Abstract: The present invention relates to an exopolysaccharide derived from Pseudoalteromonas sp. strain CY01 (KCTC 12867BP) which is a novel strain living in the polar regions, and to a composition for cryoprotection of cells, which contains the exopolysaccharide. The exopolysaccharide of the present invention has an excellent ability to cryoprotect cells, and shows no cytotoxicity. Thus, the inventive exopolysaccharide can substitute for conventional cryoprotective agents that show cytotoxicity when used at high concentrations.

Abstract: Disclosed are an organic semiconductor compound that exhibits chemical resistance and etch resistance while maintaining electrical characteristics and thus is applicable to an existing photolithography process, thereby increasing process efficiency, and an organic semiconductor device using the same.

Abstract: Disclosed is a method of purifying boron nitride nanotubes through a simplified process. Specifically, the method includes preparing a starting solution containing boron nitride nanotubes (BNNTs), a dispersant and a solvent, centrifuging the starting solution or allowing the starting solution to stand to collect a supernatant, adding an acid to the supernatant and filtering a resulting product.

Abstract: An operating method of a terminal may include establishing a video call session between the terminal and a counterpart terminal; acquiring a first video that is captured by the terminal and includes a plurality of frames; censoring the first video based on a censorship algorithm for determining whether or not at least one object preset as an inappropriate element is included in a frame within a predetermined video; and displaying the first video instead of a second video received from a counterpart terminal when it is determined that the at least one object is included in at least one of the plurality of frames as a result of censoring the first video.

Abstract: A trench is formed in an insulating layer to expose a native fin on a substrate. A replacement fin is deposited on the native fin in the trench. The replacement fin is trimmed laterally.

Abstract: Disclosed herein are a hardware security module, a device having the hardware security module, and a method for operating the device. The method for verifying integrity of executable code in a device includes dividing, by a Micro-Control Unit (MCU), executable code into multiple blocks, generating, by the MCU, hash values corresponding to the blocks resulting from the division, storing, by a Hardware Security Module (HSM), the generated hash values, calculating, by the MCU, at least one hash value, among hash values of the multiple blocks when the executable code boots, and comparing, by the HSM, the calculated hash value with a hash value corresponding to the calculated hash value, among the hash values stored in the HSM.

Abstract: An electronic device protecting privacy of a user is provided. The electronic device includes a transceiver configured to transmit and receive wireless communication signals of Wi-Fi networks, and at least one processor configured to detect occurring of an event for identifying a location of the electronic device, determine whether to use the Wi-Fi networks for identifying the location of the electronic device, control the transceiver to perform an active scan, when the Wi-Fi networks is used to identify the location of the electronic device, and control the transceiver to transmit one or more probe request frames including a virtual media access control (MAC) address to an access point of the Wi-Fi networks for identifying the location of the electronic device, when the transceiver to be performed in the active scan.

Abstract: A method for manufacturing a semiconductor device includes stacking, on a package substrate, first semiconductor chips. Each of the first semiconductor chips includes a first adhesive film. The method includes stacking, respectively on the first semiconductor chips, second semiconductor chips. Each of the second semiconductor chips includes a second adhesive film. The method includes compressing the first and second adhesive films to form an adhesive structure. The adhesive structure includes an extension disposed on sidewalls of the first and second semiconductor chips. The method includes removing the extension. The method includes forming a first molding layer substantially covering the first and second semiconductor chips. The method includes performing a cutting process on the package substrate between the first and second semiconductor chips to form a plurality of semiconductor packages each including at least one of the first semiconductor chips and at least one of the second semiconductor chips.

Abstract: Disclosed herein are an apparatus and method for authenticating an IoT device. The method, performed by the IoT device authentication apparatus, includes transmitting, by the IoT device authentication apparatus, a random number to the IoT device and encrypting, by the IoT device authentication apparatus, the random number using a previously registered first white-box cryptography value through a white-box cryptography method; generating, by the IoT device, a first device response value from a previously registered first device challenge value using a Physical Unclonable Function (PUF) and encrypting, by the IoT device, the random number, received from the IoT device authentication apparatus, using the first device response value; and performing, by the IoT device authentication apparatus, authentication of the IoT device by checking whether the random number encrypted using the white-box cryptography method matches the random number encrypted using the PUF, which is received from the IoT device.

Abstract: A flip chip bonding method includes obtaining a die including a first substrate and an adhesive layer on the first substrate; bonding the die to a second substrate different from the first substrate; and curing the adhesive layer. The curing the adhesive layer includes heating the second substrate to melt the adhesive layer, and providing the adhesive layer and the second substrate with air having pressure greater than atmospheric pressure.

Abstract: Processing an image includes acquiring, by the image processing apparatus, a target image, extracting a shape of a target object included in the target image, determining a category including the target object based on the extracted shape, and storing the target image by mapping the target image with additional information including at least one keyword related to the category.

Abstract: Methods of fabricating a semiconductor device are provided. The methods may include forming a gate structure on a core-peri region of a substrate. The substrate may further include a cell region. The methods may also include forming a gate spacer on a sidewall of the gate structure, forming a first impurity region adjacent the gate spacer in the core-peri region of the substrate by performing a first ion implantation process, removing the gate spacer, forming a second impurity region in the core-peri region of the substrate between the gate structure and the first impurity region by performing a second ion implantation process, forming a stress film on the gate structure, an upper surface of the first impurity region, and an upper surface of the second impurity region, and forming a recrystallization region by crystallizing the first impurity region and the second impurity region by performing an annealing process.

Abstract: Disclosed herein is a method of operating an authentication server based on a Physical Unclonable Function (PUF), which includes transmitting a Challenge-Response Pair (CRP) update request message to a user device when a CRP update event occurs, receiving a CRP update response message from the user device in response to the CRP update request message, generating a secret key corresponding to the CRP update request message, decrypting the CRP update response message with the secret key, and updating a CRP corresponding to the secret key in a database using the decrypted CRP update response message.

Abstract: Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.

Abstract: Integrated circuits include fins including an upper/channel region and a lower/sub-channel region, the lower region having a first chemical composition and opposing sidewalls adjacent to an insulator material, and the upper region having a second chemical composition. A first width indicates the distance between the opposing sidewalls of the lower region at a first location is at least 1 nm wider than a second width indicating the distance between the opposing sidewalls of the upper region at a second location, the first location being within 10 nm of the second location (or otherwise relatively close to one another). The first chemical composition is distinct from the second chemical composition and includes a surface chemical composition at an outer surface of the opposing sidewalls of the lower region and a bulk chemical composition therebetween, the surface chemical composition including one or more of oxygen, nitrogen, carbon, chlorine, fluorine, and sulfur.

Abstract: The present disclosure relates to a three-dimensional ground model generation and an automated earthwork target model generation system based on a parameter input.

Abstract: A multilayer capacitor includes a capacitor body, a first external electrode, and a second external electrode. The capacitor body includes a plurality of first and second internal electrodes alternately stacked with dielectric layer interposed therebetween. The first and second external electrodes are electrically connected to the first and second internal electrodes, respectively. A first Schottky layer is Schottky-junctioned to an interface between the dielectric layer and the first internal electrode in the capacitor body. A second Schottky layer is Schottky-junctioned to an interface between the dielectric later and the second internal electrode in the capacitor body. The work function values of the first and second Schottky layers is higher than the work function values of the first and second internal electrodes.

Abstract: The present disclosure relates to a method for preparing a transglucosylated steviol glycoside using a crude enzyme liquid of a Lactobacillus mali strain.

Abstract: Provided is a novel compound derived from allulose and a composition comprising the same and having acid resistance.

Abstract: A display device includes a display panel divided into a first display area and a second display area in a first direction, a first data driver which provides a first data signal to the first display area through data lines arranged in a second direction crossing the first direction, a second data driver which provides a second data signal to the second display area through the data lines arranged in the second direction, a gate driver which provides a gate signal to the display panel through gate lines arranged in the first direction, a timing controller which generates control signals that control the first data driver, the second data driver, and the gate driver, and a defect detector which controls to display a defect detecting image and a reference image on the first display area and the second display area alternately based on an enable signal.