Patents by Inventor Sung Uk YOON

Sung Uk YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240138255
    Abstract: Provided is a compound of Chemical Formula 1 or 2: wherein: R1 to R4 are each independently hydrogen or deuterium; n1 to n4 are an integer of 1 to 4; L1 and L2 are each independently a direct bond or a substituted or unsubstituted C6-60 arylene; and Ar1 and Ar2 are each independently a substituent of Chemical Formula 3: wherein X1 to X5 are each independently N or C(R5), wherein at least two of X1 to X5 are N; and each R5 is independently hydrogen, deuterium, a substituted or unsubstituted C1-20 alkyl, a substituted or unsubstituted C6-60 aryl, or a substituted or unsubstituted C2-60 heteroaryl containing at least one of N, O and S, or two adjacent R5s combine to form a benzene ring; and an organic light emitting device including the same. The device exhibits significantly superior efficiency and lifespan.
    Type: Application
    Filed: February 28, 2022
    Publication date: April 25, 2024
    Inventors: Dong Uk HEO, Heekyung YUN, Miyeon HAN, Jae Tak LEE, Jung Min YOON, Hoyoon PARK, Sung Kil HONG
  • Patent number: 11956426
    Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus for deriving an intra-prediction mode. An intra-prediction mode may be derived using a method for deriving an intra-prediction mode based on a neighbor block of the target block, a method for deriving an intra-prediction mode using signaling of the intra-prediction mode of the target block, or a method for deriving an adaptive intra-prediction mode based on the type of a target slice. An MPM list may be used to derive the intra-prediction mode, and a temporal neighbor block or the like may be used to configure the MPM list.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: April 9, 2024
    Assignees: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Industry-Academia Cooperation Group of Sejong University
    Inventors: Jin-Ho Lee, Jae-Gon Kim, Jung-Won Kang, Do-Hyeon Park, Yung-Lyul Lee, Ha-Hyun Lee, Sung-Chang Lim, Hui-Yong Kim, Ji-Hoon Do, Yong-Uk Yoon
  • Publication number: 20230005766
    Abstract: Disclosed herein are a non-rigid pad for device transfer, which allows uniform contact pressure to be applied between multiple devices and a target substrate to which the devices are to be transferred, a method of manufacturing the same, and a non-rigid pad group for device transfer including the same. The non-rigid pad includes: a base plate; and multiple pillars each protruding from one surface of the base plate with one end thereof connected to the one surface of the base plate, the pillars being bent and deformed upon application of external force, wherein the non-rigid pad is disposed between a transfer film to which multiple devices to be transferred to a target substrate are adhesively attached and a pressing unit providing pressing force to transfer the multiple devices to the target substrate, the non-rigid pad being bent and deformed upon application of pressing force by the pressing unit to allow uniform contact pressure to be applied between the multiple devices and the target substrate.
    Type: Application
    Filed: September 5, 2022
    Publication date: January 5, 2023
    Applicant: CENTER FOR ADVANCED META-MATERIALS
    Inventors: Se Jeong WON, Hak Joo LEE, Jung Yup KIM, Jae Hyun KIM, Yun HWANGBO, Sang Min KIM, Sung Uk YOON
  • Patent number: 11417546
    Abstract: An exemplary embodiment of the present invention provides a method of transferring a micro device. The method of transferring the micro device includes: separating a transferring film from a micro device transferred to a target substrate and bending the transferring film upwardly to form a bent circular arc, and pressurizing an upper transferring film fed after the bent circular arc is formed by a pressurizing roller rotating at an upper side of the target substrate.
    Type: Grant
    Filed: April 16, 2019
    Date of Patent: August 16, 2022
    Assignee: KOREA INSTITUTE OF MACHINERY & MATERIALS
    Inventors: Byung-Ik Choi, Yun Hwangbo, Jae-Hyun Kim, Sung Uk Yoon, Chang Hyun Kim, Jung Yup Kim, Kyung-Sik Kim, Sang Min Kim, Bongkyun Jang, Kwangseop Kim
  • Publication number: 20210166959
    Abstract: An exemplary embodiment of the present invention provides a method of transferring a micro device, which is applicable to more various micro devices and is capable of improving transferring efficiency. An exemplary embodiment of the present invention provides a method of transferring a micro device.
    Type: Application
    Filed: April 16, 2019
    Publication date: June 3, 2021
    Inventors: Byung-Ik CHOI, Yun HWANGBO, Jae-Hyun KIM, Sung Uk YOON, Chang Hyun KIM, Jung Yup KIM, Kyung-Sik KIM, Sang Min KIM, Bongkyun JANG, Kwangseop KIM