Abstract: An embodiment anode for an all-solid-state battery, the anode including an anode current collector and an anode active material layer disposed on the anode current collector and including an anode active material, the anode active material including a plate-type carbon material, wherein a length ratio (a/c) of a major axis (a) to a thickness (c) of the plate-type carbon material is 4 or more, and a coating layer coating a portion of a surface of the plate-type carbon material, wherein the coating layer includes a lithiophilic material.

Abstract: Provided is a coupler supporting module configured to support a coupler for a drum container that stores various types of liquid, the coupler being connected to the drum container to enable liquid flow, and more particularly, a coupler supporting module for a drum container, which supports the coupler to tilt according to an angle of a discharge port of the drum container. The coupler supporting module for a drum container allows the coupler to be inserted into the discharge port of the drum container while tilting the coupler to align with an angle the discharge port when the coupler is lowered, by supporting the coupler in a tiltable manner using a tilting joint. Accordingly, the coupler supporting module for a drum container is applicable to an automated device that automatically connects the coupler to the drum container and is effectively utilized.

Abstract: According to an embodiment, there is provided a control method for autonomously berthing a ship including obtaining ship state information and berth information, setting a DP point; an approaching operation of controlling the ship to approach the DP point; and a dynamic positioning operation of adjusting a location and posture of the ship based on an error rate between the DP point and a current location of the ship.

Abstract: A power trading system of virtual power plant includes a plurality of virtual power plants connected to a power system and including a distributed energy resource; a heat conversion device connected to the power system and converting the power generated from the plurality of distributed energy resources into thermal energy; and a power trading device configured to analyze an excess and insufficient power amount of the plurality of virtual power plant due to an output variation of the distributed energy resource, control power trading between the plurality of virtual power plant, the power system, or the heat conversion device by using the analysis result of the excess and insufficient power amount to stabilize the output of the power system and the virtual power plant.

Abstract: A method of calculating a collision risk of a ship according to an embodiment of the present disclosure may include: calculating an available velocity area based on maneuvering performance of a host ship; calculating a velocity obstacle area where there is a possibility of collision between an object and the host ship; and calculating a collision risk based on at least one of the available velocity area, the velocity obstacle area, and a preset weight.

Abstract: A virtual power plant system using a renewable combined heat and power plant includes a plurality of distributed energy resources connected to a virtual power plant; a virtual power plant output adjustment device connected to the virtual power plant and including a renewable combined heat and power plant that produces electricity using a new and renewable energy source; and a virtual power plant management device configured to conduct a bidding by predicting an power generation amount of the plurality of distributed energy resources, analyze output variation and error of the virtual power plant based on the power generation amount of the plurality of distributed energy resources, and stabilize an output variation of the virtual power plant by controlling a power generation amount of the virtual power plant output adjustment device.

Abstract: A system for laser bonding of flip chip, and more particularly, to a system for laser bonding of flip chip for bonding a flip chip-type semiconductor chip to a substrate by using a laser beam is provided. According to the system for laser bonding of flip chip of the present disclosure, by performing laser bonding on a substrate while pressurizing semiconductor chips, even semiconductor chips which are bent or likely to bend may be bonded to the substrate without causing poor contact of solder bumps.

Abstract: A device according to an aspect includes a memory in which at least one program is stored and at least one processor configured to execute the at least one program, wherein the at least one processor obtains information about a candidate object using a distance detection sensor, obtains an image of the candidate object using an image capturing sensor, determines whether the candidate object is a real object using the image of the candidate object, and displays a marker containing information about the candidate object determined to be a real object on a monitoring image.

Abstract: Provided is a conductive ball mounting method using an electrostatic chuck. According to the conductive ball mounting method using an electrostatic chuck, when the process of mounting conductive balls onto a substrate through mounting grooves formed in the mask is performed, the occurrence of process defects can be prevented and conductive balls having very small sizes can be effectively mounted on the substrate. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting conductive balls can be performed with high quality by preventing deformation of the mask without missing of some of the conductive balls. According to the conductive ball mounting method using the electrostatic chuck of the disclosure, the process of mounting small sizes of conductive balls on the substrate can be effectively performed.

Abstract: A virtual power plant system using a heat conversion device includes a plurality of distributed energy resources connected to a virtual power plant; a virtual power plant output adjustment device connected to the virtual power plant and including a heat conversion device that receives power generated from the plurality of distributed energy resources and converts the power into thermal energy, a virtual power plant management device configured to conduct a bidding by predicting an expected power generation amount of the plurality of distributed energy resources, analyze output variation and error of the virtual power plant due to an output variation of the plurality of distributed energy resources, and stabilize an output variation of the virtual power plant by controlling a power consumption amount of the virtual power plant output adjustment device based on the analysis result.

Abstract: Provided is an antibacterial composition including lemongrass oil, lavender oil, and ylang ylang oil.

Abstract: The present disclosure relates to a method of bonding column type deposits to a substrate, and more specifically, to a method of bonding to a substrate column type deposits, which are formed in a column shape and connect the substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. A method of bonding column type deposits to a substrate according to the present disclosure has the advantage of bonding the column type deposits having a high aspect ratio to accurate positions while being aligned vertically on the substrate.

Abstract: Provided is a method of bonding column type deposits, and more specifically, a method of bonding, to a substrate, column type deposits which are formed in a column shape and connect a substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. The method of bonding the column type deposits to the substrate enables bonding the column type deposits having a high aspect ratio to accurate positions while being kept aligned vertically on the substrate.

Abstract: A flip-chip laser bonding apparatus and method are provided in which flip-chip type semiconductor chips are bonded to a substrate using laser light. The flip-chip laser bonding apparatus and method are effective in rapidly bonding bent or flexible flip-chip type semiconductor chips to a substrate with high quality without contact defects of solder bumps.

Abstract: The present disclosure relates to a mutant microorganism in which a glycerol catabolic pathway and a 1,3-PDO biosynthetic pathway are introduced into a microorganism incapable of using glycerol as a carbon source, and a method of producing 1,3-PDO using the same. According to the present disclosure, it is possible to produce 1,3-PDO while growing a mutant microorganism having 1,3-PDO production ability by using the inexpensive raw material glycerol as a single carbon source. Thus, the present disclosure is useful for the economical production of 1,3-PDO.

Abstract: According to a head assembly for mounting conductive balls of the disclosure, a gas flow for moving the conductive balls in a downward direction is formed in a chamber, and thus, small and light-weight conductive balls may be effectively mounted in mounting recesses of a mask. Also, because the head assembly for mounting the conductive balls is operated in the manner of inducing the conductive balls to move in a direction in which the mounting recesses are formed, the conductive balls may be rapidly and thoroughly mounted in the plurality of mounting recesses formed in the mask.

Abstract: The present invention includes: 1) dissolving a first binder in a first solvent; 2) dissolving a dispersing agent in a solution in which the first binder is dissolved; 3) adding charcoal powder to the solution obtained in 2) and performing homogenous mixing to produce a dispersion in which the charcoal powder is bound to the first binder; 4) spray drying the dispersion obtained in 3) to produce a primary capsule from which the first solvent is removed; 5) dissolving a second binder and a softening agent in a second solvent; 6) homogeneously mixing a coloring agent and the dispersing agent with a solution in which the second binder and the softening agent are dissolved; 7) mixing the primary capsule with the solution obtained in 6) to produce a double capsule dispersion in which the primary capsule is bound to the second binder; and 8) spray-drying the double capsule dispersion to product a double capsule from which the second solvent is removed.

Abstract: Provided is a flip-chip bonding apparatus using VCSEL device, and more particularly, to a flip-chip bonding apparatus using VCSEL device for bonding a flip-chip type semiconductor chip to a substrate using infrared laser light generated from the VCSEL device. The flip-chip bonding apparatus using VCSEL device may quickly control laser light to bond a semiconductor chip to a substrate, with high productivity and high quality.

Abstract: The present invention relates to a novel compound having a histone deacetylase 6 (HDAC6) inhibitory activity, an optical isomer thereof or a pharmaceutically acceptable salt thereof, the use thereof for preparing a therapeutic medicament, a pharmaceutical composition containing the same, and a treatment method using the composition, and a preparation method thereof. The novel compound, the optical isomer thereof, or the pharmaceutically acceptable salt thereof according to the present invention has the HDAC6 inhibitory activity, which is effective in the prevention or treatment of HDAC6-mediated diseases including cancer, inflammatory diseases, autoimmune diseases, neurological or neurodegenerative diseases.

Abstract: The present invention relates to a novel compound having a histone deacetylase 6 (HDAC6) inhibitory activity, an isomer thereof or a pharmaceutically acceptable salt thereof, the use thereof for preparing a therapeutic medicament; a pharmaceutical composition containing the same, and a treatment method using the composition; and a preparation method thereof. The novel compound, the isomer thereof, or the pharmaceutically acceptable salt thereof according to the present invention has the HDAC6 inhibitory activity, which is effective in the prevention or treatment of HDAC6-mediated diseases including cancer, inflammatory diseases, autoimmune diseases, neurological or neurodegenerative diseases.