Patents by Inventor Sung-OK CHOI

Sung-OK CHOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11303439
    Abstract: Provided are a method and device for performing authentication using a hardware security module (HSM) in a one machine-to-machine (oneM2M) environment. The method of performing authentication using an HSM in a oneM2M environment includes extracting a symmetric key stored in the HSM using a security application programming interface (API), generating a first value and a second value using the extracted symmetric key, and performing mutual authentication with an M2M enrolment function (MEF) server through transport layer security pre-shared key ciphersuites (TLS-PSK) using the first value and the second value.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: April 12, 2022
    Assignee: Penta Security Systems Inc.
    Inventors: Sung Ok Choi, Young In Park, Sang Gyoo Sim, Duk Soo Kim, Seok Woo Lee
  • Publication number: 20200213107
    Abstract: Provided are a method and device for performing authentication using a hardware security module (HSM) in a one machine-to-machine (oneM2M) environment. The method of performing authentication using an HSM in a oneM2M environment includes extracting a symmetric key stored in the HSM using a security application programming interface (API), generating a first value and a second value using the extracted symmetric key, and performing mutual authentication with an M2M enrolment function (MEF) server through transport layer security pre-shared key ciphersuites (TLS-PSK) using the first value and the second value.
    Type: Application
    Filed: June 5, 2019
    Publication date: July 2, 2020
    Inventors: Sung Ok CHOI, Young In PARK, Sang Gyoo SIM, Duk Soo KIM, Seok Woo LEE
  • Patent number: 9824952
    Abstract: Disclosed herein is a light emitting device package strip capable of being used for a display application or an illumination application. The light emitting device package strip may include: a light emitting device package; and an upper adhesive sheet attached onto an upper surface of the light emitting device package so as to support the light emitting device package, wherein the light emitting device package includes: a flip-chip light emitting device having a first electrode pad and a second electrode pad; and a molding member formed to enclose side surfaces and an upper surface of the light emitting device such that the first electrode pad and the second electrode pad are exposed.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: November 21, 2017
    Assignee: LUMENS CO., LTD.
    Inventors: Hong-Geol Choi, Sung-Ok Choi, Sang-Hyub Gim, Seung-Hyun Oh, Yun-Geon Cho, Bo-Gyun Kim, Suk-Min Han, Jun-Hyeok Han
  • Publication number: 20160293815
    Abstract: Disclosed herein is a light emitting device package strip capable of being used for a display application or an illumination application. The light emitting device package strip may include: a light emitting device package; and an upper adhesive sheet attached onto an upper surface of the light emitting device package so as to support the light emitting device package, wherein the light emitting device package includes: a flip-chip light emitting device having a first electrode pad and a second electrode pad; and a molding member formed to enclose side surfaces and an upper surface of the light emitting device such that the first electrode pad and the second electrode pad are exposed.
    Type: Application
    Filed: March 31, 2016
    Publication date: October 6, 2016
    Applicant: LUMENS CO., LTD.
    Inventors: Hong-Geol CHOI, Sung-OK CHOI, Sang-Hyub GIM, Seung-Hyun OH, Yun-Geon CHO, Bo-Gyun KIM, Suk-Min HAN, Jun-Hyeok HAN