Patents by Inventor Sung Kun Lee

Sung Kun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100307473
    Abstract: The present invention relates to a diamond tool for cutting a workpiece. An object of the present invention is to provide a diamond tool, wherein diamond granules are arranged at regular intervals with respect to an outer peripheral surface of a segment so that the diamond granules are uniformly arranged in a front face of the segment, which is a substantial cutting surface, thereby improving the cutting performance thereof and simultaneously maintaining a consistent performance during the service life of the diamond tool. A diamond tool of the present invention for achieving the object has a segment that is attached to an outer peripheral surface of a shank in the form of a wheel or plate and contains diamond granules, wherein the segment comprises a plurality of diamond granules arranged on a plurality of concentric circles having the same central axis as an outer periphery of the segment.
    Type: Application
    Filed: April 24, 2007
    Publication date: December 9, 2010
    Applicant: SHINHAN DIAMOND IND CO., LTD.
    Inventors: Hyun Woo Lee, Jong Hwan Park, Sung Kun Lee, Dae Geun Kim
  • Publication number: 20100043304
    Abstract: Disclosed herein is a diamond tool and a method of manufacturing the same. The diamond tool includes a shank and a segment coupled to the shank having a compact having a plurality of grooves, and diamond particles inserted into the grooves and bonded to the compact. The grooves can be formed on the compact corresponding to a desired arrangement locations of the diamond particles. A metal powder injection molding method can be employed to prepare the compacts. More than one compact can be stacked to form the segment, so that the diamond particles can be arranged in various patterns in the segment, thereby achieving simplification of the process, which allows cost savings and process automation.
    Type: Application
    Filed: April 23, 2007
    Publication date: February 25, 2010
    Applicant: SHINHAN DIAMOND IND. CO., LTD.
    Inventors: Hyun Woo Lee, Jong Hwan Park, Sung Kun Lee, Shin Kyung Kim