Patents by Inventor Sung-Sun Park

Sung-Sun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12156727
    Abstract: Provided is a cough recognition method and device, which can detect cough sounds from an audio signal, and not only can detect coughs but also can track the location at which the cough sounds are generated by calculating the location of a sound source.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: December 3, 2024
    Assignees: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, SM INSTRUMENTS CO., LTD.
    Inventors: Yong Hwa Park, Gyeong Tae Lee, Hyeonuk Nam, Seonghu Kim, Young Key Kim, In Kwon Kim, Kwang Hyun Lee, Jae Sun Lee, Sung Hyo Park
  • Publication number: 20240356178
    Abstract: A cylindrical secondary battery includes a can and a terminal part including: a first terminal outside of the can; and a second terminal coupled to a terminal hole of the can, arranged inside and outside of the can, and riveted to the first terminal from an outside of the can. According to embodiments of the present disclosure, plastic deformation of a rivet terminal occurs outside of a can, and there is no limitation on the shape of the rivet terminal inside the can. In addition, the rivet terminal may be processed regardless of a size or height of the can, and there is no interference with the can, and a processing time may be reduced.
    Type: Application
    Filed: April 19, 2024
    Publication date: October 24, 2024
    Inventors: Gun Gue PARK, Sung Gwi KO, Hyun Ki JUNG, Yoon Sun YOO, Gwan Hyeon YOO, Myung Seob KIM, Mun Sung KIM, Woo Tae JUN
  • Publication number: 20240356123
    Abstract: A cylindrical secondary battery includes: an electrode assembly including a first electrode plate, a separator, and a second electrode plate; a cylindrical case accommodating the electrode assembly and electrically connected to the second electrode plate; a terminal coupled to a lower surface of the case through a first gasket and electrically connected to the first electrode plate; a cap plate sealing the upper end of the case; and a second gasket between the case and the cap plate, the second gasket having: a sidewall portion in close contact with a side surface of the case; and a bottom portion extending inwardly from a bottom end of the sidewall portion and having at least one opening formed therein. The bottom portion of the second gasket having flange parts extending from the sidewall portion in an edge region and a bridge part connecting the flange parts to each other.
    Type: Application
    Filed: October 12, 2023
    Publication date: October 24, 2024
    Inventors: Sung Gwi KO, Gun Gue PARK, Hyun Ki JUNG, Myung Seob KIM, Yoon Sun YOO, Woo Tae JUN, Gwan Hyeon YU
  • Publication number: 20240356122
    Abstract: A cylindrical secondary battery including: an electrode assembly including a first electrode plate, a separator, and a second electrode plate; a case accommodating the electrode assembly and having an open lower end, the case being electrically connected to the second electrode plate; a first current collector plate between an upper surface of the electrode assembly and the case and being electrically connected to the first electrode plate; a terminal extending through an upper surface of the case and having a lower end electrically and mechanically coupled to an upper surface of the first current collector plate, the terminal having: a welding groove having a depth downward from an upper surface thereof; and a sealing member filling the welding groove; and a cap plate sealing the lower end of the case.
    Type: Application
    Filed: February 26, 2024
    Publication date: October 24, 2024
    Inventors: Sung Gwi KO, Gwan Hyeon YU, Gun Gue PARK, Hyun Ki JUNG, Woo Tae JUN, Yoon Sun YOO, Myung Seob KIM
  • Publication number: 20240356186
    Abstract: A secondary battery includes: an electrode assembly; a can having a lower surface and a side surface and accommodating the electrode assembly therein; a cap plate coupled to an upper end of the can; a terminal on the lower surface of the can; and an insulator having a plate-shaped portion between the electrode assembly and the lower surface of the can and a wing portion extending upwardly from a circumference of the plate-shaped portion. The wing portion has a cutout portion.
    Type: Application
    Filed: October 23, 2023
    Publication date: October 24, 2024
    Inventors: Gun Gue PARK, Woo Tae JUN, Sung Gwi KO, Gwan Hyeon YU, Myung Seob KIM, Yoon Sun YOO, Hyun Ki JUNG
  • Publication number: 20240347575
    Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.
    Type: Application
    Filed: April 12, 2024
    Publication date: October 17, 2024
    Inventors: Jin Young Kim, No Sun Park, Yoon Joo Kim, Seung Jae Lee, Se Woong Cha, Sung Kyu Kim, Ju Hoon Yoon
  • Publication number: 20240304577
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Application
    Filed: May 17, 2024
    Publication date: September 12, 2024
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Publication number: 20240284494
    Abstract: Disclosed are various methods for transmitting or receiving data or control information having high reliability conditions. A method for operating a terminal which transmits uplink control information (UCI) includes: a step of generating UCI; a step of comparing the priority of an uplink (UL) control channel for the transmission of the UCI with the priority of a UL data channel when some symbols of the UL control channel and the UL data channel overlap; and a step of selecting the UL channel having a higher priority among the UL control channel and the UL data channel, and transmitting the UCI to a base station through the selected UL channel.
    Type: Application
    Filed: January 17, 2024
    Publication date: August 22, 2024
    Inventors: Cheul Soon KIM, Sung Hyun MOON, Seung Kwon BAEK, Gi Yoon PARK, Ok Sun PARK, Jae Su SONG
  • Patent number: 12060352
    Abstract: The disclosure provides substituted pyrrolo[2,3-d]pyrimidine compounds of Chemical Formula 1 and compositions and uses thereof, wherein R1-R7, X, Y, Cy, m and n are defined in the disclosure. The compounds are useful for inhibiting ENPP1, activating the STING pathway, and treating cancer.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: August 13, 2024
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Seo Jung Han, Sang Hee Lee, Hee Jin Jeong, Hye Lim Lee, Chan Sun Park, Sung Joon Kim
  • Publication number: 20240262799
    Abstract: Disclosed are methods for treating or ameliorating metabolic diseases, cholestatic liver diseases, disorder of bile acid homeostasis, or organ fibrosis, which includes administering to a subject a therapeutically effective amount of a pharmaceutical composition containing an isoxazole derivative, a racemate, an enantiomer, or a diastereoisomer thereof, or a pharmaceutically acceptable salt of the derivative, the racemate, the enantiomer, or the diastereoisomer.
    Type: Application
    Filed: January 23, 2024
    Publication date: August 8, 2024
    Applicant: IL DONG PHARMACEUTICAL CO., LTD.
    Inventors: Jae-Hoon KANG, Hong-Sub LEE, Yoon-Suk LEE, Jin-Ah JEONG, Sung-Wook KWON, Jeong-Guen KIM, Kyung-Sun KIM, Dong-Keun SONG, Sun-Young PARK, Kyeo-Jin KIM, Ji-Hye CHOI, Hey-Min HWANG
  • Patent number: 12055487
    Abstract: An apparatus for analyzing a substance of an object in a non-invasive manner is provided. The apparatus for analyzing a substance of an object includes: a sensor part including an image sensor, and a plurality of light sources disposed around the image sensor; and a processor configured to drive the plurality of light sources to obtain absorbance of each pixel of the image sensor based on an intensity of light received by each pixel, to correct the absorbance of each pixel based on a distance between the plurality of light sources and each pixel, and to analyze a substance of an object based on the corrected absorbance of each pixel.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: August 6, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myoung Hoon Jung, Sang Kyu Kim, Yoon Jae Kim, Hyun Seok Moon, Jin Young Park, Sung Mo Ahn, Kun Sun Eom
  • Publication number: 20240246961
    Abstract: The present disclosure provides autotaxin (ATX) inhibitor compounds and compositions including said compounds. The present disclosure also provides methods of using said compounds and compositions for inhibiting ATX. Also provided are methods of preparing said compounds and compositions, and synthetic precursors of said compounds.
    Type: Application
    Filed: January 23, 2024
    Publication date: July 25, 2024
    Inventors: Sung-Ku CHOI, Yoon-Suk LEE, Sung-Wook KWON, Kyung-Sun KIM, Jeong-Geun KIM, Jeong-Ah KIM, An-Na MOON, Sun-Young PARK, Jun-Su BAN, Dong-Keun SONG, Kyu-Sic JANG, Ju-Young JUNG, Soo-Jin LEE
  • Patent number: 11990435
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: May 21, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Publication number: 20230009679
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Application
    Filed: July 18, 2022
    Publication date: January 12, 2023
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Patent number: 11393734
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: July 19, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Publication number: 20200219780
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Application
    Filed: October 15, 2019
    Publication date: July 9, 2020
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Patent number: 10446455
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: October 15, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Patent number: 10297515
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: May 21, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Publication number: 20170243798
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Application
    Filed: May 10, 2017
    Publication date: August 24, 2017
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry
  • Publication number: 20160335470
    Abstract: A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.
    Type: Application
    Filed: April 18, 2016
    Publication date: November 17, 2016
    Inventors: Sung Sun Park, Ji Young Chung, Christopher Berry