Patents by Inventor Sung Min CHAE

Sung Min CHAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FLEXIBLE CIRCUIT BOARD AND CHIP PACKAGE INCLUDING SAME
    Publication number: 20230282590
    Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.
    Type: Application
    Filed: May 15, 2023
    Publication date: September 7, 2023
    Inventors: Jun Young LIM, Hyung Kyu YOON, Sung Min CHAE
  • FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE COMPRISING THE SAME
    Publication number: 20230225048
    Abstract: A flexible circuit board comprises a substrate on which a chip mounting area is defined, a circuit pattern disposed on the substrate, and a protective layer on the circuit pattern, and the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of dummy patterns, and the first circuit pattern includes a first pad part, a second pad part, and a first wiring part connected to the first pad part and the second pad part, and the second circuit pattern includes a third pad part, a fourth pad part, and a second wiring part connected to the third pad part and the fourth pad part, and a through hole is disposed in an inner region of the first circuit pattern.
    Type: Application
    Filed: January 9, 2023
    Publication date: July 13, 2023
    Inventors: Seung Soo CHO, Hyung Kyu YOON, Sung Min CHAE
  • Flexible circuit board and chip package including same
    Patent number: 11694964
    Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: July 4, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jun Young Lim, Hyung Kyu Yoon, Sung Min Chae
  • FLEXIBLE CIRCUIT BOARD AND CHIP PACKAGE INCLUDING SAME
    Publication number: 20220148976
    Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.
    Type: Application
    Filed: December 22, 2021
    Publication date: May 12, 2022
    Inventors: Jun Young Lim, Hyung Kyu Yoon, Sung Min Chae
  • Flexible circuit board and chip package including same
    Patent number: 11239172
    Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: February 1, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jun Young Lim, Hyung Kyu Yoon, Sung Min Chae
  • FLEXIBLE CIRCUIT BOARD AND CHIP PACKAGE INCLUDING SAME
    Publication number: 20200243452
    Abstract: A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.
    Type: Application
    Filed: October 25, 2018
    Publication date: July 30, 2020
    Inventors: Jun Young LIM, Hyung Kyu YOON, Sung Min CHAE