Abstract: A display device may include: a substrate including a display area and a non-display area; and pixels in the display area, and each including sub-pixels. Each sub-pixel may include a pixel circuit layer, and a display element layer including at least one light emitting element. The display element layer may include: a first electrode on the pixel circuit layer; a second electrode on the first electrode and electrically insulated from the first electrode; the light emitting element including a first end portion coupled to the first electrode and a second end portion coupled to the second electrode, and between the first electrode and the second electrode; an intermediate layer enclosing at least one area of the light emitting element, and on the first electrode; a connection line electrically connected to the second electrode. The second electrode may be on the intermediate layer.

Abstract: A display device comprises a first electrode, a second electrode disposed to be spaced apart from the first electrode and face the first electrode, a first insulating layer disposed to cover the first electrode and the second electrode, a second insulating layer disposed on at least a part of the first insulating layer and exposing at a part of a region where the first electrode and the second electrode overlaps the first insulating layer and at least one light emitting element on the exposed first insulating layer between the first electrode and the second electrode, wherein the second insulating layer includes at least one opening exposing the first insulating layer and disposed to be spaced apart from each other on a region where the first electrode and the second electrode face each other, and a bridge portion between the openings, and the light emitting element is disposed on the opening.

Abstract: A complementary thin film transistor (TFT) includes a substrate and a first TFT and a second TFT disposed on the substrate, wherein a first conductive semiconductor layer of the first TFT and a second gate electrode layer of the second TFT are disposed in the same layer and include the same material.

Abstract: A display device includes a first electrode and a second electrode that are spaced apart from and facing each other; a light-blocking layer disposed above the first electrode and the second electrode; and at least one light-emitting element disposed between the first electrode and the second electrode. The light-blocking layer includes a light-blocking portion absorbing light and an opening pattern. The light-blocking portion includes an area partially overlapping the first electrode and the second electrode. The at least one opening pattern exposes portions of the first and second electrodes facing each other and at least a portion of an area between the first and second electrodes facing each other. The at least one light-emitting element overlaps the at least one opening pattern.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: The present invention relates to a method for manufacturing a lithium secondary battery separator comprising the following steps: a step of surface-modifying inorganic particles using a coupling agent; a step of mixing the surface-modified inorganic particles with a polymer; and a step of irradiating an electron beam to the mixed inorganic particles and polymer. The method for manufacturing a lithium secondary battery separator provided in one aspect of the present invention has an effect that a lithium secondary battery separator having improved mechanical and thermal properties can be manufactured.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: The present invention relates to a nondestructive inspection apparatus and method for micro defect inspection, and more particularly, to a nondestructive inspection apparatus and method, which is capable of magnifying and observing a nondestructive inspection result while maintaining a resolution of the same when micro defect inspection is performed through a nondestructive inspection using beams. The nondestructive inspection apparatus for micro defect inspection includes a light source unit configured to project a beam to an object, a light detection unit having at least one surface contacting the object to generate light by detecting the beam that is transmitted through the object and arrived, an optical unit configured to form an image by using the light generated from the light detection unit, and a defect detector configured to determine whether a defect is generated by using the image.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: A touch window according to an embodiment comprises: a substrate; a sensing electrode arranged on the substrate; and a reflection prevention layer arranged on the sensing electrode, wherein the reflection prevention layer comprises a first sub reflection prevention layer arranged on a first surface of the sensing electrode, a third sub reflection prevention layer arranged on a second surface, which lies opposite the first surface, and second sub reflection prevention layers arranged on both side surfaces, which connect the first and second surfaces, respectively.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.

Abstract: The present invention relates to a method for preparing metal oxide nanoparticles and metal oxide nanoparticles prepared thereby. The method includes: dipping a cathode and an anode formed of a metal for forming oxide, in an inorganic electrolyte solution containing halogen salt, and applying voltage to the anode and the cathode to form, on the anode, metal oxide forming an anode surface. According to a method of the present invention, disadvantages of typical nanoparticle synthesizing methods may be solved to cheaply and rapidly manufacture nanoparticles having various structures through a single process without using a surfactant. In practicing a method of the invention, metal oxide nanoparticles may be rapidly formed, nanoparticles having excellent crystallinity may be produced, and factors of the anodizing method, such as voltage, temperature, an electrolyte, and an electrolyte concentration may be changed to simply adjust a shape of the nanoparticles.