Patents by Inventor Sung-Un Bae

Sung-Un Bae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080188017
    Abstract: A method of sorting dies using a discrimination region includes preparing a wafer including a chip region in which a plurality of dies are disposed and an edge region in which at least one discrimination region is disposed; testing the dies to prepare a wafer map for defining the coordinates of good dies and bad dies; allowing dies defined by the wafer map to correspond to the dies of the wafer; and confirming the correctness of the correspondence between the wafer and the wafer map by checking whether the discrimination region is included in the dies defined by the wafer map.
    Type: Application
    Filed: February 1, 2008
    Publication date: August 7, 2008
    Applicant: Samsung Electronics, Co., Ltd.
    Inventors: Young-Dae Kim, Yun-Ki Kim, Sung-Un Bae