Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: A method includes forming a material layer over a substrate, forming a first hard mask (HM) layer over the material layer, forming a first trench, along a first direction, in the first HM layer. The method also includes forming first spacers along sidewalls of the first trench, forming a second trench in the first HM layer parallel to the first trench, by using the first spacers to guard the first trench. The method also includes etching the material layer through the first trench and the second trench, removing the first HM layer and the first spacers, forming a second HM layer over the material layer, forming a third trench in the second HM layer. The third trench extends along a second direction that is perpendicular to the first direction and overlaps with the first trench. The method also includes etching the material layer through the third trench.

Abstract: A bonded semiconductor structure includes a first device wafer and a second device wafer. The first device includes a first dielectric layer, a first bonding pad disposed in the first dielectric layer, and a first bonding layer on the first dielectric layer. The second device wafer includes a second dielectric layer, a second bonding layer on the second dielectric layer, and a second bonding pad disposed in the second dielectric layer and extending through the second bonding layer and at least a portion of the first bonding layer. A conductive bonding interface between the first bonding pad and the second bonding pad and a dielectric bonding interface between the first bonding layer and the second bonding layer include a step-height in a direction perpendicular to the dielectric bonding interface and the conductive bonding interface.

Abstract: An ophthalmic device includes an optic including an optic axis and a closed-loop haptic structure coupled to the optic via a frame surrounding the optic, the closed-loop haptic structure including a closed loop extending from first and second attachment points to the frame. The closed loop includes a first hinge and a second hinge. The first hinge has a first section having a first component extending in a first angular direction, a second section having a second component extending in a second angular direction opposite to the first angular direction, and a first connecting section between the first section and the second section. The second hinge has a third section having a third component extending in the second angular direction, a fourth section having a fourth component extending in the first angular direction, the fourth section being connected to the second section to form the closed loop.

Abstract: A method includes providing a substrate having a surface such that a first hard mask layer is formed over the surface and a second hard mask layer is formed over the first hard mask layer, forming a first pattern in the second hard mask layer, where the first pattern includes a first mandrel oriented lengthwise in a first direction and a second mandrel oriented lengthwise in a second direction different from the first direction, and where the first mandrel has a top surface, a first sidewall, and a second sidewall opposite to the first sidewall, and depositing a material towards the first mandrel and the second mandrel such that a layer of the material is formed on the top surface and the first sidewall but not the second sidewall of the first mandrel.

Abstract: A resonant vibration actuator is provided, comprising: a casing, a mover, a plurality of electromagnet sets, two elastic suspensions, and a connecting circuit; the casing is provided with connection terminals for connection on the outside; the mover comprising: a mover frame, a plurality of permanent magnet units, two magnetic backs, the permanent magnet units and the magnetic backs being arranged in the mover frame; the electromagnet sets being arranged between two permanent magnet units of the mover; the elastic suspensions being connected to the casing and the mover respectively through two connection portions at both ends; the connecting circuit being used to connect the electromagnet set and the connection terminals outside the casing; wherein, by energizing the electromagnet set, the electromagnet acts on the permanent magnet unit to make the mover move relatively in the casing to generate vibration.

Abstract: A test interface circuit includes N switches and N resistors, wherein N is a positive integer. A first end of each of the N switches is coupled to each of N test connection ends, a second end of each of the N switches receives a reference voltage. Each of the N first resistors is coupled to each of the N switches in series between each of the N test connection ends and the reference voltage. Wherein, each of the N switches is controlled by each of N control signals to be turned on or cut off.

Abstract: A system is configured for reconfiguration of a Synchronization Signal Block (SSB) pattern. The system is configured for obtaining data including a configuration for a Synchronization Signal Block (SSB) transmission carrying a physical broadcast channel (PBCH), the configuration specifying, for an SSB of the configuration, resource elements (REs) allocated for transmitting a primary synchronization signal (PSS) to a user equipment (UE) and REs allocated for transmitting a secondary synchronization signal (SSS) to the UE. The system is configured for selecting a set of REs that are unused in the configuration for the SSB transmission, specifying a filling sequence for extending a synchronization signal or an SSB to the set of REs that are unused in the configuration of the SSB transmission, generating data including an enhanced configuration for the SSB transmission that includes the extended synchronization signal or the extended SSBs, and transmitting the SSB transmission using the enhanced configuration.

Abstract: A system is configured for reconfiguration of a Synchronization Signal Block (SSB) pattern. The system is configured for obtaining data including a configuration for a Synchronization Signal Block (SSB) transmission carrying a physical broadcast channel (PBCH), the configuration specifying, for an SSB of the configuration, resource elements (REs) allocated for transmitting a primary synchronization signal (PSS) to a user equipment (UE) and REs allocated for transmitting a secondary synchronization signal (SSS) to the UE. The system is configured for selecting a set of REs that are unused in the configuration for the SSB transmission, specifying a filling sequence for extending a synchronization signal or an SSB to the set of REs that are unused in the configuration of the SSB transmission, generating data including an enhanced configuration for the SSB transmission that includes the extended synchronization signal or the extended SSBs, and transmitting the SSB transmission using the enhanced configuration.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: A method for forming a bonded semiconductor structure is disclosed. A first device wafer having a first bonding layer and a first bonding pad exposed from the first bonding layer and a second device wafer having a second bonding layer and a second bonding pad exposed from the second bonding layer are provided. Following, a portion of the first bonding pad is removed until a sidewall of the first bonding layer is exposed, and a portion of the second bonding layer is removed to expose a sidewall of the second bonding pad. The first device wafer and the second device wafer are then bonded to form a dielectric bonding interface between the first bonding layer and the second bonding layer and a conductive bonding interface between the first bonding pad and the second bonding pad. The conductive bonding interface and the dielectric bonding interface comprise a step-height.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: Methods of forming line-end extensions and devices having line-end extensions are provided. In some embodiments, a method includes forming a patterned photoresist on a first region of a hard mask layer. A line-end extension region is formed in the hard mask layer. The line-end extension region extends laterally outward from an end of the first region of the hard mask layer. The line-end extension region may be formed by changing a physical property of the hard mask layer at the line-end extension region.

Abstract: A force sensing module with vibration feedback is disclosed, comprising: a substrate, a frame and a plurality of magnetic sensors; the substrate is disposed with at least one tactile actuator, and the substrate has a touch operation surface and a mounting surface on opposite sides, the tactile actuator is mounted on the mounting surface; the frame is disposed with at least three buffer spacers, the buffer spacers connect the frame to the substrate; the magnetic sensor includes a magnet and a Hall element, one of the magnet and the Hall element is disposed on the frame, and the other is disposed on the substrate; thereby when a force is applied on the touch operation surface to make the substrate generate an offset, the Hall element outputs a force signal due to the voltage change caused by the approaching magnet, and the signal drives the tactile actuator to generate a vibration feedback.

Abstract: A force sensing module with vibration feedback is disclosed, comprising: a substrate, a frame and a plurality of magnetic sensors; the substrate is disposed with at least one tactile actuator, and the substrate has a touch operation surface and a mounting surface on opposite sides, the tactile actuator is mounted on the mounting surface; the frame is disposed with at least three buffer spacers, the buffer spacers connect the frame to the substrate; the magnetic sensor includes a magnet and a Hall element, one of the magnet and the Hall element is disposed on the frame, and the other is disposed on the substrate; thereby when a force is applied on the touch operation surface to make the substrate offset, the Hall element output a force signal due to the voltage change caused by approaching magnet, and the signal drives the tactile actuator to generate a vibration feedback.

Abstract: A facial recognition method comprises obtaining an image to be recognized, determining whether the image to be recognized belongs to one of image groups of at least one user, determining whether an image number of a determined image group is less than a preset number when the image to be recognized belongs to the determined image group in the image groups, deleting one of facial images in the determined image group according to time parameters of the facial images in the determined image group and performing an image group updating procedure when the image number of the determined image group is not less than the preset number, and performing the image group updating procedure when the image number of the determined image group is less than the preset number.

Abstract: A tactile feedback device for producing uniform vibration in an effective area is provided, including: a substrate, a vibration motor, a frame, and a plurality of cushion pads; the vibration motor is fixed on the substrate at an off-center position and can vibrate back-and-forth in a first direction; the frame forms a plurality of bonding areas and at least a pair of cantilever beams, the cantilever beams are located on both sides of the first direction and parallel to a second direction, the second direction is perpendicular to the first direction, and the cantilever beams are partially fixed to the substrate; the cushion pads are fixed between the substrate and the bonding area; thereby, the tactile feedback of uniform vibration can be obtained when contacting each operation position of the substrate.

Abstract: A slim type tactile feedback device is disclosed, including: a substrate, at least an overlapping plate, a support frame, a plurality of cushions and a vibration source; the overlapping plate being fixed to the substrate in a cantilever manner; the support frame including a frame, a void area, and at least a protruding support, the protruding support being a partial segment of the frame; the cushions being fixed between the substrate and the frame; the vibration source including a magnet set and a coil set, the magnet set and the coil set being fixed between the protruding support and the overlapping plate and located at outer side the substrate; the coil set and the magnet set being positioned correspondingly to each other and separated by a gap, the gap increasing when the substrate being pressed by finger, and the substrate moving back-and-forth through linkage motion of the vibration source.

Abstract: A linear vibration actuator motor comprises a housing, a coil, a conductive sheet, a bracket, a magnet assembly and two elastic members. The coil is fixed to the bottom wall of the housing. The conductive sheet is fixed to the top wall of the housing and is located above the coil. The bracket is disposed in an accommodating space of the housing, forming framed space, and located above the coil and below the conductive sheet. The magnet assembly is disposed in the framed space above the coil and directly below the conductive sheet. The two elastic members are respectively located between two ends of the bracket and the inner side of two side walls of the housing. Thereby, the invention utilizes the induced current to provide resistance to achieve the damping effect against the motion of the assembly of the bracket and the magnet set with respect to conductive sheet.