Abstract: A germanium single-crystal wafer comprises silicon with an atomic concentration of from 3×1014 atoms/cc to 10×1013 atoms/cc, boron with an atomic concentration of from 1×1016 atoms/cc to 10×1018 atoms/cc, and gallium with an atomic concentration of from 1×1016 atoms/cc to 10×1019 atoms/cc. Further provided are a method for preparing the germanium single-crystal wafer, a method for preparing a germanium single-crystal ingot, and the use of the germanium single-crystal wafer for increasing the open-circuit voltage of a solar cell. The germanium single-crystal wafer has an improved electrical property in that it has a smaller difference in resistivity and carrier concentration.

Abstract: A {100} indium phosphide (InP) wafer has multiplies of olive-shaped etch pits on the back side surface of the wafer, wherein the olive shape refers to a shape with its both ends being narrow and its middle being wide, e.g., an oval shape. A method of manufacturing the {100} indium phosphide wafer comprises: etching the wafer by immersing it into an etching solution to produce etch pits; washing the wafer with deionized water; protecting the back side surface of the wafer; mechanical polishing and chemical polishing the front side surface of the wafer, and then washing it with deionized water; de-protecting the back side surface of the wafer; wherein the etching solution comprises an acidic substance, deionized water and an oxidizing agent. The wafer can be heated uniformly during the epitaxial growth and thus displays good application effect.

Abstract: A {100} indium phosphide (InP) wafer has multiplies of olive-shaped etch pits on the back side surface of the wafer, wherein the olive shape refers to a shape with its both ends being narrow and its middle being wide, e.g., an oval shape. A method of manufacturing the {100} indium phosphide wafer comprises: etching the wafer by immersing it into an etching solution to produce etch pits; washing the wafer with deionized water; protecting the back side surface of the wafer; mechanical polishing and chemical polishing the front side surface of the wafer, and then washing it with deionized water; de-protecting the back side surface of the wafer; wherein the etching solution comprises an acidic substance, deionized water and an oxidizing agent. The wafer can be heated uniformly during the epitaxial growth and thus displays good application effect.

Abstract: A monocrystalline germanium wafer that increases the open-circuit voltage of multijunction solar cells, a method for preparing the monocrystalline germanium wafer and a method for preparing an ingot from which the monocrystalline germanium wafer is prepared. The monocrystalline germanium wafer that increases the open-circuit voltage of the bottom cell of multijunction solar cells is prepared by adjusting the amounts of the co-dopants silicon and gallium in the monocrystalline germanium wafer, the ratio of silicon to gallium in the preparation of the monocrystalline germanium.

Abstract: A {100} indium phosphide (InP) wafer with pits distributed on the back side thereof, a method and an etching solution for manufacturing thereof are provided, wherein the pits on the back side have an elongated shape with a maximum dimension of the long axis of 65 ?m, and the pits have a maximum depth of 6.0 ?m. The {100} indium phosphide (InP) wafer has controllable pits distribution on the back side, thus provide a controllable emissivity of the wafer back side surface for better control of wafer back side heating during the epitaxial growth.

Abstract: A monocrystalline germanium wafer that increases the open-circuit voltage of multijunction solar cells, a method for preparing the monocrystalline germanium wafer and a method for preparing an ingot from which the monocrystalline germanium wafer is prepared. The monocrystalline germanium wafer that increases the open-circuit voltage of the bottom cell of multijunction solar cells is prepared by adjusting the amounts of the co-dopants silicon and gallium in the monocrystalline germanium wafer, the ratio of silicon to gallium in the preparation of the monocrystalline germanium.

Abstract: A {100} indium phosphide (InP) wafer with pits distributed on the back side thereof, a method and an etching solution for manufacturing thereof are provided, wherein the pits on the back side have an elongated shape with a maximum dimension of the long axis of 65 ?m, and the pits have a maximum depth of 6.0 ?m. The {100} indium phosphide (InP) wafer has controllable pits distribution on the back side, thus provide a controllable emissivity of the wafer back side surface for better control of wafer back side heating during the epitaxial growth.

Abstract: A process evaluates an aging property of a distributed Bragg reflector (DBR) laser. The process includes illuminating a Bragg grating of the distributed Bragg reflector (DBR) laser with light while the DBR laser is both supplied a tuning current and not lasing. The process also includes performing an action to the DBR laser responsive to a wavelength of a Bragg peak in a portion of the light reflected by the Bragg grating and a value of the tuning current supplied during the illuminating.

Abstract: The RT regions of an ISB light emitter comprise pre-biased SLs and a multiplicity of split quantum wells (SPQWs). A SPQW is a quantum well that is divided into a multiplicity of sub-wells by a first barrier layer sufficiently thin that the upper and lower energy states are split beyond their natural broadening and contribute to different minibands in each RT region. In contrast, adjacent SPQWs are coupled to one another by second barrier layers. The thicknesses of the latter layers are chosen so that minibands are created across each RT region. In one embodiment, the emitter includes an I/R region between adjacent RT regions, and in another embodiment the I/R regions are omitted.

Abstract: An intersubband (ISB) optical device comprises first quantum well (QW) interior regions having upper and lower energy states between which ISB transitions take place; and superlattice (SL) barrier regions interposed between the first QW interior regions. The SL barrier regions include second barriers and second QW interior regions, with the second QW interior regions being interposed between the second barrier regions. The first QW interior regions and the SL barrier regions are configured to produce an energy gap between the upper and lower states that is larger than the energy of a 1.7 &mgr;m wavelength photon. In accordance with another aspect of our invention, an intersubband optical device comprises a core region that includes a multiplicity of repeat units (RUs), each RU including a first barrier region and a QW active region disposed adjacent thereto, characterized in that (1) each of the QWs has upper and lower energy states separated by an energy greater than that of a 1.

Abstract: An article comprising a QC-DFB laser is disclosed. In the QC-DFB laser, an overlying grating structure achieves relatively strong coupling of the guided mode to the grating, and is thus highly effective in inducing single-mode operation even under cw operating conditions. The grating structure includes grooves etched in a plasmon-enhanced confinement layer (PECL) disposed adjacent and in contact with an upper metallic electrode. The grating structure and the PECL are designed such that in the grooves, the laser mode travelling in the waveguide can couple efficiently to the surface-plasmon at the electrode interface. This results in strong modulation of the laser mode, leading to strong modulation of, inter alia, the effective refractive index.

Abstract: An intersubband semiconductor light source comprises a core region that includes a unipolar, radiative transition (RT) region having upper and lower energy levels, an injector-only (I) region disposed on one side of the RT region, and a reflector/extractor-only (R/E) region disposed on the other side of the RT region. The I region has a first miniband of energy levels aligned so as to inject electrons into the upper energy level, and the R/E region has a second miniband of energy levels aligned so as to extract electrons from the lower energy level. The R/E region also has a minigap aligned so as to inhibit the extraction of electrons from the upper level. A suitable voltage applied across the core region is effective to cause the RT region to generate light at a wavelength determined by the energy difference between the upper and lower energy levels. Low voltage operation at less than 3 V is described.

Abstract: A method of forming selected Group III-nitride regions uses a masking layer to cause differential growth between single crystal Group III-nitride material and polycrystalline Group III-nitride material. The epitaxial process is chosen to provide vertical growth so as to allow for replication of the mask edges at the defined limits for the selected regions. By using an etchant that is selective between polycrystalline and single crystal Group III-nitride material, the polycrystalline material (that grew over the mask layer) can be removed, leaving only the single crystal Group III-nitride (that grew over the exposed substrate material).

Abstract: The specification describes a method for producing black phosphorus from red phosphorus by thermally cycling red phosphorus in a vacuum between 360-400.degree. C. and 200-240.degree. C., whereupon the red phosphorous undergoes an allotropic phase change to black phosphorus.

Abstract: A quantum cascade (QC) laser has a multilayer core region comprising alternating layers of a first and a second semiconductor material, with lattice constants a.sub.1 and a.sub.2, respectively. The first material is selected such that a.sub.1 >a.sub.0, where a, is the lattice constant of the substrate (typically InP), and the second material is selected such that a.sub.2 >a.sub.0. The materials are also selected such that the conduction band discontinuity .DELTA.E.sub.c between the first and second materials is greater than 520 meV in absolute value. The multilayer core comprises a multiplicity of essentially identical multilayer repeat units. The layer thicknesses and materials of the repeat units are selected to substantially provide strain compensation over a repeat unit. QC lasers according to this invention preferably comprise a distributed feedback feature, (e.g.