Patents by Inventor Sung-kyu Han

Sung-kyu Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240250702
    Abstract: Methods and devices to support multiple frequency bands in radio frequency (RF) circuits are shown. The described methods and devices are based on adjusting the effective width of a transistor in such circuits by selectively disposing matching transistors in parallel with the transistor. The presented devices and methods can be used in RF circuits including low noise amplifiers (LNAs), RF receiver front-ends or any other RF circuits where input matching to wideband inputs is required.
    Type: Application
    Filed: April 3, 2024
    Publication date: July 25, 2024
    Inventors: Parvez DARUWALLA, Rong JIANG, Sung Kyu HAN, Khushali SHAH
  • Publication number: 20240235596
    Abstract: Methods and devices for limiting the power level of low noise amplifiers (LNA) implemented in radio frequency (RF) receiver front-ends. The described methods are applicable to bypass, low and high gain modes of the LNA. According to the described methods, the decoder allows the signal to be clamped before or after being attenuated. The benefit of such methods is to improve large signal performances (e.g. IIP3, P1dB) of the RF receiver front-end, while still meeting the clamping requirements, or improve (lower) clamped output power, while still meeting large signal performances (e.g. IIP3, P1dB).
    Type: Application
    Filed: October 31, 2023
    Publication date: July 11, 2024
    Inventors: Parvez DARUWALLA, Sung Kyu HAN
  • Publication number: 20240213932
    Abstract: New multi-input LNA architectures with improved passive mode negative gain performance that reconfigure the bypass path routes to achieve wide-band bypass matching and make bypass matching for lower frequency bands possible to achieve desired gain specifications. In a first embodiment, improved wide-band performance is provided by a bypass path that optionally does not pass through an impedance matching network and thus has a dedicated path to RFOUT. In a second embodiment, improved wide-band performance is provided by a bypass path that does not pass through an input inductor. In a third embodiment, improved wide-band performance is provided by a bypass path that has a first portion that optionally does not pass through an impedance matching network, and a second portion that does not pass through an input inductor. In a fourth embodiment, improved wide-band performance is provided by selectively disabling a load inductor in some modes of operation.
    Type: Application
    Filed: December 22, 2022
    Publication date: June 27, 2024
    Inventors: Rong Jiang, Sung Kyu Han, Parvez H. Daruwalla, Khushali Shah
  • Publication number: 20240137059
    Abstract: Methods and devices for limiting the power level of low noise amplifiers (LNA) implemented in radio frequency (RF) receiver front-ends. The described methods are applicable to bypass, low and high gain modes of the LNA. According to the described methods, the decoder allows the signal to be clamped before or after being attenuated. The benefit of such methods is to improve large signal performances (e.g. IIP3, P1dB) of the RF receiver front-end, while still meeting the clamping requirements, or improve (lower) clamped output power, while still meeting large signal performances (e.g. IIP3, P1dB).
    Type: Application
    Filed: October 30, 2023
    Publication date: April 25, 2024
    Inventors: Parvez DARUWALLA, Sung Kyu HAN
  • Patent number: 11539382
    Abstract: Methods and devices to support multiple frequency bands in radio frequency (RF) circuits are shown. The described methods and devices are based on adjusting the effective width of a transistor in such circuits by selectively disposing matching transistors in parallel with the transistor. The presented devices and methods can be used in RF circuits including low noise amplifiers (LNAs), RF receiver front-ends or any other RF circuits where input matching to wideband inputs is required.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: December 27, 2022
    Assignee: PSEMI CORPORATION
    Inventors: Parvez Daruwalla, Rong Jiang, Sung Kyu Han, Khushali Shah
  • Patent number: 11381268
    Abstract: Methods and devices for limiting the power level of low noise amplifiers (LNA) implemented in radio frequency (RF) receiver front-ends. The described methods are applicable to bypass, low and high gain modes of the LNA. According to the described methods, the decoder allows the signal to be clamped before or after being attenuated. The benefit of such methods is to improve large signal performances (e.g. IIP3, P1dB) of the RF receiver front-end, while still meeting the clamping requirements, or improve (lower) clamped output power, while still meeting large signal performances (e.g. IIP3, P1dB).
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: July 5, 2022
    Assignee: PSEMI CORPORATION
    Inventors: Parvez Daruwalla, Sung Kyu Han
  • Patent number: 6462331
    Abstract: An ion implantation apparatus for integrated circuit manufacturing is disclosed. In an apparatus in accordance with an embodiment of the invention, a current detector detects a current flowing to a turbo pump. A display displays information about the detected current, and a controller determines whether the detected current is within a specified range. If the detected current is not within the specified range, the controller issues a power control signal to, stop the turbo pump. At this time, the controller also stops an ion implantation of the apparatus.
    Type: Grant
    Filed: May 25, 1999
    Date of Patent: October 8, 2002
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sun-Bong Choi, Dong-Ha Lim, Hyo-Sang Jung, Sung-Kyu Han
  • Patent number: 6200903
    Abstract: A semiconductor device is manufactured by forming a thin layer over a semiconductor substrate, coating photoresist on the thin layer, forming a photoresist pattern over the semiconductor substrate, injecting ions into the photoresist pattern so as to harden the photoresist pattern, and etching the thin layer by using the hardened photoresist pattern as an etch mask. The hardened photoresist pattern has an increased etch selectivity with respect to an underlying layer, allowing the use of thinner photoresist layers and improved etching.
    Type: Grant
    Filed: September 20, 1999
    Date of Patent: March 13, 2001
    Assignee: Samsung Electronics, Co., Ltd.
    Inventors: Sang-kuen Oh, Sung-kyu Han, Yeon-sang Hwang, Dong-ha Lim, Jung-ki Kim