Patents by Inventor Sung Su Na

Sung Su Na has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128136
    Abstract: A wafer level package includes: a substrate; an element portion disposed on one surface of the substrate; a cap disposed on the substrate to cover the element portion; a connection portion electrically connected to the element portion; and a bonding portion disposed on an outer side of the connection portion, wherein the bonding portion is disposed on a first surface of one of the substrate and the cap, wherein one end portion of the connection portion is disposed on a second surface having a step difference from the first surface, and wherein the connection portion and the bonding portion are formed of a eutectic material.
    Type: Application
    Filed: February 16, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Wook PARK, Seong Hun NA, Jae Hyun JUNG, Kwang Su KIM, Sung Jun LEE, Yong Suk KIM, Dong Hyun PARK
  • Patent number: 6921792
    Abstract: Disclosed are a chemically modified polyolefin elastomer composition that is highly compatible with thermoplastics and useful in improving the low temperature impact strength of thermoplastics, and a method for preparing the chemically modified polyolefin elastomer composition. The elastomer composition includes a polyolefin resin and a chemically modified ethylene-?-olefin elastomer mixed with the polyolefin resin. The chemically modified ethylene-?-olefin elastomer includes an ethylene-?-olefin elastomer backbone and grafted branches from the backbone. The branches includes polymers of one or more monomers comprising an unsaturated organic compound containing at least one carbonyl group. The method of producing the composition includes mixing an ethylene-?-olefin elastomer and a polyolefin resin to provide a mixture thereof, to which added is one or more monomers having an unsaturated organic compound containing at least one carbonyl group.
    Type: Grant
    Filed: February 7, 2002
    Date of Patent: July 26, 2005
    Assignee: Kumho Polychem Co., Ltd.
    Inventors: Sang Bae Kim, Sung Su Na, Yeon Won Jeyong
  • Publication number: 20030073783
    Abstract: Disclosed are a chemically modified polyolefin elastomer composition that is highly compatible with thermoplastics and useful in improving the low temperature impact strength of thermoplastics, and a method for preparing the chemically modified polyolefin elastomer composition. The elastomer composition includes a polyolefin resin and a chemically modified ethylene-&agr;-olefin elastomer mixed with the polyolefin resin. The chemically modified ethylene-&agr;-olefin elastomer includes an ethylene-&agr;-olefin elastomer backbone and grafted branches from the backbone. The branches includes polymers of one or more monomers comprising an unsaturated organic compound containing at least one carbonyl group. The method of producing the composition includes mixing an ethylene-&agr;-olefin elastomer and a polyolefin resin to provide a mixture thereof to which added is one or more monomers having an unsaturated organic compound containing at least one carbonyl group.
    Type: Application
    Filed: February 7, 2002
    Publication date: April 17, 2003
    Inventors: Sang Bae Kim, Sung Su Na, Yeon Won Jeyong