Patents by Inventor Sung-rey Wi

Sung-rey Wi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device structure with strain layer
    Patent number: 8350354
    Abstract: A semiconductor device with a strain layer and a method of fabricating the semiconductor device with a strain layer that can reduce a loading effect are provided. By arranging active dummies and gate dummies not to overlap each other, the area of active dummy on which a strain layer dummy will be formed can be secured, thereby reducing the loading effect.
    Type: Grant
    Filed: November 22, 2010
    Date of Patent: January 8, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-hwan Lee, Heon-jong Shin, Shigenobu Maeda, Sung-rey Wi, WangXiao Quan, Hyun-min Choi
  • SEMICONDUCTOR DEVICE STRUCTURE WITH STRAIN LAYER AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE STRUCTURE
    Publication number: 20110062497
    Abstract: A semiconductor device with a strain layer and a method of fabricating the semiconductor device with a strain layer that can reduce a loading effect are provided. By arranging active dummies and gate dummies not to overlap each other, the area of active dummy on which a strain layer dummy will be formed can be secured, thereby reducing the loading effect.
    Type: Application
    Filed: November 22, 2010
    Publication date: March 17, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seung-hwan Lee, Heon-jong Shin, Shigenobu Maeda, Sung-rey Wi, Quan WangXiao, Hyun-min Choi
  • Electronic fuse having heat spreading structure
    Patent number: 7888772
    Abstract: A semiconductor device includes a fuse transistor for fuse programming and a fuse block connected to the fuse transistor, wherein the fuse block comprises a fuse line and a heat spreading structure connected to the fuse line. The electrical fuse employs the heat spreading structure connected to the fuse line to prevent a rupture of the electrical fuse such that heat, which is generated in the fuse line during a blowing of the fuse line, is spread throughout the heat spreading structure. Thus, a sensing margin of the electrical fuse can be secured and a deterioration of devices adjacent to the electrical fuse by heat generated in the electrical fuse can be prevented.
    Type: Grant
    Filed: January 11, 2008
    Date of Patent: February 15, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dae-Jin Kwon, Woo-Sik Kim, Maeda Shigenobu, Seung-Hwan Lee, Sung-Rey Wi, Wang-Xiao Quan, Hyun-Min Choi
  • Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure
    Patent number: 7863152
    Abstract: A semiconductor device with a strain layer and a method of fabricating the semiconductor device with a strain layer that can reduce a loading effect are provided. By arranging active dummies and gate dummies not to overlap each other, the area of active dummy on which a strain layer dummy will be formed can be secured, thereby reducing the loading effect.
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: January 4, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung-hwan Lee, Heon-jong Shin, Shigenobu Maeda, Sung-rey Wi, Quan WangXiao, Hyun-min Choi
  • Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure
    Publication number: 20080246092
    Abstract: A semiconductor device with a strain layer and a method of fabricating the semiconductor device with a strain layer that can reduce a loading effect are provided. By arranging active dummies and gate dummies not to overlap each other, the area of active dummy on which a strain layer dummy will be formed can be secured, thereby reducing the loading effect.
    Type: Application
    Filed: February 26, 2008
    Publication date: October 9, 2008
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung-hwan Lee, Heon-jong Shin, Shigenobu Maeda, Sung-rey Wi, WangXiao Quan, Hyun-Min Choi
  • ELECTRONIC FUSE HAVING HEAT SPREADING STRUCTURE
    Publication number: 20080211059
    Abstract: A semiconductor device includes a fuse transistor for fuse programming and a fuse block connected to the fuse transistor, wherein the fuse block comprises a fuse line and a heat spreading structure connected to the fuse line. The electrical fuse employs the heat spreading structure connected to the fuse line to prevent a rupture of the electrical fuse such that heat, which is generated in the fuse line during a blowing of the fuse line, is spread throughout the heat spreading structure. Thus, a sensing margin of the electrical fuse can be secured and a deterioration of devices adjacent to the electrical fuse by heat generated in the electrical fuse can be prevented.
    Type: Application
    Filed: January 11, 2008
    Publication date: September 4, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dae-Jin KWON, Woo-Sik KIM, Maeda Shigenobu, Seung-Hwan LEE, Sung-Rey WI, Wang-Xiao Quan, Hyun-Min CHOI