having a delivery chamber communicating with first ends of the glass tubes, a negative pressure generating unit for allowing fluorescent solution to be drawn into the glass tubes by generating a negative pressure in the glass tubes communicating with the delivery chamber by lowering the pressure of the delivery chamber, a dry air supplying unit for supplying dry air to the delivery chamber to dry the fluorescent solution applied on inner surfaces of the glass tubes, a solution tank containing the fluorescent solution and disposed below the glass tubes mounted on the cassette, and a moving unit for allowing lower end portions of the glass tubes mounted in the delivery chamber to be dipped into the fluorescent solution contained in the solution tank.

Abstract: The motor including a stator having a stator core, and an insulator provided to the stator core for winding a coil thereon, a rotor rotatably provided with respect to the stator, and a tap terminal provided to the insulator for positioning an end of the coil, wherein the coil includes a core wire of aluminum.

Abstract: The present invention provides a method of fabricating an electrode of an EEFL including: cutting a cylindrical tube for the electrode to a uniform size; forming a round-shape protective cap having a hole with a predetermined size at one end of the cut tube; inserting the protective cap into a glass tube having the electrode formed by electroless plating; and connecting the protective cap on an outer wall of the glass tube, after inserting the protective cap into the glass tube.

Abstract: A method of fabricating a floating trap type nonvolatile memory device includes forming a cell gate insulating layer on a semiconductor substrate, the cell gate insulating layer being comprised of a lower insulating layer, a charge storage layer and an upper insulating layer sequentially stacked; thermally annealing the cell gate insulating Layer at a temperature of approximately 810° C. to approximately 1370° C.; and forming a gate electrode on the thermally annealed cell gate insulating layer.