Abstract: The present invention may relate to an optical sheet unit. According to an embodiment of the present invention, disclosed is an optical sheet unit comprising: a diffusion sheet for diffusing incident light such that the light can be uniformly emitted; a prism sheet unit arranged at the position facing the diffusion sheet to concentrate the light incident from the diffusion sheet; and a bonding layer formed between the prism sheet unit and the diffusion sheet to bond the entire surfaces of the prism sheet unit and the diffusion sheet facing each other.

Abstract: Provided are an optical member having adhesion and elastic restoring force, and a light source device and a display device including the same, the optical member including: a base film; an optical pattern layer provided on the base film and having adhesion; and an upper film partially adhering onto the optical pattern layer, in which at least a partial region of the optical pattern layer has a characteristic in which the partial region is deformed when external force is applied and restored when the external force is removed, and it is easy to assemble a product to improve productivity, and the elastic restoring force is excellent to suppress damage due to the external force.

Abstract: There is disclosed a multilayer optical sheet module including an upper optical sheet comprising a first structural pattern projected upward; a lower optical sheet disposed under the upper optical sheet, the lower optical sheet comprising a second structural pattern projected toward the upper optical sheet; and an adhesion layer provided between the upper optical sheet and the lower optical sheet, wherein the second structural pattern includes a light transmitting part having a traverse cross section getting smaller along an upward direction; and an embedded part continuously connected to an upper portion of the light transmitting part, with a predetermined portion embedded in the adhesion layer, and a circumference of a cross section possessed by the embedded part, contacting with the adhesion layer, is larger than a circumference of a virtual cross section locus formed by extending the light transmitting part upward, with a continuous slope.

Abstract: A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board is positioned on the board having the via hole and the through hole to electrically connect circuit patterns formed on the surface of the board and in the board and an insulating material is plugged in the via hole by abutting and pushing the material on the surface of the board. Therefore, the insulating material can be plugged smoothly without a void, the processing is simplified by plugging the insulating material just to the height of the circuit pattern in a space between the circuit patterns and accordingly, damage to the circuit pattern can be prevented.

Abstract: A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board is positioned on the board having the via hole and the through hole to electrically connect circuit patterns formed on the surface of the board and in the board and an insulating material is plugged in the via hole by abutting and pushing the material on the surface of the board. Therefore, the insulating material can be plugged smoothly without a void, the processing is simplified by plugging the insulating material just to the height of the circuit pattern in a space between the circuit patterns and accordingly, damage to the circuit pattern can be prevented.

Abstract: A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board is positioned on the board having the via hole and the through hole to electrically connect circuit patterns formed on the surface of the board and in the board and an insulating material is plugged in the via hole by abutting and pushing the material on the surface of the board. Therefore, the insulating material can be plugged smoothly without a void, the processing is simplified by plugging the insulating material just to the height of the circuit pattern in a space between the circuit patterns and accordingly, damage to the circuit pattern can be prevented.

Abstract: A hole plugging method for a printed circuit board, a hole plugging device in accordance therewith and a manufacturing method in accordance therewith where a mask for selectively exposing a via hole, a through hole and a surface pattern of the printed circuit board is positioned on the board having the via hole and the through hole to electrically connect circuit patterns formed on the surface of the board and in the board and an insulating material is plugged in the via hole by abutting and pushing the material on the surface of the board. Therefore, the insulating material can be plugged smoothly without a void, the processing is simplified by plugging the insulating material just to the height of the circuit pattern in a space between the circuit patterns and accordingly, damage to the circuit pattern can be prevented.