Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

Abstract: The present invention relates to donepezil ether palmitate hydrochloride (DEP HCl) and a method for preparing same. Donepezil ether palmitate hydrochloride (DEP HCl) has been developed to have increased stability by suppressing generation of unknown related substances generated during a preparation process of a raw material and formulation of donepezil ether palmitate (DEP). In addition, the present invention relates to a sustained-release pharmaceutical composition comprising donepezil ether palmitate hydrochloride (DEP HCl) as a main ingredient. When administered in the body, the initial release of donepezil, which is an active ingredient, is reduced, thereby reducing the risk of side effects such as drug toxicity, and the constant release of donepezil in the body for a long period of time can improve the drug treatment effect on dementia patients.

Abstract: The present invention relates to novel donepezil ether palmitate or a pharmaceutically acceptable salt thereof; and a sustained-release pharmaceutical composition containing same as a main ingredient. Since an ether palmitate group is introduced to donepezil, the donepezil ether palmitate of the present invention reduces the initial release of donepezil, which is the active ingredient, when administered into the body, so as to reduce the risk of side effects such as drug toxicity, and allows donepezil to be uniformly released in the body over a long time to increase drug treatment effects for dementia patients.

Abstract: A cerebral aneurysm stent (1) of the present invention comprises a hollow tubular main body (10) and a coil support (20) integrally formed with the main body (10) at one end of the main body (10) in the longitudinal direction, wherein the coil support (20) comprises a closed structure (21) with respect to the radially inner side of the cerebral aneurysm stent (1), the closed structure (21) being located at an outer end portion of the cerebral aneurysm stent (1) in the longitudinal direction.

Abstract: The present invention relates to a stent with a pigtail structure used for connection between organs of different kinds where a through hole is formed on each of the organs of different kinds and portions around the through holes are connected to each other, the stent comprising: a stent body where both end parts are arranged across the through holes formed on the organs of different kinds and a connecting passage which connects the two organs of different kinds is formed; and a one-side wound end part and an other-side wound end part which are formed in a pigtail shape at both end parts of the stent body to be caught and fixed to the through holes, such that portions of the organs of different kinds around the through holes are in close contact with each other, wherein the stent body, the one-side wound end part, and the other-side wound end part are provided as an integral body having a mesh structure made of woven wire and comprising a cover film which covers the woven wire for sealing of the connecting pa

Abstract: A stent insertion apparatus including a guide member in which a fixing part is formed includes a guide member configured to guide movement of a first stent inserted into a human body along a first guide wire inserted into a main area of stenosis to be installed in the main area of stenosis, wherein the guide member includes a fixing part configured to fix a leading end portion of a guide tube into which a second guide wire for installing a second stent is inserted, the second stent being inserted into a branched area of stenosis, which branches from the main area of stenosis, to be installed in the branched area of stenosis.

Abstract: The drainage catheter according to the examples of the present invention comprises a first induction conduit; and a second induction conduit having a circumference part surrounding the first induction conduit, in which a cut part is formed so that a front edge of the first induction conduit is exposed to the outside.

Abstract: A stent according to the present invention includes: a stent main body that has a plurality of holes formed in the surface thereof and a circumferential part of which the inside is hollow; and a cover that covers one side of the outer circumferential surface of the stent main body, in which the stent main body has an exterior path that provides a channel through which the body fluid secreted from a diverging duct can flow along the longitudinal direction of the stent main body to the outside of the cover.

Abstract: Disclosed is a stent insertion apparatus including a sheath formed to have a hollow shape and in which a stent is accommodated, a main guide tube movably inserted into the sheath and to which one end of the stent is coupled, and an auxiliary guide tube coupled to the main guide tube in a bifurcated manner and to which the other end of the stent, which branches from the one end of the stent, is coupled.

Abstract: A cardiac valve fixing device of the present invention comprises: a first structure, which continuously comes into contact with the lower surface of at least one cardiac valve; a second structure, which is connected to the first structure and continuously comes into contact with the upper surface of the cardiac valve; and a fixing barb, which is equipped in at least one of the first structure and the second structure and protrusively formed to the direction of the cardiac valve so as to be inserted into the cardiac valve. Accordingly, the cardiac valve fixing device of the present invention stably fixes the cardiac valve.

Abstract: A stent according to the present invention includes: a stent main body that has a plurality of holes formed in the surface thereof and a circumferential part of which the inside is hollow; and a cover that covers one side of the outer circumferential surface of the stent main body, in which the stent main body has an exterior path that provides a channel through which the body fluid secreted from a diverging duct can flow along the longitudinal direction of the stent main body to the outside of the cover.

Abstract: Provided is a stent that is placed in the bile duct to facilitate bile secretion into the duodenum. The stent includes an elastically deformable body, a film part, and an anti-inversion part. The body has a predetermined diameter and length and is formed by interlacing wires in the form of a tube. The film part surrounds to cover at least a portion of the body, extends a predetermined length from one end of the body, and is made of a flexible material. The anti-inversion part is connected to the one end of the body from which the film part extends and prevents the film part from being inverted and folded inwardly toward the body.

Abstract: A cardiac valve fixing device of the present invention comprises: a first structure, which continuously comes into contact with the lower surface of at least one cardiac valve; a second structure, which is connected to the first structure and continuously comes into contact with the upper surface of the cardiac valve; and a fixing barb, which is equipped in at least one of the first structure and the second structure and protrusively formed to the direction of the cardiac valve so as to be inserted into the cardiac valve. Accordingly, the cardiac valve fixing device of the present invention stably fixes the cardiac valve.

Abstract: In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions can be achieved through a reaction-preventative or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P).

Abstract: In using Ni(P) and Sn-rich solders in Pb free interconnections, the prevention and control of the formation of intermetallic compound inclusions, can be achieved through a reaction preventive or control layer that is positioned on top of an electroless Ni(P) metallization, such as by application of a thin layer of Sn on the Ni(P) or through the application of a thin layer of Cu on the Ni(P).

Abstract: A Thermal Interface Material (“TIM”) composition of matter with improved heat conductivity comprises solderable heat-conducting particles in a bondable resin matrix and at least some of the solderable heat-conducting particles comprise a solder surface. Positioning the TIM between a first surface having a solder adhesion layer and a second surface, and then heating it results in soldering some of the solderable heat-conducting particles to one another; and some to the solder-adhesion layer on the first surface as well as adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device, e.g., a semiconductor device and the second surface a heat sink, such as a solderable heat sink. A product comprises an article of manufacture made by the process.

Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

Abstract: A Thermal Interface Material (“TIM”) composition of matter with improved heat conductivity comprises solderable heat-conducting particles in a bondable resin matrix and at least some of the solderable heat-conducting particles comprise a solder surface. Positioning the TIM between a first surface having a solder adhesion layer and a second surface, and then heating it results in soldering some of the solderable heat-conducting particles to one another; and some to the solder-adhesion layer on the first surface as well as adhesively bonding the resin matrix to the first surface and the second surface. The first surface can comprise an electronic device, e.g., a semiconductor device and the second surface a heat sink, such as a solderable heat sink. A product comprises an article of manufacture made by the process.

Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

Abstract: An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.