Patents by Inventor Sung-Sik Jung

Sung-Sik Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12145298
    Abstract: A manufacturing method of a symbol button for a vehicle includes: preparing a button body comprising a side portion, a top portion formed of a polymer material on which a metal is able to be plated; forming an electrically conductive layer on an outside of the button body using a conductive polymer material; forming a plating shielding layer in a form of a symbol using a material on which a metal is not able to be plated on the electrically conductive layer; and performing metal plating on the outside of the button body having the plating shielding layer.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: November 19, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Woo Chul Jung, Sung Ho Yoon, Jae Sik Seo, Choon Soo Lee
  • Publication number: 20240301267
    Abstract: The present application can provide a curable composition capable of securing processability due to excellent blending properties with a filler while having little viscosity change with time and for forming a cured product having excellent electrical insulation performance, and can provide a device comprising, between an exothermic element and a cooling region, a cured product of a tow-component curable composition including the curable composition in thermal contact with both.
    Type: Application
    Filed: January 26, 2022
    Publication date: September 12, 2024
    Applicants: LG Chem, Ltd., LG Chem, Ltd.
    Inventors: Sol Yi Lee, Je Sik Jung, Hyoung Sook Park, Jin Hyeok Won, Hye Jin Kim, Sung Bum Hong, Jong Hun Choi, Sang Hyuk Seo, Jae Min Jung
  • Publication number: 20240271725
    Abstract: Disclosed are a hollow component, a method for manufacturing a hollow component, and a device for manufacturing a hollow component. The method for manufacturing a hollow component according to an embodiment of the disclosure includes a first operation of molding a first injection-molded component, a second operation of molding a second injection-molded component, a third operation of causing the first injection-molded component and the second injection-molded component to face each other, a fourth operation of approaching the first injection-molded component and the second injection-molded component, and a fifth operation of coupling the first injection-molded component and the second injection-molded component. A fastening boss of the first injection-molded component is press-fitted into a fastening hole of the second injection-molded component in the fifth operation.
    Type: Application
    Filed: June 2, 2022
    Publication date: August 15, 2024
    Applicant: LG ELECTRONICS INC.
    Inventors: Yeon Sun RYU, Kyong Ho JUNG, Sung Gon KIM, Lin Pyo HONG, Gwan Sik JEONG
  • Publication number: 20240255794
    Abstract: A display device includes: a backlight unit, a camera hole penetrating the backlight unit, a camera in the camera hole, a liquid crystal panel on the backlight unit, the liquid crystal panel including a transparent portion on the camera hole, and at least one light-blocking member in the camera hole, the at least one light-blocking member being configured to reduce one or more of: light leakage from the camera hole and introduction of impurities into the camera hole.
    Type: Application
    Filed: March 20, 2024
    Publication date: August 1, 2024
    Applicant: LG Display Co., Ltd.
    Inventors: Ji-Cheol SON, Ji-Soon OH, Yeoun-Jei JUNG, Sung-Sik SON, Chan-Hyeok PARK
  • Publication number: 20240243084
    Abstract: A wafer level fan out semiconductor device and a manufacturing method thereof are provided. A first sealing part is formed on lateral surfaces of a semiconductor die. A plurality of redistribution layers are formed on surfaces of the semiconductor die and the first sealing part, and solder balls are attached to the redistribution layers. The solder balls are arrayed on the semiconductor die and the first sealing part. In addition, a second sealing part is formed on the semiconductor die, the first sealing part and lower portions of the solder balls. The solder balls are exposed to the outside through the second sealing part. Since the first sealing part and the second sealing part are formed of materials having thermal expansion coefficients which are the same as or similar to each other, warpage occurring to the wafer level fan out semiconductor device can be suppressed.
    Type: Application
    Filed: December 21, 2023
    Publication date: July 18, 2024
    Inventors: Boo Yang Jung, Jong Sik Paek, Choon Heung Lee, In Bae Park, Sang Won Kim, Sung Kyu Kim, Sang Gyu Lee
  • Patent number: 9559548
    Abstract: A cover member of an electronic device is provided. The cover member includes covers hingedly connected, wherein each cover includes a power receiving member configured to wirelessly receive power.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: January 31, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyung-Jin Kwon, Jang-Rak Kim, Sung-Sik Jung, Ji-Sang Jang
  • Publication number: 20150256021
    Abstract: A cover member of an electronic device is provided. The cover member includes covers hingedly connected, wherein each cover includes a power receiving member configured to wirelessly receive power.
    Type: Application
    Filed: August 22, 2014
    Publication date: September 10, 2015
    Inventors: Hyung-Jin KWON, Jang-Rak KIM, Sung-Sik JUNG, Ji-Sang JANG
  • Publication number: 20030126149
    Abstract: A system for providing private branch exchange (PBX) operation information outputted through a computer-telephony integration (CTI) interface as CTI events, the system comprising: an operation information web server storing various PBX operation information received through the CTI interface; and at least one client PC (personal computer) connected via the Internet to the operation information web server, the client PC making a request to the operation information web server for the PBX operation information, and the operation information web server responsively converting the PBX operation information to an HTML (Hyper Text Markup Language) file and transmitting the HTML file to the client PC such that the client PC displays the received information on a monitor. The system provides various operation information generated in a PBX to a user, without installation of a separate program.
    Type: Application
    Filed: December 9, 2002
    Publication date: July 3, 2003
    Inventors: Sung-Sik Jung, Woong-Hee Ryu