Abstract: Disclosed are a backlight unit and a display device. The backlight unit includes alight emitting module including a plurality of light emitting devices; a controller for controlling an operation of the light emitting module; a light guide plate disposed at one side of the light emitting module; and an optical member disposed on or under the light guide plate. The light emitting module includes a first light emitting device and a second light emitting device. Light linearity of the first light emitting device is superior to light linearity of the second light emitting device, and a light orientation angle of the first light emitting device is smaller than a light orientation angle of the second light emitting device. The controller selectively drives the first and second light emitting devices.

Abstract: Disclosed are a light emitting device package and a light emitting apparatus. The light emitting device package comprises a package body comprising a light emitting surface inclined at an oblique angle with respect to a bottom surface, a plurality of lead electrodes in the package body, and at least one light emitting device electrically connected to the lead electrodes.

Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.

Abstract: Embodiments of a light emitting device and a method for fabricating the same are provided. The light emitting device comprises a cavity and one or more light emitting elements. The cavity is formed to a depth of 450 ?m or less, and the light emitting elements are installed in the cavity. A fabricating method includes forming a package body having a cavity with a depth of 250 ?m to 450 ?m and at least one lead frame disposed at the bottom surface of the cavity, mounting at least one light emitting element on the lead frame, and molding a molding member in the cavity.

Abstract: Provided is a light emitting device package. The light emitting device package comprises a housing, first and second lead frames, and a light emitting device. The housing comprises a front opening and side openings. The first and second lead frames pass through the housing to extend to an outside. A portion of each lead frame being exposed through the front opening. The light emitting device is in the front opening and electrically connected to the first and second lead frames. A protrusion protruding in a direction of the side opening is formed on an inner surface of the side opening.

Abstract: Disclosed is an LED package. The LED package includes a package body, a first frame and a second frame on the package body and a light emitting device chip on the first frame. The first frame is separated from the second frame, and the first frame includes a bottom frame on the package body and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.

Abstract: A light emitting device includes a body having a first recess; a barrier section having a second recess and a third recess, protruding upward over a bottom surface of the first recess, and dividing the bottom surface of the first recess into a first region and a second region; a first light emitting diode disposed in the first region; a second light emitting diode disposed in the second region; a first lead electrode disposed in the first region; a second lead electrode disposed in the second region; a first wire electrically connecting the first lead electrode to the second light emitting diode through the second recess; and a second wire electrically connecting the second lead electrode to the first light emitting diode through the third recess.

Abstract: A light emitting device includes a body having a recess; a barrier section protruding upward over a bottom surface of the recess and dividing the bottom surface of the recess into a plurality of regions; a plurality of light emitting diodes including a first diode disposed in a first region of the bottom surface of the recess and a second diode disposed in a second region of the bottom surface of the recess; a plurality of lead electrodes spaced apart from each other in the recess and selectively connected to the light emitting diodes; wires connecting the lead electrodes to the light emitting diodes; a resin layer in the recess; and at least one concave part in the barrier section. The concave part has a height lower than a top surface of the barrier section and higher than the bottom surface of the recess and the wires are provided in the concave part to connect the lead electrodes to the light emitting diodes disposed in opposition to each other.

Abstract: Disclosed is an LED package. The LED package includes a package body, a semiconductor light emitting device on the package body and at least one of frames on the package body. At least one of the frames includes a bottom frame on the package body, and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.

Abstract: Disclosed is an LED package. The LED package includes a package body, a semiconductor light emitting device on the package body and at least one of frames on the package body. At least one of the frames includes a bottom frame on the package body, and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame.

Abstract: Discussed is a semiconductor LED package. The semiconductor LED package includes a packet body having a cavity, a semiconductor light emitting device in the cavity of the package body; and a plurality of reflective frames, each of the reflective frames having a bottom frame in the cavity of the package body, and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame, wherein the plurality of reflective frames are electrically separated from each other.

Abstract: Discussed is an LED package The LED package includes a body having a cavity at one side thereof, at least one of lead frames having a bottom frame and a sidewall frame in the cavity, and a light emitting device electrically connected with the lead frames.

Abstract: Discussed is a semiconductor LED package. The semiconductor LED package includes a packet body having a cavity, a semiconductor light emitting device in the cavity of the package body; and a plurality of reflective frames, each of the reflective frames having a bottom frame in the cavity of the package body, and at least two sidewall frames extending from the bottom frame and inclined with respect to the bottom frame, wherein the plurality of reflective frames are electrically separated from each other.

Abstract: A light emitting device includes a body having a recess; a barrier section protruding upward over a bottom surface of the recess and dividing the bottom surface of the recess into a plurality of regions; a plurality of light emitting diodes including a first diode disposed in a first region of the bottom surface of the recess and a second diode disposed in a second region of the bottom surface of the recess; a plurality of lead electrodes spaced apart from each other in the recess and selectively connected to the light emitting diodes; wires connecting the lead electrodes to the light emitting diodes; a resin layer in the recess; and at least one concave part in the barrier section. The concave part has a height lower than a top surface of the barrier section and higher than the bottom surface of the recess and the wires are provided in the concave part to connect the lead electrodes to the light emitting diodes disposed in opposition to each other.

Abstract: Disclosed are a phosphor, a coating phosphor composition, a method for preparing the phosphor, and a light emitting device. A silicate-based phosphor is expressed in a chemical formula of (4-x-y-z)SrO.xBaO.zCaO.aMgO.2(SiO2).bM2O3:yEu, wherein M is at least one of Y, Ce, La, Nd, Gd, Tb, Yb or Lu, in which 0<x?3.95, 0<y?1, 0?z<3.95, x+y+z<4, 0<a<2, and 0<b<1.

Abstract: Disclosed are a backlight unit and a display device. The backlight unit includes alight emitting module including a plurality of light emitting devices; a controller for controlling an operation of the light emitting module; a light guide plate disposed at one side of the light emitting module; and an optical member disposed on or under the light guide plate. The light emitting module includes a first light emitting device and a second light emitting device. Light linearity of the first light emitting device is superior to light linearity of the second light emitting device, and a light orientation angle of the first light emitting device is smaller than a light orientation angle of the second light emitting device. The controller selectively drives the first and second light emitting devices.

Abstract: Discussed is an LED package The LED package includes a body having a cavity at one side thereof, at least one of lead frames having a bottom frame and a sidewall frame in the cavity, and a light emitting device electrically connected with the lead frames.

Abstract: Disclosed is an LED package. The LED package comprises a body comprising a cavity at one side thereof, at least one of lead frames comprising a bottom frame and a sidewall frame in the cavity, and a light emitting device electrically connected with the lead frames.

Abstract: Provided is a light emitting device package. The light emitting device package comprises a housing, first and second lead frames, and a light emitting device. The housing comprises a front opening and side openings. The first and second lead frames pass through the housing to extend to an outside. A portion of each lead frame being exposed through the front opening. The light emitting device is in the front opening and electrically connected to the first and second lead frames. A protrusion protruding in a direction of the side opening is formed on an inner surface of the side opening.

Abstract: Disclosed is an LED package. The LED package comprises a body comprising a cavity at one side thereof, at least one of lead frames comprising a bottom frame and a sidewall frame in the cavity, and a light emitting device electrically connected with the lead frames.