Patents by Inventor Sung-noh LEE

Sung-noh LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bumper for vehicle
    Patent number: 11780390
    Abstract: A bumper for vehicle may include an injection-molded bumper cover; and a reinforcing structure provided in a linear shape with fiber reinforced composite material and coupled by direct fitting onto a rear surface of the bumper cover to reinforce a rear side of the bumper cover.
    Type: Grant
    Filed: October 4, 2021
    Date of Patent: October 10, 2023
    Assignees: Hyundai Motor Company, Kia Corporation, Seoyon E-Hwa Co., Ltd.
    Inventors: Ju-han Shin, Sung-noh Lee, Dong Eun Cha, Ki Hong Lee, Dae Hee Lee
  • BUMPER FOR VEHICLE
    Publication number: 20220105885
    Abstract: A bumper for vehicle may include an injection-molded bumper cover; and a reinforcing structure provided in a linear shape with fiber reinforced composite material and coupled by direct fitting onto a rear surface of the bumper cover to reinforce a rear side of the bumper cover.
    Type: Application
    Filed: October 4, 2021
    Publication date: April 7, 2022
    Applicants: Hyundai Motor Company, Kia Corporation, Seoyon E-Hwa Co., Ltd.
    Inventors: Ju-han SHIN, Sung-noh LEE, Dong Eun CHA, Ki Hong LEE, Dae Hee LEE