Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber, a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.

Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber; a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber, a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber, and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.

Abstract: The present invention relates to a substrate separation apparatus, and the substrate separation apparatus includes a separation member (310) that enters a bonded portion (12) of a bonded substrate (10) in which a first substrate (11) and a second substrate (13) are bonded, and forms a crack, a sensor module (200) configured to photograph the bonded substrate (10) and the separation member (310) to obtain measurement values corresponding to distances from the sensor module (200) to the bonded substrate (10) and the separation member (310), and a processor (100) configured to move the separation member (310) to a height of the bonded portion (12) on the basis of the measurement values.

Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber, a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.

Abstract: The present invention relates to an etching apparatus including an etching chamber in which a target object is etched by an etchant, an etchant supply part which collects the etchant in the etching chamber and supplies the etchant to the etching chamber using an etchant pump, a gas circulation pipe connected from a predetermined point of an upper portion of the etchant supply part to a predetermined point of an upper portion of the etching chamber and formed to circulate a gas, and an air pump formed at one side of the gas circulation pipe and configured to forcibly circulate the gas.

Abstract: The present invention relates to an etching apparatus including an etching chamber in which a target object is etched by an etchant, an etchant supply part which collects the etchant in the etching chamber and supplies the etchant to the etching chamber using an etchant pump, a first pressure adjusting unit which injects a gas into the etchant pump to apply an operation pressure, a second pressure adjusting unit which pressurizes the etching chamber and the etchant supply part at the same predetermined pressure, a back pressure adjusting unit which adjusts a pressure of the gas discharged when the etchant pump operates, and a valve which controls an order and a direction in which the gas is injected into or discharged from the etchant pump.

Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber; a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.

Abstract: The present invention relates to an etching device using an etching chamber, comprising: an etchant storage chamber in which an etchant is stored; a connection unit communicating with the etching liquid storage chamber; an etching chamber which is connected with the etching liquid storage chamber through the connection unit, and in which an object is etched; and a pressurization maintaining unit for maintaining the etching liquid storage chamber and/or the etching chamber in a pressurized atmosphere.

Abstract: The present invention relates to an etching device comprising: an etching chamber; an opening/closing unit for opening/closing the etching chamber; and a locking unit for selectively locking the opening/closing unit.