Patents by Inventor Sung M. Sim

Sung M. Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for manufacturing lead frame for semiconductor package
    Patent number: 5633206
    Abstract: A process for manufacturing a lead frame having a pad, inner leads, outer leads and dambars, the lead frame being coated with a film on the back surface of the pad, which includes the steps of preparing a lead frame having a pad, inner leads and outer leads; placing a polyamic acid film on the back surface of the pad without using adhesive; and thermally compressing the polyamic acid film by using a heat; generator, to form polyimide film and simultaneously adhere that to the polyimide film the back surface of the pad.
    Type: Grant
    Filed: November 14, 1995
    Date of Patent: May 27, 1997
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang H. Kim, Sung M. Sim, In P. Hong, Sang G. Lee