Abstract: An identification system comprising a first electronic device having a first receiving part, a connection cable suited for the first electronic device, a second electronic device and an identification unit is provided. The connection cable further comprises a first connection part to connect the first receiving part and a second connection part having a first pin, a second pin and a plurality of identification pins coupled to the first pin or the second pin. The second electronic device comprises a second receiving part and an identification unit. The second receiving for connecting to the second connection part comprises a first pin receiving part for connecting the first pin, a second pin receiving part for connect the second pin and a plurality of identification pin receiving parts for connect the identification pins.

Abstract: A photographing device for photographing an object comprises an image input unit, a signal processing unit and a control unit. In the photographing device, image data of an object generated from the image input unit are analyzed in the signal processing unit, and a status indicator that represents the image quality of the image data is displayed together with a preview image of the object depending on the analysis result in the control unit. As a result, the photographing device previously informs a user of the image quality of a preview image displayed on a screen so that the user may photograph an object in the most appropriate state, thereby preventing re-photographing because of unsatisfactory photographing results.

Abstract: A microelectronic product and a method for fabricating the same each provide a capacitor formed interposed between a first dielectric layer and a second dielectric layer formed over a substrate having a first contact region and a second contact region exposed therein. The capacitor is also connected to a first conductor stud that penetrates the first dielectric layer and contacts the first contact region and a second conductor stud that penetrates the second dielectric layer. A contiguous conductor interconnect and conductor stud layer is formed within a dual damascene aperture through the second dielectric layer and the first dielectric layer and contacting the second contact region. An etch stop layer employed when forming a trench within the dual damascene aperture also passivates a capacitor sidewall.

Abstract: A microelectronic product and a method for fabricating the same each provide a capacitor formed interposed between a first dielectric layer and a second dielectric layer formed over a substrate having a first contact region and a second contact region exposed therein. The capacitor is also connected to a first conductor stud that penetrate4s the first dielectric layer and contacts the first contact region and a second conductor stud that penetrates the second dielectric layer. A contiguous conductor interconnect and conductor stud layer is formed within a dual damascene aperture through the second dielectric layer and the first dielectric layer and contacting the second contact region. An etch stop layer employed when forming a trench within the dual damascene aperture also passivates a capacitor sidewall.