Abstract: A light emitting device package is provided. The light emitting device includes: a substrate; a light emitting device disposed at one side of the substrate; and a formation layer formed on the substrate and having a slope at an edge portion of the formation layer.

Abstract: A light emitting device package is provided. The light emitting device includes: a substrate; a light emitting device disposed at one side of the substrate; and a formation layer formed on the substrate and having a slope at an edge portion of the formation layer.

Abstract: A light-emitting device package is provided including: a package substrate and a light-emitting device mounted on the package substrate. The package substrate includes first and second conductive regions each having a portion overlapping the light-emitting device. An electrode separator extends across the package substrate while penetrating the package substrate between the first and second conductive regions to electrically separate the first and second conductive regions from each other. A stress release portion surrounds at least a portion of each of the first and second conductive regions at an edge part of the package substrate. The stress release portion has different widths on both sides of the electrode separator interposed therebetween.

Abstract: A light emitting device package is provided. The light emitting device includes: a substrate; a light emitting device disposed at one side of the substrate; and a formation layer formed on the substrate and having a slope at an edge portion of the formation layer.

Abstract: A light emitting diode (LED) package comprises a LED, and a lead frame electrically connected to the LED. The lead frame includes a notch which has a predetermined size and a predetermined shape configured to separate a solder paste into two regions on either side of the notch when the solder paste is disposed on the lead frame.

Abstract: A light emitting device package is provided. The light emitting device includes: a substrate; a light emitting device disposed at one side of the substrate; and a formation layer formed on the substrate and having a slope at an edge portion of the formation layer.

Abstract: A light-emitting device package is provided including: a package substrate and a light-emitting device mounted on the package substrate. The package substrate includes first and second conductive regions each having a portion overlapping the light-emitting device. An electrode separator extends across the package substrate while penetrating the package substrate between the first and second conductive regions to electrically separate the first and second conductive regions from each other. A stress release portion surrounds at least a portion of each of the first and second conductive regions at an edge part of the package substrate. The stress release portion has different widths on both sides of the electrode separator interposed therebetween.

Abstract: A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.

Abstract: There are provided a light emitting device package and a method of manufacturing the same. The light emitting device package includes a body part including a through hole formed in a thickness direction; at least one light emitting device disposed within the through hole; and a wavelength conversion part filling the through hole and supporting the light emitting device.

Abstract: A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.