Patents by Inventor Sung Kwon HWANGBO

Sung Kwon HWANGBO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE BONDING APPARATUS AND METHOD
    Publication number: 20090056866
    Abstract: A substrate bonding apparatus including a first chamber including a first surface plate on which a first substrate is received, a surface plate lift for lifting the first surface plate, a second chamber including a second surface plate on which a second substrate to be bonded to the first substrate is received, at least one adhesive included with the first surface plate to adhere to the first substrate, and an adhesive lift for independently lifting the adhesive.
    Type: Application
    Filed: June 3, 2008
    Publication date: March 5, 2009
    Inventors: Jae Seok HWANG, Sung Kwon HWANGBO