Patents by Inventor Sung-Pi Tseng

Sung-Pi Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inductor energy loss reduction techniques
    Patent number: 8049300
    Abstract: An inductive device including an inductor coil located over a substrate, at least one electrically insulating layer interposing the inductor coil and the substrate, and a plurality of current interrupters each extending into the substrate, wherein a first aggregate outer boundary of the plurality of current interrupters substantially encompasses a second aggregate outer boundary of the inductor coil.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: November 1, 2011
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Andrew Yeh, Alex Chang, Sung-Pi Tseng, Chang-Yun Chang, Hao-Yu Chen, Fu-Liang Yang
  • Inductor Energy Loss Reduction Techniques
    Publication number: 20070246798
    Abstract: An inductive device including an inductor coil located over a substrate, at least one electrically insulating layer interposing the inductor coil and the substrate, and a plurality of current interrupters each extending into the substrate, wherein a first aggregate outer boundary of the plurality of current interrupters substantially encompasses a second aggregate outer boundary of the inductor coil.
    Type: Application
    Filed: June 25, 2007
    Publication date: October 25, 2007
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Andrew Yeh, Alex Chang, Sung-Pi Tseng, Chang-Yun Chang, Hao-Yu Chen, Fu-Liang Yang
  • Inductor energy loss reduction techniques
    Patent number: 7247922
    Abstract: An inductive device including an inductor coil located over a substrate, at least one electrically insulating layer interposing the inductor coil and the substrate, and a plurality of current interrupters each extending into the substrate, wherein a first aggregate outer boundary of the plurality of current interrupters substantially encompasses a second aggregate outer boundary of the inductor coil.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: July 24, 2007
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Andrew Yeh, Alex Chang, Sung-Pi Tseng, Chang-Yun Chang, Hao-Yun Chen, Fu-Liang Yang
  • Inductor energy loss reduction techniques
    Publication number: 20060065948
    Abstract: An inductive device including an inductor coil located over a substrate, at least one electrically insulating layer interposing the inductor coil and the substrate, and a plurality of current interrupters each extending into the substrate, wherein a first aggregate outer boundary of the plurality of current interrupters substantially encompasses a second aggregate outer boundary of the inductor coil.
    Type: Application
    Filed: September 24, 2004
    Publication date: March 30, 2006
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Andrew Yeh, Alex Chang, Sung-Pi Tseng, Chang-Yun Chang, Hao-Yu Chen, Fu-Liang Yang