Patents by Inventor Sung Ok Cho

Sung Ok Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12211630
    Abstract: Provided are stretchable electronics and a method for manufacturing the same. The stretchable electronics may include a substrate, a plurality of electronic elements disposed to be spaced apart from each other on the substrate, and a wire structure disposed on the substrate to connect the plurality of electronic elements to each other. The wire structure may include an insulator extending from one of the electronic elements to the other of the adjacent electronic elements and a metal wire configured to cover a top surface and side surfaces of the insulator. The insulator may include at least one bent part in a plan view.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: January 28, 2025
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Ji Hun Choi, Chan Woo Park, Ji-Young Oh, Seung Youl Kang, Yong Hae Kim, Hee-ok Kim, Jeho Na, Jaehyun Moon, Jong-Heon Yang, Himchan Oh, Seong-Mok Cho, Sung Haeng Cho, Jae-Eun Pi, Chi-Sun Hwang
  • Patent number: 5776993
    Abstract: This invention relates to a thermoplastic PVC foam composition and more particularly, to the thermoplastic PVC foam composition suitable for a shoe material, which is characterized by the following fabrication and advantages. Some plasticizer and additive are added to the PVC base, plasticized by dioctyl phthalate (hereinafter called as "DOP") or epoxide soybean oil (hereinafter called as "ESO") to obtain the thermoplastic PVC foam composition. Then, one type of compound, selected from rubber thermoplastic urethane compound (hereinafter called as "TPU") and ethylenevinyl acetate copolymer (hereinafter called as "EVA"), was added to the mixture for modification.
    Type: Grant
    Filed: September 3, 1996
    Date of Patent: July 7, 1998
    Assignees: Korea Institute of Footwear & Leather Technology, HS Corporation
    Inventors: Bong Sub Shin, Jae Yeon Lee, Dong Keun Kim, Seoun Jun Kim, Sung Ok Cho