Patents by Inventor Sung Taek HWANG

Sung Taek HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136296
    Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.
    Type: Application
    Filed: April 12, 2023
    Publication date: April 25, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Sung Taek HWANG, So Eun JEONG, Jun Hee PARK, Nam Sik KONG
  • Publication number: 20240105573
    Abstract: A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate, the first spacer and the second spacer extending toward each other.
    Type: Application
    Filed: July 10, 2023
    Publication date: March 28, 2024
    Inventors: Jun Hee PARK, Sung Taek Hwang, Nam Sik Kong, Myung III You
  • Publication number: 20240088009
    Abstract: A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.
    Type: Application
    Filed: April 21, 2023
    Publication date: March 14, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Jun Hee PARK, Sung Taek HWANG, Nam Sik KONG, Myung III YOU
  • Publication number: 20240082208
    Abstract: A steroid sulfatase inhibitor provided by the present invention is a safe substance without toxicity and adverse effects, has inhibitory activity against various viruses, and thus is capable of effectively preventing, ameliorating, or treating viral infections or diseases caused by viral infections.
    Type: Application
    Filed: January 10, 2022
    Publication date: March 14, 2024
    Inventors: Jung Taek Seo, Seok Jun Moon, Sung-Jin Kim, Jae Myun Lee, Pil-Gu Park, Su Jin Hwang, Moon Geon Lee