Patents by Inventor Sung Ping Sun

Sung Ping Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Precise Interpolation Method on Optical Encoder
    Publication number: 20140071461
    Abstract: We propose a high precision positional system that uses optical encoder and photo sensor to provide coarse position. We add a camera, secured to photo sensor, and set the magnification to view a few dozen marks on the encoder. With vision processing we can obtain precise interpolation with respect to pitch.
    Type: Application
    Filed: September 7, 2012
    Publication date: March 13, 2014
    Inventor: Sung Ping Sun
  • Method and apparatus for chip placement
    Patent number: 6389688
    Abstract: A method and apparatus for accurately registering electronic chip bonding pads with substrate leads. Images are developed of different portions of the interface between the electronic chip and the substrate by reflecting collimated, parallel light from the bottom of the chip through transparent areas of the substrate. Image analysis of the composite, superimposed images from spaced positions containing the bonding pads and the leads provide a corrective positioning after which the electronic chip and substrate are brought into contact.
    Type: Grant
    Filed: June 18, 1997
    Date of Patent: May 21, 2002
    Assignee: Micro Robotics Systems, Inc.
    Inventors: Nilendu Srivastava, Cyriac Devasia, Sung Ping Sun