Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: The present invention relates to a fingerprint sensor module having excellent sensing sensitivity, to a portable electronic device including same, and to a method for manufacturing same. According to one embodiment of the present invention, a fingerprint sensor module is provided which includes: a sensing unit formed on a substrate using a conductive body; a fingerprint sensor having a sensor circuit unit electrically connected to the sensing unit; a bracket accommodating the sensing unit and receiving the fingerprint sensor; and a post-processing layer positioned on a contact surface formed on the bracket so as to face the upper surface of the sensing unit. The sum of the thickness of a supporting layer between the upper surface of the sensing unit and the contact surface, and the thickness of the post-processing layer is 0.04 mm to 0.06 mm.

Abstract: The present invention relates to a fingerprint sensor module having excellent sensing sensitivity, to a portable electronic device including same, and to a method for manufacturing same. According to one embodiment of the present invention, a fingerprint sensor module is provided which includes: a sensing unit formed on a substrate using a conductive body; a fingerprint sensor having a sensor circuit unit electrically connected to the sensing unit; a bracket accommodating the sensing unit and receiving the fingerprint sensor; and a post-processing layer positioned on a contact surface formed on the bracket so as to face the upper surface of the sensing unit. The sum of the thickness of a supporting layer between the upper surface of the sensing unit and the contact surface, and the thickness of the post-processing layer is 0.04 mm to 0.06 mm.

Abstract: The present invention relates to a fingerprint sensor module having excellent sensing sensitivity, to a portable electronic device including same, and to a method for manufacturing same. According to one embodiment of the present invention, a fingerprint sensor module is provided which includes: a sensing unit formed on a substrate using a conductive body; a fingerprint sensor having a sensor circuit unit electrically connected to the sensing unit; a bracket accommodating the sensing unit and receiving the fingerprint sensor; and a post-processing layer positioned on a contact surface formed on the bracket so as to face the upper surface of the sensing unit. The sum of the thickness of a supporting layer between the upper surface of the sensing unit and the contact surface, and the thickness of the post-processing layer is 0.04 mm to 0.06 mm.

Abstract: The present invention relates to a fingerprint sensor module having excellent sensing sensitivity, to a portable electronic device including same, and to a method for manufacturing same. According to one embodiment of the present invention, a fingerprint sensor module is provided which includes: a sensing unit formed on a substrate using a conductive body; a fingerprint sensor having a sensor circuit unit electrically connected to the sensing unit; a bracket accommodating the sensing unit and receiving the fingerprint sensor; and a post-processing layer positioned on a contact surface formed on the bracket so as to face the upper surface of the sensing unit. The sum of the thickness of a supporting layer between the upper surface of the sensing unit and the contact surface, and the thickness of the post-processing layer is 0.04 mm to 0.06 mm.

Abstract: Digital multimedia broadcasting watching method using direct input of DMB channel number in terminal and apparatus are disclosed. A method of receiving digital multimedia broadcasting (DMB) programs on a mobile terminal, comprises: recognizing a DMB channel number being input through a keypad of the mobile terminal; recognizing a DMB hotkey input proximate in time to the DMB channel number; checking if there exists a DMB channel corresponding to the DMB channel number; tuning to the DMB channel corresponding to the DMB channel number if the channel exists; and outputting a content being received through the DMB channel.