Abstract: An apparatus for improving turning performance of a vehicle includes: a turning characteristic detection module configured to detect a turning situation based on vehicle information obtained from at least one sensor and to calculate a required driving force to be implemented in the vehicle for a turning motion; a driving force estimation module configured to estimate a limited driving force applicable to a drive wheel; and a turning characteristic control module configured to control and apply a braking force corresponding to a difference between the required driving force and the limited driving force to a motor to inhibit a wheel slip, when the required driving force is greater than the limited driving force.

Abstract: A light emitting diode module is disclosed. The light emitting diode module includes: a plurality of printed circuit boards; a light emitting diode package disposed on any one of the plurality of printed circuit boards; a driving chip disposed on another printed circuit board among the plurality of printed circuit boards on which the light emitting diode package is not disposed; and a connector connecting the plurality of printed circuit boards to one another.

Abstract: A display device includes a display panel; a first upper support member on the display panel; and a second upper support member on the display panel and spaced from the first upper support member; and a blocking member including a blocking part crossing the first upper support member and the second upper support member, a first stretchable part connected to a side of the blocking part and including a plurality of openings, a second stretchable part connected to another side of the blocking part and including a plurality of openings, a first fixing part connected to the first stretchable part, and a second fixing part connected to the second stretchable part.

Abstract: Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.

Abstract: A light emitting module includes a substrate, a light emitting diode chip, and a lens. The light emitting diode chip is disposed on the substrate. The lens is coupled to the substrate and covers the light emitting diode chip. The lens includes a light incident surface and a light exit surface. The light incident surface receives light from the light emitting diode chip. The light exit surface outputs the light from the lens. The light incident surface includes a concave light incident surface and a convex light incident surface. The concave light incident surface overlaps the light emitting diode. The convex light incident surface extends from the concave light incident surface.

Abstract: Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.

Abstract: Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.

Abstract: A light emitting module includes a substrate, a light emitting diode chip, and a lens. The light emitting diode chip is disposed on the substrate. The lens is coupled to the substrate and covers the light emitting diode chip. The lens includes a light incident surface and a light exit surface. The light incident surface receives light from the light emitting diode chip. The light exit surface outputs the light from the lens. The light incident surface includes a concave light incident surface and a convex light incident surface. The concave light incident surface overlaps the light emitting diode. The convex light incident surface extends from the concave light incident surface.

Abstract: A light emitting module includes a circuit board, a light emitting device mounted on the circuit board, and a lens dispersing light emitted from the light emitting device. The lens includes a lower surface formed with a concave section defining a light incident surface through which light enters the lens, an upper surface through which light exits the lens, and legs coupled to the circuit board and disposed farther outside the lens than an area of the upper surface. The light emitting device is disposed within the concave section of the lens.

Abstract: A light emitting module includes a circuit board, a light emitting device mounted on the circuit board, and a lens dispersing light emitted from the light emitting device. The lens includes a lower surface formed with a concave section defining a light incident surface through which light enters the lens, an upper surface through which light exits the lens, and legs coupled to the circuit board and disposed farther outside the lens than an area of the upper surface. The light emitting device is disposed within the concave section of the lens.

Abstract: Disclosed are a light-emitting device package, a manufacturing method therefor, and a vehicle lamp and a backlight unit including the same. The light-emitting device package includes: a light-emitting chip having electrode pads positioned at a lower part thereof; a wavelength conversion unit for covering at least an upper surface and lateral surfaces of the light-emitting chip; and a reflective part which covers the lateral surfaces of the light-emitting chip. Accordingly, the light-emitting device package can be miniaturized and a separate substrate for forming a lens is not required.

Abstract: A light emitting module includes a circuit board, a light emitting device mounted on the circuit board, and a lens dispersing light emitted from the light emitting device. The lens includes a lower surface formed with a concave section defining a light incident surface through which light enters the lens, an upper surface through which light exits the lens, and legs coupled to the circuit board and disposed farther outside the lens than an area of the upper surface. The light emitting device is disposed within the concave section of the lens.

Abstract: Disclosed herein is a lens and light emitting module for surface illumination. The light emitting module includes a circuit board; a light emitting device mounted on the circuit board; and a lens dispersing light emitted from the light emitting device. The lens includes a lower surface formed with a concave section defining a light incident surface through which light enters the lens, an upper surface through which light exits the lens, and legs coupled to the circuit board and disposed farther outside the lens than an area of the upper surface. The light emitting device is disposed within the concave section of the lens. With this structure, the lens and the light emitting module can be reduced in thickness.

Abstract: Disclosed herein is a lens and light emitting module for surface illumination. The light emitting module includes a circuit board; a light emitting device mounted on the circuit board; and a lens dispersing light emitted from the light emitting device. The lens includes a lower surface formed with a concave section defining a light incident surface through which light enters the lens, an upper surface through which light exits the lens, and legs coupled to the circuit board and disposed farther outside the lens than an area of the upper surface. The light emitting device is disposed within the concave section of the lens. With this structure, the lens and the light emitting module can be reduced in thickness.